Light emitting device and method for manufacturing the same

• US 9,484,502 B2
• Filed: 04/04/2014
• Issued: 11/01/2016
• Est. Priority Date: 03/15/2007
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Konishi, Masahiro, Agatani, Makoto, Hata, Toshio
• Primary Examiner(s): Hines, Anne
• Application Number:
  US14/245,974
• Publication Number:
  US 20140339594A1
• Time in Patent Office: 942 Days
• US Class Current: 1/1
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 : characterized by the materials

Abstract

By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Claims

1. A light emitting device comprising:

a substrate having a top surface and a bottom surface opposite from the top surface, the substrate including a lighting area and a peripheral area surrounding the lighting area in the top surface of said substrate;

a positive electrode land exposed for external connection on the top surface and a negative electrode land exposed for external connection on the top surface, said positive and negative electrode lands being provided on the peripheral area of said substrate;

wiring patterns including a cathode wiring pattern and an anode wiring pattern disposed on the top surface of said substrate and connected to said positive and negative electrode lands, respectively;

a light emitting unit formed on the lighting area of said substrate, including a plurality of light emitting elements electrically connected between the cathode and anode wiring patterns, and a sealing member for sealing and continuously covering the plurality of light emitting elements, the sealing member being located within the lighting area; and

a positive polarity symbol provided on the top surface in the peripheral area and adjacent to said positive electrode land,

wherein the positive electrode land and the negative electrode land are disposed on the peripheral area of the top surface so that the positive and negative electrode lands do not extend over an edge of the substrate,

the positive electrode land and the negative electrode land are disposed on the peripheral area of the top surface opposite to each other so as to have the light emitting unit between the lands such that the lands do not overlap the light emitting unit,

a first lead-out wiring pattern is disposed between the positive electrode land and the anode wiring pattern, and

a second lead-out wiring pattern is disposed between the negative electrode land and the cathode wiring pattern.

2. The light emitting device of claim 1, further comprising a negative polarity symbol provided on the peripheral area in the top surface of said substrate and adjacent to said negative electrode land.

3. The light emitting device of claim 1, wherein the sealing member is composed of a light-transmitting resin.

4. The light emitting device of claim 3, wherein the sealing member contains a fluorescent material.

5. The light emitting device of claim 3, wherein the light-transmitting resin is a silicone resin.

6. The light emitting device of claim 1, wherein a through hole penetrating the substrate is formed in the peripheral area.

7. The light emitting device of claim 1, wherein the substrate is shaped as one of a hexagon, a rectangle and a square.

8. The light emitting device of claim 1, wherein the substrate has a thickness of about 1 mm.

9. The light emitting device of claim 1, wherein a hole having a cut-out shape and penetrating the substrate is formed in the peripheral area.

10. The light emitting device of claim 1, wherein the positive electrode land is large in width than the first lead-out wiring pattern, and the negative electrode land is large in width than the second lead-out wiring pattern.

11. A light emitting device comprising:

a substrate having a top surface and a bottom surface opposite from the top surface, the substrate including a lighting area and a peripheral area surrounding the lighting area in the top surface of said substrate;

a positive electrode land exposed for external connection on the top surface and a negative electrode land exposed for external connection on the top surface, said positive and negative electrode lands being provided on the peripheral area of said substrate;

wiring patterns including a cathode wiring pattern and an anode wiring pattern disposed on the top surface of said substrate and connected to said positive and negative electrode lands, respectively;

a light emitting unit formed on the lighting area of said substrate, including a plurality of light emitting elements electrically connected between the cathode and anode wiring patterns, and a sealing member for sealing and continuously covering the plurality of light emitting elements, the sealing member being located within the lighting area; and

a negative polarity symbol provided on the top surface in the peripheral area and adjacent to said negative electrode land,

wherein the positive electrode land and the negative electrode land are disposed on the peripheral area of the top surface so that the positive and negative electrode lands do not extend over an edge of the substrate,

the positive electrode land and the negative electrode land are disposed on the peripheral area of the top surface opposite to each other so as to have the light emitting unit between the lands such that the lands do not overlap the light emitting unit,

a first lead-out wiring pattern is disposed between the positive electrode land and the anode wiring pattern, and

a second lead-out wiring pattern is disposed between the negative electrode land and the cathode wiring pattern.

12. The light emitting device of claim 11, wherein the sealing member is composed of a light-transmitting resin.

13. The light emitting device of claim 12, wherein the sealing member contains a fluorescent material.

14. The light emitting device of claim 12, wherein the light-transmitting resin is a silicone resin.

15. The light emitting device of claim 11, wherein a through hole penetrating the substrate is formed in the peripheral area.

16. The light emitting device of claim 11, wherein the substrate is shaped as one of a hexagon, a rectangle and a square.

17. The light emitting device of claim 11, wherein the substrate has a thickness of about 1 mm.

18. The light emitting device of claim 11, wherein a hole having a cut-out shape and penetrating the substrate is formed in the peripheral area.

19. The light emitting device of claim 11, wherein the positive electrode land is large in width than the first lead-out wiring pattern, and the negative electrode land is large in width than the second lead-out wiring pattern.