Semiconductor memory device and method of fabricating the same
First Claim
1. A semiconductor memory device, comprising:
- a substrate;
a stack on the substrate, the stack including gate electrodes and insulating layers that are alternately and repeatedly stacked on the substrate;
a cell channel structure penetrating the stack,the cell channel structure including a first semiconductor pattern contacting the substrate and a first channel pattern on the first semiconductor pattern,the first channel pattern contacting the first semiconductor pattern,the first semiconductor pattern extending to a first height from a surface of the substrate to a top surface of the first semiconductor pattern; and
a first dummy channel structure on the substrate,the first dummy channel structure being spaced apart from the stack,the first dummy channel structure including a second semiconductor pattern contacting the substrate and a second channel pattern on the second semiconductor pattern,the second channel pattern contacting the second semiconductor pattern,the second semiconductor pattern extending to a second height from the surface of the substrate to a top surface of the second semiconductor pattern, andthe first height being greater than the second height.
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Accused Products
Abstract
A semiconductor memory device includes a stack including gate electrodes and insulating layers that are alternately and repeatedly stacked on a substrate. A cell channel structure penetrates the stack. The cell channel structure includes a first semiconductor pattern contacting the substrate and a first channel pattern on the first semiconductor pattern. The first semiconductor pattern extends to a first height from a surface of the substrate to a top surface of the first semiconductor pattern. A dummy channel structure on the substrate and spaced apart from the stack. The dummy channel structure includes a second semiconductor pattern contacting the substrate and a second channel pattern on the second semiconductor pattern. The second semiconductor pattern extends to a second height from the surface of the substrate to a top surface of the second semiconductor pattern. The first height is greater than the second height.
43 Citations
20 Claims
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1. A semiconductor memory device, comprising:
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a substrate; a stack on the substrate, the stack including gate electrodes and insulating layers that are alternately and repeatedly stacked on the substrate; a cell channel structure penetrating the stack, the cell channel structure including a first semiconductor pattern contacting the substrate and a first channel pattern on the first semiconductor pattern, the first channel pattern contacting the first semiconductor pattern, the first semiconductor pattern extending to a first height from a surface of the substrate to a top surface of the first semiconductor pattern; and a first dummy channel structure on the substrate, the first dummy channel structure being spaced apart from the stack, the first dummy channel structure including a second semiconductor pattern contacting the substrate and a second channel pattern on the second semiconductor pattern, the second channel pattern contacting the second semiconductor pattern, the second semiconductor pattern extending to a second height from the surface of the substrate to a top surface of the second semiconductor pattern, and the first height being greater than the second height. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor memory device, comprising:
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a substrate including a cell region including a cell array region and a connection region, a peripheral region spaced apart from the cell region, and a boundary region between the connection region of the cell region and the peripheral region; stacks on the cell region, the stacks spaced apart from each other in a first direction, each of the stacks including gate electrodes and insulating layers that are alternately and repeatedly stacked on the substrate and having an edge part on the connection region; cell channel structures penetrating the stacks on the cell array region, each of the cell channel structures including a first semiconductor pattern and a first channel pattern that is on the first semiconductor pattern and in contact with the first semiconductor pattern; first dummy channel structures penetrating the stacks on the connection region, each of the first dummy channel structures including a second semiconductor pattern and a second channel pattern that is on the second semiconductor pattern and in contact with the second semiconductor pattern; and a second dummy channel structure on the boundary region, the second dummy channel structure including a third semiconductor pattern and a third channel pattern that is on the third semiconductor pattern and in contact with the third semiconductor pattern. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A semiconductor memory device, comprising:
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a substrate including a cell region including a cell array region and a connection region, a peripheral region spaced apart from the cell region, and a boundary region between the cell region and the peripheral region; a stack on the cell region, the stack including gate electrodes and insulating layers that are alternately and repeatedly stacked on each other on the substrate; and a plurality of channel structures spaced apart from each other on the substrate, the plurality of channel structures each including a channel pattern on top of a semiconductor pattern, the plurality of channel structures including cell channel structures on the cell array region, the cell channel structures extending vertically through the stack, a bottom of the channel pattern of the cell channel structures being spaced apart from a surface of the substrate by a first height, the plurality of channel structures including a dummy channel structure on the boundary region, and a bottom of the channel pattern of the dummy channel structure being spaced apart from the surface of the substrate by a second height that is less than the first height. - View Dependent Claims (17, 18, 19, 20)
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Specification