Mass transfer system

• US 9,484,237 B2
• Filed: 07/30/2015
• Issued: 11/01/2016
• Est. Priority Date: 06/04/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Bibl, Andreas, Golda, Dariusz
• Primary Examiner(s): Tran, Thienvu
• Assistant Examiner(s): Thomas, Lucy
• Application Number:
  US14/814,307
• Publication Number:
  US 20150340262A1
• Time in Patent Office: 460 Days
• Field of Search: 361/234
• US Class Current: 1/1
• CPC Class Codes: B81C 99/002 Apparatus for assembling MEMS, e.g. micromanipulators micromanipulators per se B25J7/00
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/76802 by forming openings in dielectrics
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/75725 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.

Claims

1. A system comprising:

a transfer head assembly including an operating voltage contact and a clamping voltage contact; and

a micro pick up array including a base substrate, a plug formed through the base substrate, and an array of electrostatic transfer heads electrically coupled with the plug;

wherein the operating voltage contact is alignable with the plug and the clamping voltage contact is alignable with a backside of the micro pick up array opposite the array of electrostatic transfer heads on a frontside of the micro pick up array.

2. The system of claim 1, wherein a gap separates the plug from the base substrate, and the array of electrostatic transfer heads are electrically coupled with the plug.

3. The system of claim 1, wherein the transfer head assembly comprises a plurality of operating voltage contacts, and the micro pick up array comprises a plurality of plugs, wherein the plurality of operating voltage contacts are alignable with the plurality of plugs.

4. The system of claim 1, wherein each electrostatic transfer head comprises:

a mesa structure having an electrode surface, and a dielectric layer covering the electrode surface.

5. The system of claim 2, wherein the gap is filled with a dielectric material.

6. The system of claim 2, wherein the plug is movable relative to the base substrate.