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Microelectronic assemblies with cavities, and methods of fabrication

  • US 9,478,504 B1
  • Filed: 06/19/2015
  • Issued: 10/25/2016
  • Est. Priority Date: 06/19/2015
  • Status: Active Grant
First Claim
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1. A fabrication method comprising:

  • obtaining a first structure comprising one or more cavities;

    obtaining a second structure comprising a first microelectronic component and one or more second microelectronic components, wherein;

    the first microelectronic component comprises a first substrate, the first microelectronic component comprising first circuitry, wherein the first substrate comprises a first side and one or more first holes in the first side;

    each second microelectronic component comprises one or more respective second substrates, each second microelectronic component comprising respective second circuitry, each second microelectronic component being attached to the first side of the first substrate, wherein the second circuitry of at least one second microelectronic component is electrically coupled to the first circuitry;

    attaching the first structure to the second structure so that at least one second microelectronic component is located in at least one of the one or more cavities and so that at least a portion of a sidewall of at least one of the one or more cavities is located in a corresponding first hole such that at least a portion of a sidewall of the corresponding first hole extends laterally along a straight line adjacent to at least one second microelectronic component located in said cavity, and such that said at least a portion of a sidewall of at least one of the one or more cavities extends laterally along the portion of the corresponding first hole.

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