Vertical spiral inductor
First Claim
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1. An inductor, comprising:
- a first plurality of vias through a substrate, wherein the first plurality of vias are substantially the same height; and
a plurality of conductive traces external to the substrate interconnecting the first plurality of vias,wherein the plurality of conductive traces and the first plurality of vias comprise a plurality of conductive turns,wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane,wherein the inductor further comprises a plurality of lead out patterns in a second plane perpendicular to the first plane, the plurality of lead out patterns comprising a first lead out and a second lead out,wherein the first lead out is coupled to a first via of the first plurality of vias, the first via adjacent to at least two other vias of the first plurality of vias, andwherein the second lead out is coupled to a second via of the first plurality of vias, the second via adjacent to one other via of the first plurality of vias.
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Abstract
Methods and apparatuses, wherein the method forms a first plurality of vias in a substrate, further comprising forming the first plurality of vias to be substantially the same height. The method forms a plurality of conductive traces external to the substrate and couples the plurality of conductive traces to the first plurality of vias: wherein the plurality of conductive traces and the first plurality of vias comprise a plurality of conductive turns and wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane.
11 Citations
18 Claims
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1. An inductor, comprising:
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a first plurality of vias through a substrate, wherein the first plurality of vias are substantially the same height; and a plurality of conductive traces external to the substrate interconnecting the first plurality of vias, wherein the plurality of conductive traces and the first plurality of vias comprise a plurality of conductive turns, wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane, wherein the inductor further comprises a plurality of lead out patterns in a second plane perpendicular to the first plane, the plurality of lead out patterns comprising a first lead out and a second lead out, wherein the first lead out is coupled to a first via of the first plurality of vias, the first via adjacent to at least two other vias of the first plurality of vias, and wherein the second lead out is coupled to a second via of the first plurality of vias, the second via adjacent to one other via of the first plurality of vias. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method comprising:
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forming a first plurality of vias in a substrate, further comprising forming the first plurality of vias to be substantially the same height; and forming a plurality of conductive traces external to the substrate, and coupling the plurality of conductive traces to the first plurality of vias, wherein the plurality of conductive traces and the first plurality of vias comprise a plurality of conductive turns, wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane, and wherein the method further comprises; forming a plurality of lead out patterns in a second plane perpendicular to the first plane, the plurality of lead out patterns comprising a first lead out and a second lead out; coupling the first lead out to a first via of the first plurality of vias, the first via adjacent to at least two other vias of the first plurality of vias; and coupling the second lead out to a second via of the first plurality of vias, the second via adjacent to one other via of the first plurality of vias. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. An inductor, comprising:
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a first plurality of vias through a substrate, wherein the first plurality of vias are substantially the same height; a second plurality of vias coupled to the first plurality of vias, wherein the second plurality of vias are external to the substrate; and a plurality of conductive traces interconnecting the second plurality of vias, wherein the plurality of conductive traces, the first plurality of vias, and the second plurality of vias comprise a plurality of conductive turns, wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane, wherein the inductor further comprises a plurality of lead out patterns in a second plane perpendicular to the first plane, the plurality of lead out patterns comprising a first lead out and a second lead out, wherein the first lead out is coupled to a first via of the first plurality of vias, the first via adjacent to at least two other vias of the first plurality of vias, and wherein the second lead out is coupled to a second via of the first plurality of vias, the second via adjacent to one other via of the first plurality of vias.
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Specification