Acoustic wave band reject filter

• US 9,484,887 B2
• Filed: 12/26/2012
• Issued: 11/01/2016
• Est. Priority Date: 11/28/2012
• Status: Active Grant

• Current Assignee: Telefonaktiebolaget LM Ericsson
• Original Assignee: Telefonaktiebolaget LM Ericsson
• Inventors: Jian, Chunyun, Sychaleun, Somsack
• Primary Examiner(s): Summons, Barbara
• Assistant Examiner(s): Salazar, Jr., Jorge
• Application Number:
  US13/726,668
• Publication Number:
  US 20140145799A1
• Time in Patent Office: 1,406 Days
• Field of Search: 333/133, 333/186, 333/187, 333193-195
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H03H 2009/0019 Surface acoustic wave multichip
• CPC Class Codes: H03H 3/02 for the manufacture of piezoelectric or electrostrictive resonators or networks H03H3/08 takes precedence
• CPC Class Codes: H03H 3/08 for the manufacture of resonators or networks using surface acoustic waves
• CPC Class Codes: H03H 9/0514 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/0542 consisting of a lateral arrangement H03H9/0566 takes precedence
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/08 Holders with means for regulating temperature
• CPC Class Codes: H03H 9/542 including passive elements H03H9/545 takes precedence
• CPC Class Codes: H03H 9/547 Notch filters, e.g. notch BAW or thin film resonator filters
• CPC Class Codes: H03H 9/605 consisting of a ladder configuration
• CPC Class Codes: H03H 9/6409 SAW notch filters
• CPC Class Codes: H03H 9/6423 Means for obtaining a particular transfer characteristic
• CPC Class Codes: H03H 9/6426 Combinations of the characteristics of different transducers
• CPC Class Codes: H03H 9/6483 Ladder SAW filters
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to positions on each of the die.

Claims

1. An acoustic wave band reject filter, comprising:

a substrate, the substrate including bonding pads formed on the substrate;

a plurality of dies positioned physically parallel to the substrate, each die having a side facing the substrate;

a plurality of acoustic wave band reject filter blocks, at least one of the plurality of acoustic wave band reject filter blocks being fixed on a corresponding die of the plurality of dies, the at least one acoustic wave band reject filter block being fixed on the side of the corresponding die facing the substrate, each of the plurality of acoustic wave band reject filter blocks having adjacent stop band frequency responses that substantially overlap only in transition regions;

solder balls positioned to engage a corresponding bonding pad on the substrate, at least one of the bonding pads electrically connecting adjacent dies via the solder balls; and

the plurality of acoustic wave band reject filter blocks collectively exhibiting a band reject filter frequency response.

2. The acoustic wave band reject filter of claim 1, wherein an acoustic wave band reject filter block of the plurality of acoustic wave band reject filter blocks is arranged as one of a series-parallel electrical configuration and a parallel-series electrical configuration.

3. The acoustic wave band reject filter of claim 1, wherein an acoustic wave band reject filter block of the plurality of acoustic wave band reject filter blocks is one of a surface acoustic wave filter, a bulk acoustic wave filter, and a film bulk acoustic resonator.

4. The acoustic wave band reject filter of claim 1, further comprising an inductor external to the substrate, wherein at least one bonding pad electrically connects the external inductor to one of the plurality of dies without bonding wires.

5. The acoustic wave band reject filter of claim 4, wherein the external inductor is electrically connected to a bonding pad positioned between dies.

6. The acoustic wave band reject filter of claim 1, wherein each of the dies have a width and a length, and the largest of the width and the length of a die is less than 3 millimeters.

7. A method for constructing an acoustic wave band reject filter, the method comprising:

forming bonding pads on a substrate;

providing a plurality of dies, each die having a side that faces the substrate, each die having a length and a width, a largest one of the length and width being less than about 3 millimeters to reduce thermal mismatch between each of the dies and the substrate;

forming solder balls on one of the substrate and each of the plurality of dies on the sides of the dies facing the substrate;

mounting an acoustic wave band reject filter block on each one of the plurality of dies on the side of the die facing the substrate, the acoustic wave band reject filter blocks having adjacent stop band frequency responses that substantially overlap only in transition regions; and

positioning the plurality of dies on the substrate such that the solder balls electrically connect bonding pads of the substrate, at least one of the bonding pads electrically connecting adjacent dies via the solder balls.

8. The method of claim 7, wherein the acoustic wave band reject filter blocks are cascaded.

9. The method of claim 8, further comprising providing bus bars on the substrate, the bus bars electrically connecting adjacent cascaded acoustic wave band reject filter blocks.

10. The method of claim 7, further comprising providing an inductor external to the substrate, wherein at least one bonding pad electrically connects to the external inductor.

11. The method of claim 10, wherein the at least one bonding pad electrically connects to the external inductor via a bonding wire.

12. The method of claim 7, wherein the acoustic wave band reject filter blocks comprise two electrically series-parallel band reject filter blocks separated by an electrically parallel-series band reject filter block.

13. The method of claim 7, wherein the acoustic wave band reject filter blocks comprise two electrically parallel-series band reject filter blocks separated by an electrically series-parallel band reject filter block.

14. An acoustic wave band reject filter, comprising:

a substrate having bonding pads thereon;

a first die and a second die, each of the first die and the second die having a side that faces the substrate;

a plurality of solder balls, the solder balls positioned to electrically connect bonding pads of the substrate to positions on the first and second die;

a first acoustic wave band reject filter circuit formed on the first die;

a second acoustic wave band reject filter circuit formed on the second die, the first and second acoustic wave band reject filter circuits having adjacent stop band frequency responses that substantially overlap only in transition regions; and

a first bus bar formed on the substrate and configured to electrically connect the first acoustic wave band reject filter circuit to the second acoustic wave band reject filter circuit via the solder balls.

15. The acoustic wave band reject filter of claim 14, further comprising:

a third die having a side facing the substrate;

a plurality of solder balls positioned to electrically connect bonding pads of the substrate to positions on the third die;

a third acoustic wave band reject filter circuit formed on the third die; and

a second bus bar formed on the substrate and configured to electrically connect the second acoustic wave band reject filter circuit to the third acoustic wave band reject filter circuit via the solder balls.

16. The acoustic wave band reject filter of claim 15, wherein the first die, the second die and the third die each have a corresponding width and a corresponding length, the largest one of the width and the length being less than 3 millimeters.

17. The acoustic wave band reject filter of claim 14, wherein the first acoustic wave band reject filter circuit and the second acoustic wave band reject filter circuit are electrically series-parallel band reject filters.