Three dimensional electronic patch

• US 9,483,726 B2
• Filed: 07/30/2015
• Issued: 11/01/2016
• Est. Priority Date: 12/10/2014
• Status: Active Grant

• Current Assignee: Vivalnk Inc.
• Original Assignee: Vivalnk Inc.
• Inventors: Mei, Junfeng, Wang, Zhigang
• Primary Examiner(s): Marshall, Christle I
• Application Number:
  US14/814,347
• Publication Number:
  US 20160171363A1
• Time in Patent Office: 460 Days
• US Class Current: 1/1
• CPC Class Codes: A61B 2560/0252 using ambient temperature
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/0002 Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network A61B5/07 takes precedence; transmission systems for measured values G08C; transmission H04B; transmission of digital information H04L; wireless communication networks H04W
• CPC Class Codes: A61B 5/0008 Temperature signals
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/0205 Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
• CPC Class Codes: A61B 5/024 Detecting, measuring or recording pulse rate or heart rate A61B5/0205, A61B5/021 take precedence
• CPC Class Codes: A61B 5/369 Electroencephalography [EEG] devices for psychotechnics A61B5/16
• CPC Class Codes: A61B 5/6814 Head
• CPC Class Codes: A61B 5/6833 Adhesive patches
• CPC Class Codes: G01K 13/20 Clinical contact thermometers for use with humans or animals
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G06K 19/07773 Antenna details antennas for wireless devices, e.g. RFID tags, in general H01Q1/22
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/273 Adaptation for carrying or wearing by persons or animals
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

Claims

1. A three-dimensional electronic patch, comprising:

a flat flexible circuit substrate, comprising;

an elastic layer including a first portion and a second portion, wherein the second portion includes at least one side connected to the first portion of the elastic layer and one or more sides defined by one or more cuts in the elastic layer;

a first sensor on the first portion of the elastic layer;

a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor; and

a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor, wherein the second portion is folded to position the conductive layer away from the first portion.

2. The three-dimensional electronic patch of claim 1, wherein the first conductive sensing pad and the conductive layer of the folded second portion are respectively on opposing sides of the three-dimensional electronic patch.

3. The three-dimensional electronic patch of claim 1, further comprising:

a second sensor on the second portion of the elastic layer and in electrical connection with the conductive layer, wherein the conductive layer includes a second conductive sensing pad electrically connected with the second sensor.

4. The three-dimensional electronic patch of claim 3, wherein the second sensor is configured to measure ambient temperature via the second conductive sensing pad.

5. The three-dimensional electronic patch of claim 3, wherein the second conductive sensing pad and the second sensor are electrically connected by a conductive pin through the second portion of the elastic layer.

6. The three-dimensional electronic patch of claim 3, further comprising:

an adhesive layer configured to bond the second sensor to the first portion of the elastic layer.

7. The three-dimensional electronic patch of claim 1, wherein the first conductive sensing pad is configured to be in contact with a user'"'"'s skin, wherein the first sensor is configured to measure body temperature of a user via the first conductive sensing pad.

8. The three-dimensional electronic patch of claim 1, wherein the first conductive sensing pad and the first sensor are electrically connected by a conduct pin through the first portion of the elastic layer.

9. The three-dimensional electronic patch of claim 1, wherein the conductive layer comprises an antenna circuit.

10. The three-dimensional electronic patch of claim 9, further comprising:

a spacer on the second portion of the elastic layer, wherein the spacer is configured to keep the conductive layer at a distance away from the conductive sensing pad while the second portion is folded to be in parallel to the first portion.

11. The three-dimensional electronic patch of claim 10, further comprising:

an adhesive layer configured to bond the spacer to the first portion of the elastic layer.

12. The three-dimensional electronic patch of claim 9, wherein the antenna circuit is electrically connected with the first sensor by a circuit in or on the elastic layer.

13. The three-dimensional electronic patch of claim 9, wherein the antenna circuit is configured to transmit wireless signals to transfer sensing data measured by the first sensor.

14. A three-dimensional electronic patch, comprising:

a flat flexible circuit substrate, comprising;

an elastic layer including a first portion and a second portion, wherein the second portion includes at least one side connected to the first portion of the elastic layer and one or more sides defined by one or more cuts in the elastic layer;

a first sensor on the first portion of the elastic layer;

a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, wherein the first conductive sensing pad is configured to be in contact with a user'"'"'s skin, wherein the first sensor is configured to measure body temperature of a user via the first conductive sensing pad;

a second sensor on the second portion of the elastic layer; and

a second conductive sensing pad under the second portion of the elastic layer and in electrical connection with the second sensor, wherein the second sensor is configured to measure ambient temperature via the second conductive sensing pad,

wherein the second portion is folded to position the second conductive sensing pad away from the first portion.

15. The three-dimensional electronic patch of claim 14, wherein the first conductive sensing pad and the second conductive sensing pad of the folded second portion are respectively on opposing sides of the three-dimensional electronic patch.

16. The three-dimensional electronic patch of claim 14, wherein the first conductive sensing pad and the first sensor are electrically connected by a conduct pin through the elastic layer, wherein the second conductive sensing pad and the second sensor are electrically connected by a conductive pin through the second portion of the elastic layer.

17. The three-dimensional electronic patch of claim 14, further comprising:

an adhesive layer configured to bond the second sensor to the first portion of the elastic layer.

18. A three-dimensional electronic patch, comprising:

a flat flexible circuit substrate, comprising;

an elastic layer including a first portion and a second portion, wherein the second portion includes at least one side connected to the first portion of the elastic layer and one or more sides defined by one or more cuts in the elastic layer;

a first sensor on the first portion of the elastic layer;

a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor; and

an antenna circuit under the second portion of the elastic layer and in electrical connection with the first sensor, wherein the second portion is folded to position the antenna circuit away from the first portion.

19. The three-dimensional electronic patch of claim 18, wherein the first conductive sensing pad and the antenna circuit of the folded second portion are respectively on opposing sides of the three-dimensional electronic patch.

20. The three-dimensional electronic patch of claim 18, further comprising:

a spacer on the second portion of the elastic layer, wherein the spacer is configured to keep the conductive layer at a distance away from the conductive sensing pad while the second portion is folded to be in parallel to the first portion.

21. The three-dimensional electronic patch of claim 18, further comprising:

an adhesive layer configured to bond the spacer to the first portion of the elastic layer.

22. The three-dimensional electronic patch of claim 18, wherein the antenna circuit is configured to transmit wireless signals to transfer sensing data measured by the first sensor.