Light emitting device and method for manufacturing the same

• US 9,478,716 B2
• Filed: 03/04/2015
• Issued: 10/25/2016
• Est. Priority Date: 03/15/2007
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Konishi, Masahiro, Agatani, Makoto, Hata, Toshio
• Primary Examiner(s): HINES, ANNE M
• Application Number:
  US14/638,672
• Publication Number:
  US 20150176824A1
• Time in Patent Office: 601 Days
• US Class Current: 1/1
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 : characterized by the materials

Abstract

By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Claims

1. An LED lamp comprising:

a support member;

a light emitting device mounted on said support member, comprising;

a substrate having a lighting area and a peripheral area surrounding the lighting area in an upper surface of the substrate, and having a lower surface facing said support member,

a positive electrode land provided on the upper surface and located on the peripheral area of the substrate with a space between an edge of the substrate and the positive electrode land,

a negative electrode land provided on the upper surface and located on the peripheral area of the substrate with a space between the edge of the substrate and the negative electrode land, and

a light emitter formed on the lighting area of the substrate, comprising a plurality of light emitting elements electrically coupled between the positive and negative electrode lands, and a sealing member for sealing and continuously covering the plurality of light emitting elements, the sealing member being located within the lighting area other than the peripheral area; and

first and second external conductors configure to be connected to the positive and negative electrode lands, respectively.

2. The LED lamp of claim 1, wherein an outer shape of the substrate has a pit.

3. The LED lamp of claim 2, wherein one of said first and second external wires passes through the pit.

4. The LED lamp of claim 1, wherein the positive electrode land is opposite to the negative electrode land with respect to the sealing member.

5. The LED lamp of claim 4, wherein the sealing member has a round top shape.

6. The LED lamp of claim 5, wherein the sealing member has an upward convex portion.

7. The LED lamp of claim 4, wherein the substrate has a quadrangle top shape, and the positive and negative electrode lands are located on opposite corners of the substrate.

8. The LED lamp of claim 7, wherein the quadrangle top shape is a rectangular top shape.

9. The LED lamp of claim 7, wherein the quadrangle top shape is a square top shape.

10. The LED lamp of claim 1, wherein the substrate includes a polarity indicator disposed on the peripheral area and adjacent to at least one of the positive and negative electrode lands.

11. The LED lamp of claim 10, wherein the polarity indicator includes a positive polarity mark.

12. The LED lamp of claim 11, wherein the polarity indicator further includes a negative polarity mark.

13. The LED lamp of claim 10, wherein the polarity indicator includes a negative polarity mark.

14. The LED lamp of claim 13, wherein the substrate has a thickness of about 1 mm.

15. The LED lamp of claim 1, wherein the substrate is made of white ceramic.