Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink

• US 9,485,884 B2
• Filed: 07/12/2012
• Issued: 11/01/2016
• Est. Priority Date: 07/14/2011
• Status: Active Grant

• Current Assignee: Thomson Licensing (Vantiva SA)
• Original Assignee: Thomson Licensing (Vantiva SA)
• Inventors: Bose, William Hofmann, Hunt, Mickey Jay
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US14/232,486
• Publication Number:
  US 20140198456A1
• Time in Patent Office: 1,573 Days
• Field of Search: 361/679.46, 361/679.54, 361/679.55, 361702-724, 361/752, 165/80.2, 165/80.3, 165/104.33, 165/185, 174/50, 174/50.02, 174/16.1, 174/17.R, 174/252, 257706-727, 257/737, 257/738, 257/778, 296/021, 298/41, 295/921, 298/32
• US Class Current: 1/1
• CPC Class Codes: H05K 7/12 Resilient or clamping means for holding component to structure
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/2049 Pressing means used to urge contact, e.g. springs

Abstract

A hold down for an electronic device is provided that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad. The hold down includes a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down.

Claims

1. A hold down for an electronic device that includes a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, and a heat sink associated with the thermal pad, wherein the hold down comprises:

a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least a bottom frame to provide a biasing force against a surface of the heat sink that retains the heat sink against a circuit board that is positioned between the bottom frame and the hold down.

2. The hold down of claim 1, wherein the heat sink includes a planar portion surrounding a central depression portion and the hold down secures the thermal pad of the circuit board between the central depression portion of the heat sink and the circuit board.

3. The hold down of claim 2, wherein the hold down includes a plurality of wires that cross each other.

4. The hold down of claim 3, wherein the plurality of wires are dimensioned such that the biasing force is applied across a top surface of the heat sink.

5. The hold down of claim 3, wherein the plurality of wires includes central portions that extend downwards along an inner surface of the central depression portion of the heat sink.

6. The hold down of claim 3, wherein the heat sink includes grooves for receiving the wires.

7. The hold down of claim 2, wherein the heat sink has a second central depression portion that contacts a second heat generating component on the circuit board.

8. The hold down of claim 1, wherein

the bottom frame includes vertically extending portions on opposing sides having slots;

and

the heat sink includes vertical extensions having clips that snap into the slots of the bottom frame, thereby securing the heat sink to the bottom frame.

9. The hold down of claim 1, wherein the retainers include U-shaped or V-shaped contours that are received in the mating locations of the bottom frame and the heat sink.

10. The hold down of claim 1, wherein the retainers include a first vertical portion, a lower horizontal portion, and second vertical portion that is received in the mating locations of the bottom frame and the heat sink.

11. The hold down of claim 1, wherein the electronic device is a set top box.

18. The hold down of claim 1, wherein the frame is a separate structure from the heat sink.

12. An electronic device comprising:

a bottom frame,

a circuit board mounted above the bottom frame,

a thermal pad mounted on the circuit board,

a heat sink associated with the thermal pad, and

a hold down for providing a biasing force against a surface of the heat sink that retains the heat sink against the thermal pad,

wherein the hold down comprises;

a frame that defines a perimeter having a plurality of retainers that are configured to engage with a plurality of mating locations defined on at least the bottom frame.

13. The electronic device of claim 12, wherein the heat sink includes a planar portion surrounding a central depression portion and the hold down secures the thermal pad of the circuit board between the central depression portion of the heat sink and the circuit board.

14. The electronic device of claim 13, wherein the hold down includes a plurality of wires that cross each other.

15. The electronic device of claim 14, wherein the plurality of wires are dimensioned such that the biasing force is applied across a top surface of the heat sink.

16. The electronic device of claim 15, wherein the plurality of wires includes central portions that extend downwards along an inner surface of the central depression portion of the heat sink.

17. The electronic device of claim 16, wherein the heat sink includes grooves in the planar portion for receiving the wires.

19. The electronic device of claim 12, wherein the hold down is a separate structure form the heat sink.