Pressure mapping and orientation sensing system
First Claim
1. A pressure mapping system for measuring and analyzing forces applied to an object over time, the pressure mapping system comprising:
- a pressure sensor comprising a plurality of electrode pads in an electrode array layer proximate to a pressure sensing material layer of piezo-resistive material, the plurality of electrode pads being formed upon a printed circuit board shaped for one or more exterior surfaces of the object, the plurality of electrode pads measuring forces on the pressure sensing material layer;
a plurality of multiplexers coupled to the plurality of electrode pads, wherein each electrode pad is coupled to only one multiplexer in the plurality of multiplexers;
an internal processor in communication with the plurality of multiplexers, the internal processor being configured to obtain measurements of the forces on the pressure sensing material layer from the printed circuit board, identify locations of the forces on the pressure sensing material layer, and transmit the measurements and the locations of the forces on the pressure sensing material layer as data over a network; and
an external processor configured to receive the data over the network, and analyze the data to generate diagnostic information relating to the measurements and the locations of the forces on the pressure sensing material layer.
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Accused Products
Abstract
This disclosure if directed to an improved pressure, force, and orientation sensing system, which may be applied to various industrial articles or sports equipment, fore remote performance analysis and user interface. Where applied to sports equipment, including a golf club, the sensor array of flexible and resilient piezo-resistive material permits collection of grip force data for an array of positions around and along the golf club grip handle; for the analysis, processing and communication of the data once collected, and a method of providing automated golf instruction using a force sensing golf grip of the present invention. Where applied to improved manufacturing lines and shipping of containers, force sensing packages may be equipped with the sensor arrays disclosed herein. The force sensing package is of similar shape to a standard sized package the ordinary forces on which are being tested and by the sampled force sensing package. Control and display software collects the force sensing data, and possibly other data (including motion and orientation data), and communicates it to analytics and display software remote from the device. The force sensing package is comprised of layers, at least two of the layers of which is a force sensing material and a related electrode array. Shapes disclosed are cylinders (cans), cylinders with conic portions (bottle), and parallelepipeds (boxes).
20 Citations
20 Claims
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1. A pressure mapping system for measuring and analyzing forces applied to an object over time, the pressure mapping system comprising:
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a pressure sensor comprising a plurality of electrode pads in an electrode array layer proximate to a pressure sensing material layer of piezo-resistive material, the plurality of electrode pads being formed upon a printed circuit board shaped for one or more exterior surfaces of the object, the plurality of electrode pads measuring forces on the pressure sensing material layer; a plurality of multiplexers coupled to the plurality of electrode pads, wherein each electrode pad is coupled to only one multiplexer in the plurality of multiplexers; an internal processor in communication with the plurality of multiplexers, the internal processor being configured to obtain measurements of the forces on the pressure sensing material layer from the printed circuit board, identify locations of the forces on the pressure sensing material layer, and transmit the measurements and the locations of the forces on the pressure sensing material layer as data over a network; and an external processor configured to receive the data over the network, and analyze the data to generate diagnostic information relating to the measurements and the locations of the forces on the pressure sensing material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A pressure sensor for use in a pressure mapping system configured to measure forces applied to an object over time, the pressure sensor comprising:
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a plurality of electrode pads in an electrode array layer proximate to a pressure sensing material layer; wherein the plurality of electrode pads are formed upon a flexible printed circuit board shaped for one or more exterior surfaces of the object; wherein the plurality of electrode pads are configured to measure force on the pressure sensing material layer; and wherein the plurality of electrode pads are coupled to a processor via a plurality of multiplexers, wherein each electrode pad is coupled to only one multiplexer in the plurality of multiplexers. - View Dependent Claims (19, 20)
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Specification