Crashworthy memory module having a thermal cutoff
First Claim
Patent Images
1. A memory module, comprising:
- an enclosure including a wall that defines a slot therethrough;
an electronic device disposed within the enclosure;
a filler disposed within the enclosure, the filler including a first filler portion and a second filler portion, a surface of the first filler portion facing a surface of the second filler portion, the surface of the first filler portion and the surface of the second filler portion being in contact with the electronic device; and
a thermal cutoff disposed in the slot, the thermal cutoff includinga first end attached to the electronic device, anda second end attached to a wire configured to electrically connect to the electronic device, the thermal cutoff being configured to disconnect the wire from the electronic device when subjected to a threshold temperature.
1 Assignment
0 Petitions
Accused Products
Abstract
A memory module is disclosed. The memory module may have an enclosure having a slot in a wall of the enclosure. The memory module may also have a device disposed within the enclosure. The memory module may further have a thermal cutoff disposed in the slot. The thermal cutoff may have a first end attached to the device. The thermal cutoff may also have a second end attached to a wire configured to electrically connect to the device. The thermal cutoff may disconnect the wire from the device when subjected to a threshold temperature.
11 Citations
18 Claims
-
1. A memory module, comprising:
-
an enclosure including a wall that defines a slot therethrough; an electronic device disposed within the enclosure; a filler disposed within the enclosure, the filler including a first filler portion and a second filler portion, a surface of the first filler portion facing a surface of the second filler portion, the surface of the first filler portion and the surface of the second filler portion being in contact with the electronic device; and a thermal cutoff disposed in the slot, the thermal cutoff including a first end attached to the electronic device, and a second end attached to a wire configured to electrically connect to the electronic device, the thermal cutoff being configured to disconnect the wire from the electronic device when subjected to a threshold temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A thermal wiring disconnect system for an electronic device disposed within an enclosure, the thermal wiring disconnect system comprising:
-
a wall of the enclosure defining a slot therethrough; a thermal cutoff disposed in the slot, the thermal cutoff including a first end attached to the electronic device, and a second end attached to a wire configured to electrically connect to the electronic device, the thermal cutoff being configured to disconnect the wire from the electronic device when subjected to a threshold temperature; and a filler disposed within the enclosure, the filler including a first filler portion and a second filler portion, a surface of the first filler portion facing a surface of the second filler portion, the surface of the first filler portion and the surface of the second filler portion being in contact with the electronic device. - View Dependent Claims (10, 11, 12)
-
-
13. A method for manufacturing a memory module, the method comprising:
-
fabricating an enclosure including a wall that defines a slot therethrough; installing a filler within the enclosure, the filler including a first filler portion and a second filler portion, a surface of the first filler portion facing a surface of the second filler portion; installing an electronic device in the enclosure, the surface of the first filler portion and the surface of the second filler portion being in contact with the electronic device; and installing a thermal cutoff by disposing the thermal cutoff in the slot so that the thermal cutoff is substantially perpendicular to the wall; connecting a first end of the thermal cutoff to the electronic device; and connecting a second end of the thermal cutoff to a wire configured to electrically connect to the electronic device, wherein the thermal cutoff is configured to disconnect the wire from the electronic device when subjected to a threshold temperature. - View Dependent Claims (14, 15, 16, 17, 18)
-
Specification