Probe card

• US 9,476,913 B2
• Filed: 07/10/2014
• Issued: 10/25/2016
• Est. Priority Date: 07/19/2013
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Fukasawa, Ryo, Horiuchi, Michio, Tokutake, Yasue, Matsuda, Yuichi, Aizawa, Mitsuhiro
• Primary Examiner(s): Hollington, Jermele M
• Assistant Examiner(s): YODICHKAS, KHRISTOPHER J
• Application Number:
  US14/327,745
• Publication Number:
  US 20150022230A1
• Time in Patent Office: 838 Days
• Field of Search: 324/756.03
• US Class Current: 1/1
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A probe card includes a wiring substrate including an opening portion, a first connection pad, and a second connection pad arranged in an opposite area to the first connection pad, a resin portion formed in the opening portion, a first wire buried in the resin portion, in which one end is connected to the first connection pad and other end constitutes a first contact terminal, and a second wire buried in the resin portion, in which one end is connected to the second connection pad and other end constitutes a second contact terminal, wherein the first and second wires extend on one line, and the first and second contact terminals are arranged on the one line, and the first and second contact terminals are gathered to be separated such that the first and second contact terminals touch one electrode pad of a text object with a pair.

Claims

1. A probe card, comprising:

a wiring substrate including an insulating layer and a wiring layer formed on the insulating layer;

an opening portion penetrating the insulating layer and the wiring layer of the wiring substrate in a thickness direction, the opening portion having a quadrangle shape in a plan view, wherein four side faces of the opening portion are formed in a step shape, and have step faces;

a first connection pad formed on the step faces of the side faces of the opening portion of the wiring substrate;

a second connection pad formed on the step faces of the side faces of the opening portion of the wiring substrate, wherein the first connection pad and the second connection pad are arranged, so as to oppose, in facing step faces in the four side faces of the opening portion, wherein the first connection pad and the second connection pad are exposed from an inner face of the opening portion, the first connection pad and the second connection pad each connected to one of the wiring layer;

a resin portion formed in the opening portion of the wiring substrate, the resin portion burying the first connection pad and the second connection pad;

a first bonding wire buried in the resin portion, the first bonding wire in which one end is connected to the first connection pad and the other end constitutes a protruding portion protruding from a lower face of the resin portion, the lower face which is located to a reverse face side to a face on which the first and second connection pads are arranged;

a first contact terminal formed from the protruding portion of the first bonding wire, the first contact terminal protruding downward from the lower face of the resin portion, in a state that a whole of a side face of the first contact terminal is exposed from the resin portion, wherein the first contact terminal and the first bonding wire are formed of one bonding wire which is made of the same metal;

a second bonding wire buried in the resin portion, the second wire in which one end is connected to the second connection pad and the other end constitutes a protruding portion protruding from the lower face of the resin portion; and

a second contact terminal formed from the protruding portion of the second bonding wire, the second contact terminal protruding downward from the lower face of the resin portion, in a state that a whole of a side face of the second contact terminal is exposed from the resin portion, wherein the second contact terminal and the second bonding wire are formed of one bonding wire which is made of the same metal,

wherein each diameter of the first contact terminal and the second contact terminal is equal to each diameter of the first wire and the second wire buried in the resin portion, and

the first bonding wire and the second bonding wire extend on one line in a plan view, and the first contact terminal and the second contact terminal are arranged side by side on the one line, and

the first bonding wire having the first contact terminal in a tip side is arranged to be opposite to the second bonding wire having the second contact terminal in a tip side, such that a distance between the first bonding wire and the second bonding wire narrows gradually as a position becomes the tip side, and

the first contact terminal and the second contact terminal contact one electrode pad of a test object in a pair.

2. The probe card according to claim 1, wherein

a contact face of a tip of each of the first contact terminal and the second contact terminal is formed as a flat face.

3. The probe card according to claim 1, wherein

a plurality of pairs of wires, each pair formed of the first bonding wire and the second bonding wire, are arranged side by side in parallel in the opening portion of the wiring substrate, and

pairs of contact terminals, each pair formed of the first contact terminal and the second contact terminal, are arranged side by side with one row to a direction perpendicular to an extending direction of the wires.

4. The probe card according to claim 1, wherein

a plurality of pairs of wires, each pair formed of the first bonding wire and the second bonding wire, are arranged side by side in parallel in the opening portion of the wiring substrate, and

pairs of contact terminals, each pair formed of the first contact terminal and the second contact terminal, are arranged with a staggered arrangement to a direction perpendicular to an extending direction of the wires.

5. The probe card according to claim 1, wherein each of the first and second bonding wires is a wire with insulation coating.

6. The probe card according to claim 1, wherein the resin portion has a protruding portion protruding downward from a second face of the wiring substrate.