×

Method for fabricating semiconductor device

  • US 9,490,342 B2
  • Filed: 06/16/2011
  • Issued: 11/08/2016
  • Est. Priority Date: 06/16/2011
  • Status: Active Grant
First Claim
Patent Images

1. A method for fabricating a semiconductor device, the method comprising steps of:

  • providing a dummy gate structure having a dummy gate electrode layer;

    removing the dummy gate electrode layer to form an opening in the dummy gate structure, thereby exposing an underlying layer beneath the dummy gate electrode layer;

    performing an ammonium hydroxide treatment process to treat the dummy gate structure; and

    filling a metal material into the opening, wherein the ammonium hydroxide treatment process is performed in an ammonium hydroxide solution at an operating temperature of 60°

    C., wherein the ammonium hydroxide solution is a mixture of ammonium hydroxide and water in a ratio of 1;

    120, whereinat least one-third of the dummy gate electrode layer is removed by a pre-etching process, and at least one half of the dummy gate electrode layer is removed by the ammonium hydroxide treatment process.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×