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Assembly bonding

  • US 9,488,853 B2
  • Filed: 04/03/2015
  • Issued: 11/08/2016
  • Est. Priority Date: 09/26/2012
  • Status: Active Grant
First Claim
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1. A method for manufacturing a device having an integrated circuit, comprising:

  • creating a plurality of chip contact pads on a chip by forming a first grid of metal lines on a surface of the chip, wherein the chip contact pads correspond to intersection points of the metal lines in the first grid;

    creating a plurality of substrate contact pads on a substrate by forming a second grid of metal lines on a surface of the substrate, wherein the substrate contact pads correspond to intersection points of the metal lines in the second grid and wherein the plurality of substrate contact pads correspond to the plurality of chip contact pads;

    applying assembly bonding material to each of the plurality of substrate contact pads formed on the substrate; and

    bonding the plurality of chip contact pads to the plurality of substrate contact pads via the assembly bonding material to bond the chip to the substrate.

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