Method for fabricating semiconductor device
First Claim
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1. A method for fabricating a semiconductor device, the method comprising steps of:
- providing a dummy gate structure having a dummy gate electrode layer;
removing the dummy gate electrode layer to form an opening in the dummy gate structure, thereby exposing an underlying layer beneath the dummy gate electrode layer;
performing an ammonium hydroxide treatment process to treat the dummy gate structure; and
filling a metal material into the opening, wherein the ammonium hydroxide treatment process is performed in an ammonium hydroxide solution at an operating temperature of 60°
C., wherein the ammonium hydroxide solution is a mixture of ammonium hydroxide and water in a ratio of 1;
120, whereinat least one-third of the dummy gate electrode layer is removed by a pre-etching process, and at least one half of the dummy gate electrode layer is removed by the ammonium hydroxide treatment process.
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Abstract
A method for fabricating a semiconductor device includes the following steps. Firstly, a dummy gate structure having a dummy gate electrode layer is provided. Then, the dummy gate electrode layer is removed to form an opening in the dummy gate structure, thereby exposing an underlying layer beneath the dummy gate electrode layer. Then, an ammonium hydroxide treatment process is performed to treat the dummy gate structure. Afterwards, a metal material is filled into the opening.
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Citations
13 Claims
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1. A method for fabricating a semiconductor device, the method comprising steps of:
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providing a dummy gate structure having a dummy gate electrode layer; removing the dummy gate electrode layer to form an opening in the dummy gate structure, thereby exposing an underlying layer beneath the dummy gate electrode layer; performing an ammonium hydroxide treatment process to treat the dummy gate structure; and filling a metal material into the opening, wherein the ammonium hydroxide treatment process is performed in an ammonium hydroxide solution at an operating temperature of 60°
C., wherein the ammonium hydroxide solution is a mixture of ammonium hydroxide and water in a ratio of 1;
120, whereinat least one-third of the dummy gate electrode layer is removed by a pre-etching process, and at least one half of the dummy gate electrode layer is removed by the ammonium hydroxide treatment process. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for fabricating a semiconductor device, the method comprising steps of:
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providing a dummy gate structure having a dummy gate electrode layer; performing a pre-etching process to remove a portion of the dummy gate electrode layer; performing an ammonium hydroxide treatment process to remove the remaining dummy gate electrode layer, thereby forming an opening in the dummy gate structure and exposing an underlying layer beneath the dummy gate electrode layer; and filling a metal material into the opening, wherein the ammonium hydroxide treatment process is performed in an ammonium hydroxide solution at an operating temperature of 60°
C., wherein the ammonium hydroxide solution is a mixture of ammonium hydroxide and water in a ratio of 1;
120 whereinat least one-third of the dummy gate electrode layer is removed by the pre-etching process, and at least one half of the dummy gate electrode layer is removed by the ammonium hydroxide treatment process. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification