Inter-stage test structure for wireless communication apparatus

• US 9,485,671 B2
• Filed: 02/27/2014
• Issued: 11/01/2016
• Est. Priority Date: 02/27/2014
• Status: Active Grant

• Current Assignee: Azurewave Technologies, Inc.
• Original Assignee: Azurewave Technologies, Inc.
• Inventors: Chien, Huang-Chan
• Primary Examiner(s): Hollington, Jermele M
• Assistant Examiner(s): McAndrew, Christopher
• Application Number:
  US14/192,561
• Publication Number:
  US 20150241496A1
• Time in Patent Office: 978 Days
• Field of Search: 324/754.03
• US Class Current: 1/1
• CPC Class Codes: G01R 1/067 Measuring probes
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 1/073 Multiple probes
• CPC Class Codes: G01R 31/2601 Apparatus or methods therefor G01R31/2607, G01R31/2642 take precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H04W 24/02 Arrangements for optimising operational condition

Abstract

An inter-stage test structure for a wireless communication apparatus is provided. The wireless communication apparatus has a unit under test (UUT) and a next-stage component connected to the UUT through a signal wire. The inter-stage test structure is disposed on the signal wire and electrically connects the UUT to the next-stage unit component. The inter-stage test structure includes an upper board, a lower board, and an intermediate layer. The intermediate layer is disposed between the upper board and the lower board. The intermediate layer includes a first region and a second region defined thereon. The first region has an air cavity for generating an air impedance. The second region has an impedance adjusting cavity for generating an adjustable impedance. Accordingly, the inter-stage test structure can detect the condition of the UUT of the wireless communication apparatus based on the air impedance and the adjustable impedance.

Claims

1. An inter-stage test structure for a wireless communication apparatus, the wireless communication apparatus having a unit under test (UUT), a first ground wire, a signal wire, a second ground wire, and a next-stage component, the UUT electrically connected to the next-stage component through the first ground wire, the signal wire, and the second ground wire, respectively, the inter-stage test structure comprising:

an upper board;

a lower board having a first ground pad, a first signal pad, and a second ground pad disposed thereon, the first ground pad electrically connected a first ground terminal of the UUT to a first ground terminal of the next-stage component through the first ground wire, the first signal pad electrically connected to a signal terminal of the UUT and a signal terminal of the next-stage component through the signal wire, and the second ground pad electrically connected a second ground terminal of the UUT and a second ground terminal of the next-stage component; and

an intermediate layer disposed between the upper board and the lower board, the intermediate layer having a first region and a second region defined thereon, the first region being in adjacent to the second region;

wherein the first region has an air cavity formed between the intermediate layer and the lower board, and air inside the air cavity generates an air impedance;

wherein, the second region has an impedance adjusting cavity formed between the intermediate layer and the lower board, and the impedance adjusting cavity comprises of a conductive paste, a ground plate, a substrate layer, and a metal plate;

wherein the conductive paste being disposed on the lower board is configured to electrically connect the first ground pad to the second ground pad and the ground plate, the conductive paste has the ground plate, the substrate layer, and the metal plate sequentially disposed thereon, and the substrate layer has a predefined thickness for generating an adjustable impedance;

wherein the upper board has a third ground pad, a second signal pad, and a fourth ground pad disposed thereon, and the intermediate layer further has a first through-hole, a signal through-hole, and a second through-hole, wherein the third ground pad is disposed opposite to the first ground pad, the second signal pad is disposed opposite to the first board signal pad, and the fourth ground pad is disposed opposite to the second ground pad;

wherein the inter-stage test structure further comprises a first conductor, a signal conductor, and a second conductor, the first conductor is disposed in the first through-hole to electrically connect the third ground pad to the first ground pad, the signal conductor is disposed in the signal through-hole to electrically connect the first signal pad to second signal pad, and the second conductor is disposed in the second through-hole to electrically connect the fourth ground pad to the second ground pad;

wherein the inter-stage test structure further comprises a probing component having a first ground probe, a signal probe, and a second ground probe, the first ground probe electrically connects the third ground pad, the signal probe electrically connects the second signal pad, and the second ground probe electrically connects the fourth ground pad.

2. The inter-stage test structure according to claim 1, wherein the conductive paste is disposed around the second region and not disposed on the first region.

3. The inter-stage test structure according to claim 2, wherein the shape of the ground plate is configured to be the same as the shape of the conductive paste.

4. The inter-stage test structure according to claim 1, wherein the intermediate layer is formed from the first region and the second region and the first region has the same area as the second region.

5. The inter-stage test structure according to claim 1, wherein an equivalent impedance of the inter-stage test structure is determined by the air impedance and the adjustable impedance.

6. The inter-stage test structure according to claim 1, wherein the intermediate layer comprises of insulation material.

7. The inter-stage test structure according to claim 1, wherein the substrate layer comprises glass fiber.