Solid-state imaging device and manufacturing method thereof, and electronic apparatus

• US 9,490,285 B2
• Filed: 11/18/2011
• Issued: 11/08/2016
• Est. Priority Date: 11/24/2010
• Status: Active Grant

• Current Assignee: Sony Semiconductor Solutions Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Itonaga, Kazuichiroh
• Primary Examiner(s): Payen, Marvin
• Assistant Examiner(s): BARZYKIN, VICTOR V
• Application Number:
  US13/299,951
• Publication Number:
  US 20120147207A1
• Time in Patent Office: 1,817 Days
• Field of Search: 257/415, 257432-434, 257/E21.127, 257/E21.124, 257/E21.499, 438/57, 438/64, 438/66
• US Class Current: 1/1
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A solid-state imaging device includes a supporting substrate that includes a concave portion, a solid-state imaging chip that is bonded on the supporting substrate so as to seal the concave portion in a view-angle region, a stress film that is formed on the surface of the solid-state imaging chip, and an imaging surface curved toward the concave portion at least in the view-angle region.

Claims

1. A manufacturing method of a solid-state imaging device comprising:

forming a plurality of concave portions in a supporting substrate;

forming a stress film on a first surface of a semiconductor wafer which includes a plurality of solid-state imaging portions;

bonding the first surface of the semiconductor wafer on the supporting substrate so as to seal each concave portion in a view-angle region of each of the solid-state imaging portions, each of the view-angle regions being a region in which a light-receiving pixel of the solid-state imaging device is arranged;

curving the view-angle regions of the plurality of solid-state imaging portions to a concave portions side by stress of the stress film in a state where the semiconductor wafer is thinned; and

dividing the semiconductor wafer and the supporting substrate into the plurality of solid-state imaging portions.

2. The manufacturing method of a solid-state imaging device according to claim 1,

wherein the bonding of the semiconductor wafer is performed in a vacuum chamber, and

thereafter, a pressure in the vacuum chamber is made to be in atmospheric pressure, and

the curving of the view-angle regions is performed by both effects of differential pressure between a vacuum in the vacuum chamber and the atmospheric pressure.

3. The manufacturing method of a solid-state imaging device according to claim 1, further comprising:

filling an adhesive agent having shrinkage characteristics into the concave portions of the supporting substrate,

wherein the bonding of the semiconductor wafer on the supporting substrate is performed by bonding between the supporting substrate and the semiconductor wafer and bonding between the adhesive agent and the semiconductor wafer, and

the curving of the view-angle regions is performed by both volumetric shrinkage of the adhesive agent due to a light irradiation and heating.

4. The manufacturing method of a solid-state imaging device according to claim 1, further comprising:

forming the plurality of solid-state imaging portions of the semiconductor wafer in a backside-illumination type,

wherein the stress film is formed as a film having a stress on a surface opposite to a light-incident side of the solid-state imaging portions, and

the curving of the view-angle regions is performed by the stress of the stress film due to the thinning of the semiconductor wafer.

5. The manufacturing method of a solid-state imaging device according to claim 1, further comprising:

forming the plurality of solid-state imaging portions of the semiconductor wafer in a frontside-illumination type.

6. A manufacturing method of a solid-state imaging device comprising:

forming a plurality of concave portions in a supporting substrate;

forming a stress film on a first surface of a semiconductor wafer which includes a plurality of solid-state imaging portions, the plurality of solid-state imaging portions of the semiconductor wafer being a frontside-illumination type;

bonding a second surface of the semiconductor wafer on the supporting substrate so as to seal each concave portion in a view-angle region of each of the solid-state imaging portions, each of the view-angle regions being a region in which a light-receiving pixel of the solid-state imaging device is arranged;

curving the view-angle regions of the plurality of solid-state imaging portions to the concave portions side by stress of the stress film in a state where the semiconductor wafer is thinned; and

dividing the semiconductor wafer and the supporting substrate into the plurality of solid-state imaging portions

wherein the bonding of the semiconductor wafer is performed in a vacuum chamber,

thereafter, a pressure in the chamber is made to be in atmospheric pressure, and

the curving of the view-angle regions is performed by both effects of differential pressure between a vacuum and the atmospheric pressure and the stress of the stress film.