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Pressure mapping and orientation sensing system

  • US 9,488,538 B2
  • Filed: 01/31/2013
  • Issued: 11/08/2016
  • Est. Priority Date: 01/31/2012
  • Status: Active Grant
First Claim
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1. A pressure mapping system for measuring and analyzing forces applied to an object over time, the pressure mapping system comprising:

  • a pressure sensor comprising a plurality of electrode pads in an electrode array layer proximate to a pressure sensing material layer of piezo-resistive material, the plurality of electrode pads being formed upon a printed circuit board shaped for one or more exterior surfaces of the object, the plurality of electrode pads measuring forces on the pressure sensing material layer;

    a plurality of multiplexers coupled to the plurality of electrode pads, wherein each electrode pad is coupled to only one multiplexer in the plurality of multiplexers;

    an internal processor in communication with the plurality of multiplexers, the internal processor being configured to obtain measurements of the forces on the pressure sensing material layer from the printed circuit board, identify locations of the forces on the pressure sensing material layer, and transmit the measurements and the locations of the forces on the pressure sensing material layer as data over a network; and

    an external processor configured to receive the data over the network, and analyze the data to generate diagnostic information relating to the measurements and the locations of the forces on the pressure sensing material layer.

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