Alignment mark and method of formation
First Claim
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1. A structure comprising:
- a substrate having a surface, a through via being in the substrate and protruding from the surface of the substrate;
an isolation layer on the surface of the substrate, the isolation layer defining a first recess having isolation sidewalls and an isolation bottom surface;
a first conductive layer in the first recess conformally lining the isolation sidewalls and the isolation bottom surface; and
a second conductive layer over and conformal to the first conductive layer, the second conductive layer having a second composition different from a first composition of the first conductive layer.
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Abstract
In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.
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Citations
20 Claims
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1. A structure comprising:
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a substrate having a surface, a through via being in the substrate and protruding from the surface of the substrate; an isolation layer on the surface of the substrate, the isolation layer defining a first recess having isolation sidewalls and an isolation bottom surface; a first conductive layer in the first recess conformally lining the isolation sidewalls and the isolation bottom surface; and a second conductive layer over and conformal to the first conductive layer, the second conductive layer having a second composition different from a first composition of the first conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A structure comprising:
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a substrate having a surface, a through via being in the substrate and protruding from the surface of the substrate, the substrate having a recess extending from the surface to a depth in the substrate; an isolation layer on the surface of the substrate and conformally lining sidewalls of the recess, a bottom surface of the recess, and sidewalls of an upper portion of the through via protruding from the surface of the substrate, wherein an upper surface of the isolation layer is level with an upper surface of the through via distal the substrate; and a conductive material on the isolation layer and in the recess. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A structure comprising:
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a substrate having a surface, a through via formed in an opening in the substrate and protruding from the surface of the substrate, sidewalls of the opening in the substrate contacting the through via; an isolation layer on the surface of the substrate, the isolation layer defining a first recess having isolation sidewalls that extend to and contact an isolation bottom surface, the isolation layer having a first sublayer and a second sublayer on the first sublayer, the first sublayer having a different composition from the second sublayer; and a conductive layer in the first recess having a substantially same thickness throughout the conductive layer along and in respective directions perpendicular to the isolation sidewalls and the isolation bottom surface. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification