Optoelectronic device and method for manufacturing the same

• US 9,490,295 B2
• Filed: 05/19/2015
• Issued: 11/08/2016
• Est. Priority Date: 05/19/2014
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Chen, Chao Hsing, Wang, Jia Kuen, Shen, Chien Fu, Ko, Chun Teng
• Primary Examiner(s): HOANG, QUOC DINH
• Application Number:
  US14/716,262
• Publication Number:
  US 20150333241A1
• Time in Patent Office: 539 Days
• Field of Search: 257/82, 257/98, 257/99
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

An optoelectronic device including a substrate having a first site, a second side opposite to the first side, and an outer boundary; a light emitting unit formed on the first side; a first electrode electrically connected to the light emitting unit; a second electrode electrically connected to the light emitting unit; and a heat dissipation pad formed between the first electrode and the second electrode and electrically insulated from the light emitting unit.

Claims

1. An optoelectronic device, comprising:

a substrate having a first side, a second side opposite to the first side, and a first outer boundary;

a first contact optoelectronic unit formed on the first side of the substrate;

a second contact optoelectronic unit formed on the first side of the substrate;

an optoelectronic unit formed on the first side of the substrate;

a first electrode formed on and electrically connected to the first contact optoelectronic unit;

a second electrode formed on and electrically connected to the second contact optoelectronic unit;

a heat dissipation pad formed between the first electrode and the second electrode, wherein the heat dissipation pad is formed on and electrically insulated from the optoelectronic unit; and

a plurality of conductor arrangement structures electrically connected to the first contact optoelectronic unit, the second contact optoelectronic unit, and the optoelectronic unit to form an array.

2. The optoelectronic device of claim 1, further comprising a plurality of the optoelectronic units formed on the first side of the substrate.

3. The optoelectronic device of claim 2, wherein conductor arrangement structures are separated from one another and one of the conductor arrangement structures is electrically connected with the first contact optoelectronic unit and one of the optoelectronic units adjacent the first contact optoelectronic unit or electrically connected with the second contact optoelectronic unit and one of the optoelectronic units adjacent the second contact optoelectronic unit or electrically connected with two of the adjacent optoelectronic units.

4. The optoelectronic device of claim 2, further comprising a plurality of the heat dissipation pads correspondingly formed on the optoelectronic units wherein a distance between any two of the heat dissipation pads is greater than 100 μ

m.

5. The optoelectronic device of claim 2, further comprising a supporting device formed on the second side of the substrate and covering a side wall of the substrate wherein the heat dissipation pad is formed on the supporting device.

6. The optoelectronic device of claim 5, further comprising a trench formed between two adjacent of the first contact optoelectronic unit, the optoelectronic units, and the second contact optoelectronic unit wherein the heat dissipation pad comprises a first portion formed on the supporting device and a second portion formed on the trench.

7. The optoelectronic device of claim 2, further comprising a third electrode formed on the first electrode and electrically connected therewith, and a fourth electrode formed on the second electrode and electrically connected therewith, wherein an outer boundary of the third electrode or the fourth electrode goes beyond the first outer boundary of the substrate.

8. The optoelectronic device of claim 7, further comprising an optical layer between the third electrode and the first electrode and between the fourth electrode and the second electrode, wherein the optical layer has a second outer boundary and the first outer boundary of the substrate is formed in the second outer boundary.

9. The optoelectronic device of claim 1, wherein the heat dissipation pad has a stacked structure the same as that of the first electrode or the second electrode.

10. The optoelectronic device of claim 1, wherein the substrate is an epitaxial growth substrate or a bearing substrate and/or the substrate comprises a wavelength conversion material.

11. The optoelectronic device of claim 1, wherein each of the first contact optoelectronic unit, the second contact optoelectronic unit, and the optoelectronic unit comprises a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer.

12. The optoelectronic device of claim 11, further comprising a contact layer or a metal reflection layer formed on the second semiconductor layer of one of the first contact optoelectronic unit, the second contact optoelectronic unit, and the optoelectronic unit.

13. The optoelectronic device of claim 11, wherein the second semiconductor layer of the optoelectronic unit has a first surface area, the heat dissipation pad is formed on the second semiconductor layer of the optoelectronic unit and has a second surface area, and a ratio of the second surface area to the first surface area is between 80% and 100%.

14. The optoelectronic device of claim 1, further comprising a carrier plate comprising a first carrier electrode and a second carrier electrode wherein the first carrier electrode and the first electrode are jointed and the second carrier electrode and the second electrode are jointed to form a flip chip structure.

15. The optoelectronic device of claim 1, further comprising a first insulating layer and/or a second insulating layer, wherein the first insulating layer is formed on one of the first contact optoelectronic unit, the second contact optoelectronic unit, and the optoelectronic unit.

16. The optoelectronic device of claim 15, wherein a projection of the heat dissipation pad, vertical to the first side of the substrate, is not formed on the first insulating layer and/or the second insulating layer comprises a flat surface and the heat dissipation pad is formed on the flat surface.

17. The optoelectronic device of claim 15, further comprising a trench formed between the first contact optoelectronic unit and the optoelectronic unit or between the second contact optoelectronic unit and the optoelectronic unit, and portions of the conductor arrangement structures and the first insulating layer stacked disposed in the trench.

18. The optoelectronic device of claim 1, wherein the conductor arrangement structures have a reflectivity of more than 80% for a light emitting from the first contact optoelectronic unit, the second contact optoelectronic unit, or the optoelectronic unit.

19. The optoelectronic device of claim 1, wherein the array is arranged in series.

20. The optoelectronic device of claim 1, further comprising a first extension electrode formed on the first semiconductor layer and electrically connected with the first electrode.