Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
First Claim
1. A semiconductor package, comprising:
- an electrically conductive lead-frame, comprising a first die paddle having a first opening, and a plurality of electrically conductive leads;
a ridge formed around a perimeter of the first opening; and
an electrically insulating molding compound, comprising an interior cavity being defined by a planar base surface and outer sidewalls of the molding compound, a second opening formed in the base surface, and an interior sidewall being arranged within the interior cavity;
wherein the molding compound is formed around the lead-frame with the first die paddle arranged in the interior cavity,wherein the first and the second openings are aligned with one another so as to form a port that provides access to the interior cavity, andwherein the ridge and the interior sidewall collectively form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.
1 Assignment
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Accused Products
Abstract
A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.
15 Citations
20 Claims
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1. A semiconductor package, comprising:
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an electrically conductive lead-frame, comprising a first die paddle having a first opening, and a plurality of electrically conductive leads; a ridge formed around a perimeter of the first opening; and an electrically insulating molding compound, comprising an interior cavity being defined by a planar base surface and outer sidewalls of the molding compound, a second opening formed in the base surface, and an interior sidewall being arranged within the interior cavity; wherein the molding compound is formed around the lead-frame with the first die paddle arranged in the interior cavity, wherein the first and the second openings are aligned with one another so as to form a port that provides access to the interior cavity, and wherein the ridge and the interior sidewall collectively form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor package, comprising:
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an electrically conductive lead-frame, comprising a first die paddle having a first opening, and a plurality of electrically conductive leads; a ridge formed around a perimeter of the first opening; an electrically insulating molding compound, comprising an interior cavity being defined by a planar base surface and outer sidewalls of the molding compound, a second opening formed in the base surface, and an interior sidewall being arranged within the interior cavity; a first semiconductor device arranged in the interior cavity and electrically connected to the lead-frame; and a sealant adhesively bonding the first semiconductor device to the lead-frame, wherein the first and the second openings are aligned with one another so as to form a port that provides access to the interior cavity; wherein the first semiconductor device is arranged in the interior cavity over the port, and wherein the sealant is contained by a dam that is collectively formed by the ridge and the interior sidewall. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
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14. A method of packaging a semiconductor device, comprising:
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providing an electrically conductive lead-frame, comprising a first die paddle having a first opening, and a plurality of electrically conductive leads, and a ridge around a perimeter of the first opening; forming an electrically insulating molding compound around the lead-frame such that the first die paddle is arranged within an interior cavity of the molding compound, the interior cavity being defined by a planar base surface and outer sidewalls of the molding compound; forming a second opening in the base surface that is aligned with the first opening such that the first and second openings form a port that provides access to the interior cavity; forming an interior sidewall that is arranged within the interior cavity; and wherein the ridge and the interior sidewall collectively form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification