Contact element for connecting to a circuit board, contact system and method
First Claim
1. A contact element (8, 9, 40) for connecting to a circuit board (3) having at least one substrate layer (4, 4a) and having at least one electrically conductive layer (5, 6, 7) which is connected to the substrate layer (4, 4a), the contact element (8, 9, 40) being configured to connect to the electrically conductive layer (5, 6, 7), characterized in that the contact element (8, 9, 40) is configured to be pushed onto a circuit board edge of the circuit board (3) and to reach over the circuit board edge, wherein the contact element (8, 9, 40) has at least one cutting blade with a cutting edge (10, 12, 42, 44, 61), the cutting edge (10, 12, 42, 44, 61) having a harder metal in an area of a severing section (23, 24, 46, 48, 67) than in an adjoining contact section (21, 22, 44, 45, 62) alongside the cutting edge (10, 12, 42, 44, 61), and said cutting edge (10, 12, 42, 44, 61) being configured to cut through the substrate layer (4, 4a) with the severing section (23, 24, 46, 48, 67) when pushed onto the circuit board edge and to contact the electrically conductive layer (5, 6, 7) electrically with the contact section (21, 22, 44, 45, 62).
1 Assignment
0 Petitions
Accused Products
Abstract
The invention relates to a contact element for connecting to a circuit board. The circuit board has at least one substrate layer, particularly an electrically insulating substrate layer. The circuit board also has at least one electrically conductive layer. The contact element is designed for connecting to the electrically conductive layer. According to the invention, the contact element is designed to be pushed onto a circuit board edge of the circuit board. The contact element is designed to reach over the circuit board edge and has at least one cutting blade with a cutting edge, the cutting edge having a harder metal in the area of a severing section than in an adjoining contact section alongside the cutting edge. The cutting edge is designed to cut through the substrate layer with the severing section when pushed onto the circuit board edge and to contact the electrically conductive layer electrically with the contact section.
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Citations
18 Claims
- 1. A contact element (8, 9, 40) for connecting to a circuit board (3) having at least one substrate layer (4, 4a) and having at least one electrically conductive layer (5, 6, 7) which is connected to the substrate layer (4, 4a), the contact element (8, 9, 40) being configured to connect to the electrically conductive layer (5, 6, 7), characterized in that the contact element (8, 9, 40) is configured to be pushed onto a circuit board edge of the circuit board (3) and to reach over the circuit board edge, wherein the contact element (8, 9, 40) has at least one cutting blade with a cutting edge (10, 12, 42, 44, 61), the cutting edge (10, 12, 42, 44, 61) having a harder metal in an area of a severing section (23, 24, 46, 48, 67) than in an adjoining contact section (21, 22, 44, 45, 62) alongside the cutting edge (10, 12, 42, 44, 61), and said cutting edge (10, 12, 42, 44, 61) being configured to cut through the substrate layer (4, 4a) with the severing section (23, 24, 46, 48, 67) when pushed onto the circuit board edge and to contact the electrically conductive layer (5, 6, 7) electrically with the contact section (21, 22, 44, 45, 62).
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9. A method for connecting a circuit board (3) to a contact element (8, 9, 40), the method comprising:
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providing the circuit board (3) having a circuit board edge, wherein the circuit board (3) has at least one electrically conductive layer (5, 6, 7) and at least one electrically insulating substrate layer (4, 4a) connected to the electrically conductive layer (5, 6, 7); providing the contact element (8, 9, 40), wherein the contact element (8, 9, 40) has at least one cutting blade with a cutting edge (10, 12, 42, 44, 61), the cutting edge (10, 12, 42, 44, 61) having a harder metal in an area of a severing section (23, 24, 46, 48, 67) than in an adjoining contact section (21, 22, 44, 45, 62) alongside the cutting edge (10, 12, 42, 44, 61); severing the substrate layer (4, 4a) with the cutting edge (10, 12, 42, 44, 61) when the contact element (8, 9, 40) is pushed onto the circuit board edge; and electrically contacting the electrically conductive layer (5, 6, 7), in the area of the severed substrate layer (4, 4a), when the contact element (8, 9, 40) is pushed onto a circuit board edge of the circuit board (3). - View Dependent Claims (10)
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Specification