Digitizing sensors coupled to a structure

• US 9,480,163 B2
• Filed: 04/30/2014
• Issued: 10/25/2016
• Est. Priority Date: 08/10/2009
• Status: Active Grant

• Current Assignee: Metis Design Corporation, The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Kessler, Seth S., Ihn, Jeong-Beom, Dunn, Christopher T., Duce, Jeffrey Lynn, Borgen, Michael G.
• Primary Examiner(s): PHAN, THIEM D
• Application Number:
  US14/266,745
• Publication Number:
  US 20140232552A1
• Time in Patent Office: 909 Days
• Field of Search: 297/39, 297/29, 298/54, 298/25, 298/29, 298/30, 298/46, 298/52, 298/74, 257/208, 257/211, 257/659, 257/662, 257/758, 702/35, 702/183
• US Class Current: 1/1
• CPC Class Codes: G06F 3/05 Digital input using the sampling of an analogue quantity at regular intervals of time , input from a/d converter or output to d/a converter
• CPC Class Codes: G08C 19/16 in which transmission is by pulses
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2203/1344 Spraying small metal particles or droplets of molten metal
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular system includes a digitizing sensor node. The system further includes a bus including a plurality of conductive elements applied to a substrate. A first conductive element of the bus is coupled to the digitizing sensor node using a direct-write technique.

Claims

1. A structure, comprising:

a structural element;

a digitizing sensor coupled to the structural element;

a bus comprising a plurality of conductive traces applied on the structural element using a direct-write technique, wherein one or more power traces of the bus provide power to the digitizing sensor, and wherein one or more communication traces of the bus enable data communication from the digitizing sensor;

a first conductive shield layer applied to the structural element, wherein the one or more communication traces are applied over the first conductive shield layer; and

a first insulating layer between the first conductive shield layer and the one or more communication traces.

2. The structure of claim 1, further comprising:

a second conductive shield layer over the one or more communication traces; and

a second insulating layer between the one or more communication traces and the second conductive shield layer.

3. The structure of claim 1, wherein the digitizing sensor is adapted to gather data regarding structural integrity of the structural element and is adapted to transmit the data as a digital signal via the one or more communication traces to a structural health monitoring system.

4. The structure of claim 1, further comprising an actuator coupled to the structural element.

5. The structure of claim 4, wherein one or more synchronization traces of the bus enable synchronization between the actuator and the digitizing sensor.

6. The structure of claim 1, wherein the one or more communication traces include two communication traces, and wherein the structure further comprises one or more shield traces between the two communication traces.

7. The structure of claim 1, wherein the first insulating layer comprises a dielectric material.

8. The structure of claim 1, wherein the plurality of conductive traces include a copper trace.

9. The structure of claim 1, wherein the first conductive shield layer comprises silver ink.

10. The structure of claim 1, further comprising a dielectric layer applied to the structure, wherein the one or more communication traces are applied over the dielectric layer.

11. The structure of claim 10, wherein the dielectric layer comprises a pressure sensitive adhesive, wherein the dielectric layer is coupled to the structure via the pressure sensitive adhesive.

12. The structure of claim 1, further comprising a hub coupled to the bus, wherein the hub is adapted to receive signals from the digitizing sensor via the bus using a first protocol and is adapted to convert the signals to a second protocol.

13. The structure of claim 1, wherein the digitizing sensor comprises a processor that processes information gathered by the digitizing sensor and transmits the processed information via the bus.

14. The structure of claim 1, further comprising an actuator separate from the digitizing sensor and coupled to the bus, wherein the actuator and the digitizing sensor are synchronized for data gathering via a synchronization signal transmitted via the bus.

15. The structure of claim 14, wherein the actuator is configured to transmit an acoustic signal via the structural element, and wherein structural health information is determined based on the acoustic signal.

16. The structure of claim 14, wherein the actuator is coupled to the digitizing sensor via a synchronization trace of the one or more communication traces.

17. The structure of claim 1, further comprising a substrate coupled to the structural element, wherein the substrate is flexible and substantially conforms to a surface of the structural element, and wherein the digitizing sensor is operable to monitor structural health of the structural element and to transmit data related to the structural health of the structural element to a second digitizing sensor via the bus.

18. A method comprising:

receiving structural health information at a digitizing sensor coupled to a structural element;

converting the structural health information to digital data; and

transmitting a signal corresponding to the digital data to a central processor via one or more communication traces of a bus comprising a plurality of conductive traces applied to the structural element using a direct-write technique, wherein the bus includes one or more power traces that provide power to the digitizing sensor, wherein the one or more communication traces are applied over a first conductive shield layer that is applied to the structural element, and wherein a first insulating layer is between the first conductive shield layer and the one or more communication traces.

19. The method of claim 18, wherein the central processor corresponds to a structural health monitoring system.

20. The method of claim 18, further comprising differentiating between first data to report and second data, wherein the digital data includes the first data.