Probe card having a wiring substrate

• US 9,488,677 B2
• Filed: 10/28/2013
• Issued: 11/08/2016
• Est. Priority Date: 11/05/2012
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Fukasawa, Ryo, Horiuchi, Michio, Tokutake, Yasue, Matsuda, Yuichi, Aizawa, Mitsuhiro
• Primary Examiner(s): Hollington, Jermele M
• Assistant Examiner(s): Yodichkas, Khristopher
• Application Number:
  US14/064,608
• Publication Number:
  US 20140125372A1
• Time in Patent Office: 1,107 Days
• Field of Search: 324/756.03
• US Class Current: 1/1
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A probe card includes a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on the periphery of the opening portion, a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity, a contact terminal arranged to protrude from the lower face of the resin portion, and wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire.

Claims

1. A probe card, comprising:

a wiring substrate including an insulating layer and a wiring layer formed on the insulating layer;

an opening portion penetrating the insulating layer and the wiring layer of the wiring substrate in a thickness direction, the opening portion having a quadrangle shape in a plan view, wherein four side faces of the opening portion are formed in a stepped shape and have stepped faces;

a connection pad arranged on the stepped faces of the side faces of the opening portion, the connection pad exposed from an inner face of the opening portion, the connection pad connected to one of the wiring layer;

a resin portion formed in the opening portion of the wiring substrate, the resin portion formed of a material having elasticity, the resin portion burying the connection pad;

a contact terminal arranged to protrude downward from a lower face of the resin portion in a state that a whole of a side face of the contact terminal is exposed from the resin portion, wherein a contact face of the contact terminal is a concave curved face; and

a wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal and the wire are formed of the same metal, and a diameter of the contact terminal is larger than a diameter of the wire, and a connection part with the wire in one edge side of the contact terminal is buried in the resin portion, and the other edge side of the contact terminal is exposed from the resin layer.

2. The probe card according to claim 1, wherein the resin portion protrudes from a lower face of the wiring substrate.

3. The probe card according to claim 1, wherein the wire is a coaxial-type wire in which a resin layer and a metal layer are covered on an outer face of a metal wire.

4. The probe card according to claim 1, wherein a contact face of a tip of the contact terminal is formed as a flat face.

5. A probe card, comprising:

a wiring substrate including an insulating layer and a wiring layer formed on the insulating layer;

an opening portion penetrating the insulating layer and the wiring layer of the wiring substrate in a thickness direction;

a connection pad arranged on an upper face of the wiring substrate located on a periphery of the opening portion, the connection pad exposed from an inner face of the opening portion, the connection pad connected to one of the wiring layer;

a resin portion formed in the opening portion of the wiring substrate, the resin portion formed of a material having elasticity, the resin portion burying the connection pad;

a contact terminal arranged to protrude from a lower face of the resin portion, wherein the contact terminal includes a columnar contact portion protruding from the lower face of the resin portion, and a convex portion wider than the columnar contact portion, the convex portion which is arranged on the columnar contact portion and is buried in the resin portion, and a contact face of a tip of the contact terminal is formed as a flat face; and

a wire buried in the resin portion and connecting the contact terminal and the connection pad,

wherein the contact terminal and the wire are formed of the same metal, and a diameter of the contact terminal is larger than a diameter of the wire, and a connection part with the wire in one edge side of the contact terminal is buried in the resin portion, and the other edge side of the contact terminal is exposed from the resin layer.

6. A probe card, comprising:

a wiring substrate including an insulating layer and a wiring layer formed on the insulating layer;

an opening portion penetrating the insulating layer and the wiring layer of the wiring substrate in a thickness direction;

a connection pad arranged on an upper face of the wiring substrate located on a periphery of the opening portion, the connection pad exposed from an inner face of the opening portion, the connection pad connected to one of the wiring layer;

a resin portion formed in the opening portion of the wiring substrate, the resin portion formed of a material having elasticity, the resin portion burying the connection pad;

a contact terminal arranged to protrude from a lower face of the resin portion, wherein the contact terminal includes a columnar contact portion protruding from the lower face of the resin portion, and a convex portion wider than the columnar contact portion, the convex portion which is arranged on the columnar contact portion and is buried in the resin portion, and a constricted portion that is recessed inward in an annular part between the contact portion and the convex portion, and a contact face of a tip of the contact terminal is formed as a flat face; and

a wire buried in the resin portion and connecting the contact terminal and the connection pad,

wherein the contact terminal and the wire are formed of the same metal, and a diameter of the contact terminal is larger than a diameter of the wire, and a connection part with the wire in one edge side of the contact terminal is buried in the resin portion, and the other edge side of the contact terminal is exposed from the resin layer.