Hot tile sputtering system
First Claim
1. A method of sputter coating a glass substrate, said method comprising:
- providing a glass substrate;
providing a sputtering assembly for sputtering a coating material onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate;
providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element;
providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process;
sputtering coating material from said at least one target element;
heating said at least one target element to at least about 400 degrees C. during the step of sputtering coating material; and
wherein the step of sputtering coating material comprises sputtering coating material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with a layer of the coating material.
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Abstract
A method of sputter coating a glass substrate includes providing a glass substrate and providing a sputtering assembly for sputtering a coating onto the glass substrate in a vacuum deposition chamber. The sputtering assembly includes a backing plate and a separating element disposed on the backing plate. At least one target element is provided and disposed at and in contact with a surface of the separating element. The target element is not bonded the separating element when disposed at and in contact with the surface of the separating element. An expansion gap is provided at or adjacent to the target element to allow for expansion of the target element during the sputtering process. Material from the target element is sputtered and the target element is heated to a substantially elevated temperature during the sputtering process. The sputtering process coats a surface of the glass substrate with the target element material.
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Citations
20 Claims
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1. A method of sputter coating a glass substrate, said method comprising:
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providing a glass substrate; providing a sputtering assembly for sputtering a coating material onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate; providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element; providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process; sputtering coating material from said at least one target element; heating said at least one target element to at least about 400 degrees C. during the step of sputtering coating material; and wherein the step of sputtering coating material comprises sputtering coating material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with a layer of the coating material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of sputter coating a glass substrate, said method comprising:
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providing a glass substrate; providing a sputtering assembly for sputtering a coating onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate; providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element; wherein said separating element comprises a sheet having a low-coefficient of friction surface, and wherein said at least one target element is disposed on said low-coefficient of friction surface of said separating element, and wherein said low-coefficient of friction surface allows for movement of said at least one target element on said low-coefficient of friction surface; providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process; sputtering coating material from said at least one target element; heating said at least one target element to at least about 400 degrees C. during the step of sputtering coating material; wherein, during the step of sputtering coating material, said at least one target element is capable of movement relative to said surface of said separating element; and wherein the step of sputtering coating material comprises sputtering coating material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with a layer of the coating material. - View Dependent Claims (13, 14, 15, 16)
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17. A method of sputter coating a glass substrate, said method comprising:
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providing a glass substrate for a reflective element of a mirror assembly for a vehicle; providing a sputtering assembly for sputtering a coating onto said glass substrate in a vacuum deposition chamber, wherein said sputtering assembly comprises a backing plate and a separating element disposed on said backing plate; providing at least one target element and disposing said at least one target element at and in contact with a surface of said separating element, wherein said at least one target element is not bonded to said separating element when disposed at and in contact with said surface of said separating element; wherein said at least one target element comprises a metallic material; providing an expansion gap at or adjacent to said at least one target element to allow for expansion of said at least one target element during the sputtering process; sputtering metallic material from said at least one target element; heating said at least one target element to at least about 400 degrees C. during the step of sputtering metallic material; wherein the step of sputtering metallic material sputters metallic material onto a surface of said glass substrate in the vacuum deposition chamber to coat said surface of said glass substrate with the metallic material to establish a transparent electrically conductive layer at said surface of said glass substrate; wherein, during the step of sputtering metallic material, said at least one target element is capable of movement relative to said surface of said separating element; and wherein said separating element thermally insulates said at least one target element from said backing plate, and wherein heating said at least one target element comprises heating said at least one target element to a greater temperature than said backing plate during the step of sputtering metallic material. - View Dependent Claims (18, 19, 20)
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Specification