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Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device

  • US 9,475,691 B1
  • Filed: 06/26/2015
  • Issued: 10/25/2016
  • Est. Priority Date: 06/26/2015
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • an electrically conductive lead-frame, comprising a first die paddle having a first opening, and a plurality of electrically conductive leads;

    a ridge formed around a perimeter of the first opening; and

    an electrically insulating molding compound, comprising an interior cavity being defined by a planar base surface and outer sidewalls of the molding compound, a second opening formed in the base surface, and an interior sidewall being arranged within the interior cavity;

    wherein the molding compound is formed around the lead-frame with the first die paddle arranged in the interior cavity,wherein the first and the second openings are aligned with one another so as to form a port that provides access to the interior cavity, andwherein the ridge and the interior sidewall collectively form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.

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