Method for fabricating an image sensor package

• US 9,484,385 B2
• Filed: 11/23/2015
• Issued: 11/01/2016
• Est. Priority Date: 08/01/2007
• Status: Active Grant

• Current Assignee: Visera Technologies Company Limited (Taiwan Semiconductor Manufacturing Company Limited)
• Original Assignee: Visera Technologies Company Limited (Taiwan Semiconductor Manufacturing Company Limited)
• Inventors: Weng, Jui-Ping, Hsieh, Jang-Cheng, Lin, Tzu-Han, Zung, Pai-Chun Peter
• Primary Examiner(s): Hu, Shouxiang
• Application Number:
  US14/948,871
• Publication Number:
  US 20160079304A1
• Time in Patent Office: 344 Days
• Field of Search: 438/65, 438/64, 438/70, 438/106, 438/118, 438/29, 438/66, 438/455, 438/459, 438/48
• US Class Current: 1/1
• CPC Class Codes: H01L 21/304 Mechanical treatment, e.g. grinding, polishing, cutting H01L21/30625 takes precedence
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2224/10 Bump connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration

Abstract

An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.

Claims

1. A method for fabricating an image sensor package, comprising:

providing a first substrate comprising a via therein, wherein the first substrate comprises an upper surface and a lower surface opposite the upper surface;

forming a driving circuit on the upper surface of the first substrate and electrically connected to the via;

bonding a second substrate to the first substrate, wherein the second substrate comprises a first surface and a second surface opposite the first surface, and wherein a photosensitive device is on the first surface and is electrically connected to the driving circuit;

forming a support member on the second surface of the second substrate; and

disposing a covering plate on the second surface of the second substrate.

2. The method as claimed in claim 1, wherein further comprising:

etching the first substrate to form a cavity; and

filling a conductive material in the cavity to form the via.

3. The method as claimed in claim 1, further comprising:

forming a first conductive pad on the upper surface of the first substrate electrically connected to the driving circuit; and

forming a second conductive pad on the first surface of the second substrate electrically connected to the photosensitive device;

wherein the first conductive pad is in contact with the second conductive pad to electrically connect the driving circuit to the photosensitive device by the bonding.

4. The method as claimed in claim 3, further comprising:

forming an interlayer dielectric on the second substrate prior to bonding; and

forming a metal plug in the interlayer dielectric electrically connected the photosensitive device and the second conductive pad.

5. The method as claimed in claim 1, further comprising thinning the first substrate from the lower surface to expose the via.

6. The method as claimed in claim 5, wherein thinning the first substrate is performed by grinding.

7. The method as claimed in claim 1, further comprising thinning the second substrate to make the photosensitive device capable of sensing a sufficient amount of light through the second surface.

8. The method as claimed in claim 1, wherein forming the support member comprises:

removing a portion of the covering plate to form a recess and a protruding part; and

disposing the covering plate on the second substrate.

9. The method as claimed in claim 1, further comprising:

forming a color filter layer on the photosensitive device; and

disposing an optics element on the color filter layer.

10. The method as claimed in claim 1, further comprising forming a solder ball on the lower surface of the first substrate and electrically connected to the via.

11. The method as claimed in claim 1, wherein the photosensitive device senses light through a backside thereof.

12. The method as claimed in claim 1, further comprising forming a conductive layer on the lower surface of the first substrate.

13. The method as claimed in claim 12, further comprising forming a solder ball on the lower surface of the first substrate, and wherein the via and the solder ball are electrically connected through the conductive layer.

14. The method as claimed in claim 1, further comprising forming a solder mask on the lower surface of the first substrate.

15. The method as claimed in claim 1, further comprising forming a trench extending from the first substrate towards the support member.

16. The method as claimed in claim 15, wherein forming the trench is performed by notching.

17. The method as claimed in claim 15, wherein the trench penetrates through the second substrate.

18. The method as claimed in claim 15, further comprising forming an insulating layer on the lower surface of the first substrate and extending into the trench.

19. The method as claimed in claim 1, further comprising removing a portion of the second substrate to allow a sufficient amount of light to penetrate into the photosensitive device.

20. The method as claimed in claim 19, wherein the removal of the portion of the second substrate is performed after bonding the second substrate to the first substrate.