Assembly bonding
First Claim
1. A method for manufacturing a device having an integrated circuit, comprising:
- creating a plurality of chip contact pads on a chip by forming a first grid of metal lines on a surface of the chip, wherein the chip contact pads correspond to intersection points of the metal lines in the first grid;
creating a plurality of substrate contact pads on a substrate by forming a second grid of metal lines on a surface of the substrate, wherein the substrate contact pads correspond to intersection points of the metal lines in the second grid and wherein the plurality of substrate contact pads correspond to the plurality of chip contact pads;
applying assembly bonding material to each of the plurality of substrate contact pads formed on the substrate; and
bonding the plurality of chip contact pads to the plurality of substrate contact pads via the assembly bonding material to bond the chip to the substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.
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Citations
20 Claims
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1. A method for manufacturing a device having an integrated circuit, comprising:
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creating a plurality of chip contact pads on a chip by forming a first grid of metal lines on a surface of the chip, wherein the chip contact pads correspond to intersection points of the metal lines in the first grid; creating a plurality of substrate contact pads on a substrate by forming a second grid of metal lines on a surface of the substrate, wherein the substrate contact pads correspond to intersection points of the metal lines in the second grid and wherein the plurality of substrate contact pads correspond to the plurality of chip contact pads; applying assembly bonding material to each of the plurality of substrate contact pads formed on the substrate; and bonding the plurality of chip contact pads to the plurality of substrate contact pads via the assembly bonding material to bond the chip to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A device having an integrated circuit disposed thereon or therein formed by a process comprising:
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creating a plurality of chip contact pads on a chip by forming a first grid of metal lines on a surface of the chip, wherein the chip contact pads correspond to intersection points of the metal lines in the first grid; creating a plurality of substrate contact pads on a substrate by forming a second grid of metal lines on a surface of the substrate, wherein the substrate contact pads correspond to intersection points of the metal lines in the second grid and wherein the plurality of substrate contact pads correspond to the plurality of chip contact pads; applying assembly bonding material to each of the plurality of chip contact pads; and bonding the plurality of the chip contact pads to the plurality of substrate contact pads formed on the substrate via the assembly bonding material to bond the chip to the substrate. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for manufacturing a device having an integrated circuit, comprising:
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creating a plurality of substrate contact pads on a substrate, wherein the plurality of substrate contact pads correspond to intersection points of a grid of metal lines on a surface of the substrate; creating a plurality of chip contact pads on a chip, wherein the plurality of chip contact pads correspond to intersection points of a grid of metal lines on the chip, and wherein the plurality of chip contact pads correspond to the plurality of substrate contact pads; applying assembly bonding material to the each of the plurality of substrate contact pads or chip contact pads, wherein the assembly bonding material includes an anisotropic conductive material; aligning the plurality of substrate contact pads with the plurality of chip contact pads; and bonding the chip to the substrate via the assembly bonding material using flip chip bonding. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification