Hot tile sputtering system

• US 9,476,117 B2
• Filed: 03/14/2014
• Issued: 10/25/2016
• Est. Priority Date: 04/07/2009
• Status: Active Grant

• Current Assignee: Magna Mirrors of America Incorporated (Magna International Incorporated)
• Original Assignee: Magna Mirrors of America Incorporated (Magna International Incorporated)
• Inventors: McCabe, Ian A., Harlow, Jeffrey D.
• Primary Examiner(s): Hendricks, Keith
• Assistant Examiner(s): Wanga, Timon
• Application Number:
  US14/211,257
• Publication Number:
  US 20140197025A1
• Time in Patent Office: 956 Days
• US Class Current: 1/1
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/3421 using heated targets
• CPC Class Codes: H01J 37/3408 Planar magnetron sputtering
• CPC Class Codes: H01J 37/3423 Shape
• CPC Class Codes: H01J 37/3435 Target holders (includes backing plates and endblocks)
• CPC Class Codes: H01J 37/3497 Temperature of target

Abstract

A method of sputter coating a glass substrate includes providing a glass substrate and providing a sputtering assembly for sputtering a coating onto the glass substrate in a vacuum deposition chamber. The sputtering assembly includes a backing plate and a separating element disposed on the backing plate. At least one target element is provided and disposed at and in contact with a surface of the separating element. The target element is not bonded the separating element when disposed at and in contact with the surface of the separating element. An expansion gap is provided at or adjacent to the target element to allow for expansion of the target element during the sputtering process. Material from the target element is sputtered and the target element is heated to a substantially elevated temperature during the sputtering process. The sputtering process coats a surface of the glass substrate with the target element material.

Claims

1. A method of sputter coating a glass substrate, said method comprising:

providing a glass substrate;

providing a sputtering assembly for sputtering a coating material onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate;

providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element;

providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process;

sputtering coating material from said at least one target element;

heating said at least one target element to at least about 400 degrees C. during the step of sputtering coating material; and

wherein the step of sputtering coating material comprises sputtering coating material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with a layer of the coating material.

2. The method of claim 1, wherein said separating element comprises an electrically conductive material.

3. The method of claim 1, wherein said separating element comprises a sheet having a low-coefficient of friction surface, and wherein said at least one target element is disposed on said low-coefficient of friction surface of said separating element, and wherein said low-coefficient of friction surface allows for movement of said at least one target element on said low-coefficient of friction surface.

4. The method of claim 1, wherein said separating element comprises a graphite sheet.

5. The method of claim 1, wherein said separating element thermally insulates said at least one target element from said backing plate, and wherein heating said at least one target element comprises heating said at least one target element to a greater temperature than said backing plate during the sputtering process.

6. The method of claim 5, wherein heating said at least one target element comprises heating said at least one target element to an elevated temperature in the range of about 400 degrees C. to about 600 degrees C. during the step of sputtering coating material.

7. The method of claim 1, wherein providing at least one target element comprises providing a plurality of target elements and arranging said plurality of target elements on said separating element with expansion gaps established between adjacent target elements to allow for movement of and expansion of said target elements during the sputtering process.

8. The method of claim 1, wherein said glass substrate comprises a substrate of a reflective element of a mirror assembly for a vehicle, and wherein said at least one target element comprises a metallic coating material that, when sputtered onto said surface of said glass substrate, establishes a transparent electrically conductive layer at said surface of said glass substrate.

9. The method of claim 1, comprising providing at least one retaining element for retaining said at least one target element at said separating element and said backing plate.

10. The method of claim 9, wherein said retaining element comprises an expansion element so as to substantially retain said target elements at said backing plate while allowing for expansion of said target elements during the step of sputtering coating material.

11. The method of claim 1, wherein, during the step of sputtering coating material, said at least one target element is capable of movement relative to said surface of said separating element.

12. A method of sputter coating a glass substrate, said method comprising:

providing a glass substrate;

providing a sputtering assembly for sputtering a coating onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate;

providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element;

wherein said separating element comprises a sheet having a low-coefficient of friction surface, and wherein said at least one target element is disposed on said low-coefficient of friction surface of said separating element, and wherein said low-coefficient of friction surface allows for movement of said at least one target element on said low-coefficient of friction surface;

providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process;

sputtering coating material from said at least one target element;

heating said at least one target element to at least about 400 degrees C. during the step of sputtering coating material;

wherein, during the step of sputtering coating material, said at least one target element is capable of movement relative to said surface of said separating element; and

wherein the step of sputtering coating material comprises sputtering coating material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with a layer of the coating material.

13. The method of claim 12, wherein said separating element comprises an electrically conductive material.

14. The method of claim 12, wherein said separating element thermally insulates said at least one target element from said backing plate, and wherein heating said at least one target element comprises heating said at least one target element to a greater temperature than said backing plate during the sputtering process.

15. The method of claim 12, wherein providing at least one target element comprises providing a plurality of target elements and arranging said plurality of target elements on said separating sheet with expansion gaps established between adjacent target elements to allow for movement of and expansion of said target elements during the step of sputtering coating material.

16. The method of claim 12, wherein said glass substrate comprises a substrate of a reflective element of a mirror assembly for a vehicle, and wherein said at least one target element comprises a metallic coating material that, when sputtered onto said surface of said glass substrate, establishes a transparent electrically conductive layer at said surface of said glass substrate.

17. A method of sputter coating a glass substrate, said method comprising:

providing a glass substrate for a reflective element of a mirror assembly for a vehicle;

providing a sputtering assembly for sputtering a coating onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate;

providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element;

wherein said at least one target element comprises a metallic material;

providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process;

sputtering metallic material from said at least one target element;

heating said at least one target element to at least about 400 degrees C. during the step of sputtering metallic material;

wherein the step of sputtering metallic material sputters metallic material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with the metallic material to establish a transparent electrically conductive layer at said surface of said glass substrate;

wherein, during the step of sputtering metallic material, said at least one target element is capable of movement relative to said surface of said separating element; and

wherein said separating element thermally insulates said at least one target element from said backing plate, and wherein heating said at least one target element comprises heating said at least one target element to a greater temperature than said backing plate during the step of sputtering metallic material.

18. The method of claim 17, wherein heating said at least one target element comprises heating said at least one target element to an elevated temperature in the range of about 400 degrees C. to about 600 degrees C. during the step of sputtering metallic material.

19. The method of claim 17, wherein said separating element comprises a sheet having a low-coefficient of friction surface, and wherein said at least one target element is disposed on said low-coefficient of friction surface of said separating element, and wherein said low-coefficient of friction surface allows for movement of said at least one target element on said low-coefficient of friction surface.

20. The method of claim 17, wherein providing at least one target element comprises providing a plurality of target elements and arranging said plurality of target elements on said separating element with expansion gaps established between adjacent target elements to allow for movement of and expansion of said target elements during the step of sputtering metallic material.