Conductive sealant compositions
First Claim
Patent Images
1. A sealant composition comprising:
- a base composition comprising a sulfur-containing polymer;
a curing agent composition comprising a curing agent; and
an electrically conductive filler in at least one of the base composition or the curing agent composition, the electrically conductive filler comprising carbon nanotubes and stainless steel fibers;
wherein the stainless steel fibers have an average particle dimension larger than an average particle dimension of the carbon nanotubes wherein the stainless steel fibers have an average first dimension of about 8 μ
m to about 22 μ
m, and an average second dimension of about 330 μ
m to about 1 mm.
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Abstract
Embodiments of the present disclosure are directed to sealant compositions including a base composition with at least one sulfur-containing polymer, a curing agent composition, and an electrically conductive filler including carbon nanotubes and stainless steel fibers. The electrically conductive filler can be in either or both of the base composition and the curing agent composition. The sealant compositions are substantially Ni-free and exhibit unexpectedly superior EMI/RFI shielding effectiveness.
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Citations
24 Claims
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1. A sealant composition comprising:
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a base composition comprising a sulfur-containing polymer; a curing agent composition comprising a curing agent; and an electrically conductive filler in at least one of the base composition or the curing agent composition, the electrically conductive filler comprising carbon nanotubes and stainless steel fibers;
wherein the stainless steel fibers have an average particle dimension larger than an average particle dimension of the carbon nanotubes wherein the stainless steel fibers have an average first dimension of about 8 μ
m to about 22 μ
m, and an average second dimension of about 330 μ
m to about 1 mm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A sealant composition comprising:
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a base composition comprising a sulfur-containing polymer; a curing agent composition comprising a curing agent; and an electrically conductive filler in at least one of the base composition or the curing agent composition, the electrically conductive filler comprising carbon nanotubes and stainless steel fibers;
wherein the carbon nanotubes have an average particle dimension larger than an average particle dimension of the stainless steel fibers wherein the stainless steel fibers have an average first dimension of about 8 μ
m to about 22 μ
m, and an average second dimension of about 330 μ
m to about 1 mm. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A sealant composition comprising:
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a substantially nickel-free base composition comprising a sulfur-containing polymer; a substantially nickel-free curing agent composition comprising a curing agent; and a substantially nickel-free electrically conductive filler in at least one of the base composition or the curing agent composition, the electrically conductive filler comprising carbon nanotubes and stainless steel fibers;
wherein the stainless steel fibers have an average particle dimension larger than an average particle dimension of the carbon nanotubes fibers wherein the stainless steel fibers have an average first dimension of about 8 μ
m to about 22 μ
m, and an average second dimension of about 330 μ
m to about 1 mm. - View Dependent Claims (20, 21)
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22. A sealant composition comprising:
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a substantially nickel-free base composition comprising a sulfur-containing polymer; a substantially nickel-free curing agent composition comprising a curing agent; and a substantially nickel-free electrically conductive filler in at least one of the base composition or the curing agent composition, the electrically conductive filler comprising carbon nanotubes and stainless steel fibers;
wherein the carbon nanotubes have an average particle dimension larger than an average particle dimension of the stainless steel fibers wherein the stainless steel fibers have an average first dimension of about 8 μ
m to about 22 μ
m, and an average second dimension of about 330 μ
m to about 1 mm. - View Dependent Claims (23, 24)
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Specification