Multi-chip module architecture
First Claim
1. A multi-chip module (MCM), comprising:
- a first semiconductor component;
a plurality of second semiconductor components, wherein the first semiconductor component is coupled to the plurality of second semiconductor components, and wherein the first semiconductor component is configured to control the plurality of second semiconductor components;
wherein each of the plurality of second semiconductor components is accessible through a plurality of data paths providing communication defined by a plurality of data strings between the first semiconductor component and the plurality of second semiconductor components, each data string defining a unique path for the communication between the first semiconductor component and a unique subset of the plurality of second semiconductor components, such that the plurality of data strings define redundant data paths between the first semiconductor component and each of the plurality of second semiconductor components.
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Abstract
Electronically scanned arrays and multi-chip modules (MCMs) that may be used in such arrays are provided. One MCM may include a set of one or more first semiconductor components and a plurality of second semiconductor components. The first semiconductor component set is coupled to the plurality of second semiconductor components, and the first semiconductor component set is configured to control the plurality of second semiconductor components. Each of the plurality of second semiconductor components is accessible through a plurality of data strings providing communication between the first semiconductor component set and the plurality of second semiconductor components, each data string defining a unique path between the first semiconductor component set and the plurality of second semiconductor components, such that the plurality of data strings provide redundant data paths between the first semiconductor component set and the plurality of second semiconductor components.
231 Citations
32 Claims
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1. A multi-chip module (MCM), comprising:
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a first semiconductor component; a plurality of second semiconductor components, wherein the first semiconductor component is coupled to the plurality of second semiconductor components, and wherein the first semiconductor component is configured to control the plurality of second semiconductor components; wherein each of the plurality of second semiconductor components is accessible through a plurality of data paths providing communication defined by a plurality of data strings between the first semiconductor component and the plurality of second semiconductor components, each data string defining a unique path for the communication between the first semiconductor component and a unique subset of the plurality of second semiconductor components, such that the plurality of data strings define redundant data paths between the first semiconductor component and each of the plurality of second semiconductor components. - View Dependent Claims (2, 3, 4, 6, 7, 8, 9, 10, 12, 13, 14)
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5. A multi-chip module (MCM), comprising:
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a first set of one or more first semiconductor components; a plurality of second semiconductor components, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components; wherein each of the plurality of second semiconductor components is accessible through a plurality of data paths defined by a plurality of data strings for communication between the first set and the plurality of second semiconductor components, each data string defining a unique path between the first set and at least one of the plurality of second semiconductor components for the communication, such that the plurality of data strings define redundant data paths between the first set and each of the plurality of second semiconductor components, wherein the first set comprises an α
-channel transmit/receive radio frequency integrated circuit (RFIC), where α
is an integer, wherein the plurality of second semiconductor components comprise;β
γ
-channel second semiconductor components, where β
×
γ
=α
, and α
, β
, and γ
are integers.
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11. A multi-chip module (MCM), comprising:
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a first set of one or more first semiconductor components; a plurality of second semiconductor components, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components; wherein each of the plurality of second semiconductor components is accessible through a plurality of data paths defined by a plurality of data strings for communication between the first set and the plurality of second semiconductor components, each data string defining a unique path between the first set and at least one of the plurality of second semiconductor components for the communication, such that the plurality of data strings define redundant data paths between the first set and each of the plurality of second semiconductor components, wherein the MCM is one of a plurality of MCMs in an electronically scanned array.
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15. A subassembly for an electronically scanned array, comprising:
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an antenna aperture layer configured to selectively emit and receive radio waves; a radio frequency (RF) ground layer; a radio frequency integrated circuit (RFIC) multi-chip module (MCM) attach layer, wherein the RFIC MCM attach layer has attached thereto a plurality of MCMs, each MCM comprising a first set of one or more first semiconductor components and a plurality of second semiconductor components controlled by the first set; and a thermal layer configured to draw heat away from at least one of the first set and the second semiconductor components, wherein the each of the plurality of second semiconductor components is accessible through a plurality of data paths defined by a plurality of data strings providing communication between the first set and the plurality of second semiconductor components, each data string defining a unique path between the first set and at least one of the plurality of second semiconductor components. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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23. An electronically scanned array, comprising:
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a master controller; and a plurality of multi-chip transmit/receive modules, each transmit/receive module comprising; a first set of one or more first semiconductor components; and a plurality of second semiconductor components, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components; wherein the each of the plurality of second semiconductor components is accessible through a first plurality of data paths providing communication between the first set and the plurality of second semiconductor components defined by a plurality of data strings, each data string of the first plurality of data strings defining a unique path between the first set and at least one of the plurality of second semiconductor components, such that the first plurality of data strings define redundant data paths between the first set and each of the plurality of second semiconductor components, and wherein each of the transmit/receive modules is accessible by the master controller through a second plurality of data paths defined by a plurality of second data strings providing communication between the master controller and the plurality of transmit/receive modules, each data string of the second plurality of data strings defining a unique path between the master controller and at least one of the plurality of transmit/receive modules, such that the second plurality of data strings provide redundant data paths between the master controller and each of the plurality of transmit/receive modules, wherein the first set comprises an α
-channel transmit/receive radio frequency integrated circuit (RFIC), and wherein the plurality of second semiconductor components comprise β
γ
-channel second semiconductor components, where β
×
γ
=α
, and α
,β
, and γ
are integers. - View Dependent Claims (24, 25, 26, 27, 28, 29, 31, 32)
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30. An electronically scanned array, comprising:
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a master controller; and a plurality of multi-chip transmit/receive modules, each transmit/receive module comprising; a first set of one or more first semiconductor components; and a plurality of second semiconductor components, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components; wherein the each of the plurality of second semiconductor components is accessible through a first plurality of data paths defined by a plurality of data strings for communication between the first set and the plurality of second semiconductor components, each data string of the first plurality of data strings defining a unique path between the first set and at least one of the plurality of second semiconductor components, such that the first plurality of data strings define redundant data paths between the first set and each of the plurality of second semiconductor components, and wherein each of the transmit/receive modules is accessible by the master controller through a second plurality of data paths defined by a plurality of second data strings providing communication between the master controller and the plurality of transmit/receive modules, each data string of the second plurality of data strings defining a unique path between the master controller and the plurality of transmit/receive modules, such that the second plurality of data strings define redundant data paths between the master controller and the plurality of transmit/receive modules, wherein the first set comprises an α
-channel transmit/receive radio frequency integrated circuit (RFIC), and wherein each of the plurality of second semiconductor components is a first device with respect to the first set in only one data path defined by the first plurality of data strings.
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Specification