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Alignment mark and method of formation

  • US 9,478,480 B2
  • Filed: 11/14/2014
  • Issued: 10/25/2016
  • Est. Priority Date: 06/30/2010
  • Status: Active Grant
First Claim
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1. A structure comprising:

  • a substrate having a surface, a through via being in the substrate and protruding from the surface of the substrate;

    an isolation layer on the surface of the substrate, the isolation layer defining a first recess having isolation sidewalls and an isolation bottom surface;

    a first conductive layer in the first recess conformally lining the isolation sidewalls and the isolation bottom surface; and

    a second conductive layer over and conformal to the first conductive layer, the second conductive layer having a second composition different from a first composition of the first conductive layer.

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