Semiconductor device
First Claim
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1. A semiconductor device comprising:
- a first oxide semiconductor film;
a second oxide semiconductor film on and in contact with the first oxide semiconductor film;
a third oxide semiconductor film on and in contact with the second oxide semiconductor film;
a first oxide insulating film and a second oxide insulating film between which the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film are positioned;
a gate electrode overlapping with the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film with the first oxide insulating film interposed therebetween;
a source electrode and a drain electrode each electrically connected to at least one of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film,wherein a difference between a Fermi level and a bottom of a conduction band in the second oxide semiconductor film is smaller than those in the first oxide semiconductor film and the third oxide semiconductor film.
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Abstract
High field-effect mobility is provided for a transistor including an oxide semiconductor. Further, a highly reliable semiconductor device including the transistor is provided. In a bottom-gate transistor including an oxide semiconductor layer, an oxide semiconductor layer functioning as a current path (channel) of the transistor is sandwiched between oxide semiconductor layers having lower carrier densities than the oxide semiconductor layer. In such a structure, the channel is formed away from the interface of the oxide semiconductor stacked layer with an insulating layer in contact with the oxide semiconductor stacked layer, i.e., a buried channel is formed.
148 Citations
60 Claims
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1. A semiconductor device comprising:
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a first oxide semiconductor film; a second oxide semiconductor film on and in contact with the first oxide semiconductor film; a third oxide semiconductor film on and in contact with the second oxide semiconductor film; a first oxide insulating film and a second oxide insulating film between which the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film are positioned; a gate electrode overlapping with the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film with the first oxide insulating film interposed therebetween; a source electrode and a drain electrode each electrically connected to at least one of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film, wherein a difference between a Fermi level and a bottom of a conduction band in the second oxide semiconductor film is smaller than those in the first oxide semiconductor film and the third oxide semiconductor film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 31, 32)
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11. A semiconductor device comprising:
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a first oxide semiconductor film; a second oxide semiconductor film on and in contact with the first oxide semiconductor film; a third oxide semiconductor film on and in contact with the second oxide semiconductor film; a first oxide insulating film and a second oxide insulating film between which the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film are positioned; a first nitride insulating film and a second nitride insulating film between which the first oxide insulating film, the first oxide semiconductor film, the second oxide semiconductor film, the third oxide semiconductor film and the second oxide insulating film are positioned; a gate electrode overlapping with the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film with the first oxide insulating film and the first nitride insulating film interposed therebetween; a source electrode and a drain electrode each electrically connected to at least one of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film, wherein a difference between a Fermi level and a bottom of a conduction band in the second oxide semiconductor film is smaller than those in the first oxide semiconductor film and the third oxide semiconductor film. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 33, 34)
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22. A semiconductor device comprising:
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a gate electrode; a first gate insulating film over the gate electrode; a second gate insulating film over the first gate insulating film; a first oxide semiconductor film on and in contact with the second gate insulating film; a second oxide semiconductor film on and in contact with the first oxide semiconductor film; a third oxide semiconductor film on and in contact with the second oxide semiconductor film; a source electrode and a drain electrode on and in contact with a top surface of the third oxide semiconductor film and in contact with side surfaces of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film; an oxide insulating film on and in contact with the third oxide semiconductor film, the source electrode, and the drain electrode; and a nitride insulating film over the oxide insulating film, wherein a difference between a Fermi level and a bottom of a conduction band in the second oxide semiconductor film is smaller than those in the first oxide semiconductor film and the third oxide semiconductor film. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 35, 36)
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37. A semiconductor device comprising:
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a first oxide semiconductor film; a second oxide semiconductor film on and in contact with the first oxide semiconductor film; a third oxide semiconductor film on and in contact with the second oxide semiconductor film; a first oxide insulating film and a second oxide insulating film between which the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film are positioned; a gate electrode overlapping with the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film with the first oxide insulating film interposed therebetween; a source electrode and a drain electrode each electrically connected to at least one of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film, wherein a difference between a Fermi level and a bottom of a conduction band in the second oxide semiconductor film is smaller than those in the first oxide semiconductor film and the third oxide semiconductor film, and wherein the third oxide semiconductor film is in contact with a side surface of the first oxide semiconductor film and in contact with a side surface and a top surface of the second oxide semiconductor film. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 50, 51)
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49. A semiconductor device comprising:
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a first oxide semiconductor film; a second oxide semiconductor film on and in contact with the first oxide semiconductor film; a third oxide semiconductor film on and in contact with the second oxide semiconductor film; a first oxide insulating film and a second oxide insulating film between which the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film are positioned; a gate electrode overlapping with the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film with the first oxide insulating film interposed therebetween; a source electrode and a drain electrode each electrically connected to at least one of the first oxide semiconductor film, the second oxide semiconductor film, and the third oxide semiconductor film, wherein a difference between a Fermi level and a bottom of a conduction band in the second oxide semiconductor film is smaller than those in the first oxide semiconductor film and the third oxide semiconductor film, and wherein the third oxide semiconductor film is in contact with a side surface and a top surface of the second oxide semiconductor film. - View Dependent Claims (52, 53, 54, 55, 56, 57, 58, 59, 60)
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Specification