MEMS apparatus disposed on assembly lid

• US 9,491,539 B2
• Filed: 07/29/2013
• Issued: 11/08/2016
• Est. Priority Date: 08/01/2012
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Vos, Sandra F., Szczech, John B.
• Primary Examiner(s): Joshi, Sunita
• Application Number:
  US13/953,175
• Publication Number:
  US 20140037115A1
• Time in Patent Office: 1,198 Days
• Field of Search: 381/174, 381/150, 381/355, 381/333, 381/306, 381/388, 381/334, 381/361, 381/365, 381/175, 381/374, 295/94, 296/091, 257/416, 257/704, 257/723, 257/724, 257/731, 257/774, 257/782
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 3/00 Circuits for transducers , loudspeakers or microphones
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A Microelectromechanical system (MEMS) assembly includes a substrate, lid, MEMS device, and at least one wall. The substrate has electrical connection pads and the electrical connection pads are coupled to electrical conductors extending through the substrate. The MEMS device is attached to the lid. The at least one wall is coupled to the lid and the substrate and is formed separately from the lid and has an electrical conduit disposed therein. The electrical conduit is electrically coupled to the electrical conductors on the substrate. The electrical conduit and electrical conductors form an electrical path between the MEMS device and the electrical connection pads.

Claims

1. A Microelectromechanical system (MEMS) assembly comprising,

a base substrate having a first base via extending through the base substrate, wherein the first base via is electrically connected to a first electrical connection pad on the base substrate, wherein the first base via is hollow and has an interior surface that is plated with a first base conductive material and filled with a first base insulating material;

a lid;

a MEMS device attached to the lid and mounted over an acoustic port;

a wall coupled to the lid and the base substrate, wherein the wall includes a first wall portion and a second wall portion opposing each other, and a third wall portion and a fourth wall portion opposing each other, wherein the first, second, third, and fourth wall portions form a cavity within which the MEMS device is disposed;

a first wall via disposed within only the first wall portion of the wall and not through the second wall portion, the third wall portion, or the fourth wall portion, wherein the first wall via is hollow and has an interior surface that is plated with a first wall conductive material and filled with a first wall insulating material, wherein the first wall via is electrically coupled to the first base via.

2. The MEMS assembly of claim 1, further comprising an integrated circuit attached to the lid and electrically connected to the MEMS device.

3. The MEMS assembly of claim 1, wherein at least one of the lid and the base substrate contains multiple layers.

4. The MEMS assembly of claim 1, further comprising:

a second base via within the base substrate, wherein the second base via is electrically connected to a second electrical connection pad on the base substrate, wherein the second base via is hollow and has an interior surface that is plated with a second base conductive material and filled with a second base insulating material;

a second wall via disposed within only the first wall portion of the wall and has an interior surface that is plated with a second wall conductive material and filled with a second wall insulating material, wherein the second wall via is electrically connected to the second base via,

a second electrical connector that connects the second wall via to the second base via and provides a ground.

5. The MEMS assembly of claim 4, wherein the first wall via is substantially aligned with the second wall via.

6. The MEMS assembly of claim 5, wherein a signal processed by the integrated circuit reaches a first electrical connection pad of the base substrate through a first electrical path formed on the lid, the first base via and the first wall via, and the electrical connector.

7. The MEMS assembly of claim 6, wherein a source power voltage is provided to the integrated circuit through a second electrical connection pad of the base substrate, the second base via, the second wall via, the second electrical connection, and a second electrical path formed on the lid.

8. The MEMS assembly of claim 7, wherein the first, second, third, and fourth wall portions are plated and act as a ground.

9. The MEMS assembly of claim 8, wherein the ground is provided to the integrated circuit through the second wall portion and a third electrical path formed on the lid.

10. A surface-mount Microelectromechanical system (MEMS) assembly comprising,

a base substrate having an electrical conductor extending through the base substrate between a first surface of the base substrate and a second surface of the base substrate opposite the first surface;

a surface mount pad disposed on the first surface of the base substrate coupled to the electrical conductor extending through the base substrate;

a cover having an acoustic port extending through the cover;

an acoustic MEMS sensor fastened to the cover over the acoustic port;

a wall disposed between the cover and the second surface of the base substrate wherein the cover, the wall, and the base substrate form a cavity within which the acoustic MEMS sensor is disposed, and wherein at least the wall and the cover are discrete elements,

an electrically conductive via extending through a wall portion between the cover and the base substrate, the wall portion through which the electrically conductive via extends has a width greater than a width of wall portions devoid of the electrically conductive via,

the electrically conductive via electrically coupled to the electrical conductor of the base substrate and to an electrical conductor at the cover; and

the electrically conductive via having a hollow portion plated with a conductive material, an insulating material disposed in the hollow portion of the electrically conductive via.

11. The MEMS assembly of claim 10, the wall comprises multiple sides formed as a unitary member, the wall portion through which the electrically conductive via extends is a single side of the wall, the single side of the wall through which the electrically conductive via extends having a width greater than a width of the sides of the wall devoid of the electrically conductive via.

12. The MEMS assembly of claim 11,

the base substrate having multiple electrical conductors extending through the base substrate between the first surface and the second surface of the base substrate,

multiple electrically conductive vias extending through the wall portion between the cover and the base substrate, the wall portion through which the multiple electrically conductive vias extend having a width greater than a width of wall portions devoid of the multiple electrically conductive vias,

each electrically conductive via electrically coupled to a corresponding electrical conductor of the base substrate and to a corresponding electrical conductor at the cover;

and

each of the electrically conductive vias is hollow, an insulating material disposed in each hollow electrically conductive via.

13. The MEMS assembly of claim 12 further comprising an integrated circuit disposed within the cavity and electrically coupled to the acoustic MEMS sensor, a first electrically conductive via electrically coupled to a power pin of the integrated circuit by a corresponding electrical conductor at the cover, a second electrically conductive via electrically coupled to a ground pin of the integrated circuit by a corresponding electrical conductor at the cover, and a third electrically conductive via electrically coupled to a signal output pin of the integrated circuit by a corresponding electrical conductor at the cover.

14. The MEMS assembly of claim 10, the electrically conductive via comprises conductive plating formed on a surface of a passage through the wall portion.

15. The MEMS assembly of claim 10 further comprising an integrated circuit disposed within the cavity and electrically coupled to the acoustic MEMS sensor, the electrically conductive via electrically coupled to the integrated circuit by the electrical conductor at the cover.

16. The MEMS assembly of claim 10, the cover, the wall and the base substrate each comprise multiple layers, wherein the cover, the wall and the base substrate each have a conductive layer that forms a substantially electrically and magnetically shielded cavity.

17. A Microelectromechanical system (MEMS) assembly comprising,

a base substrate having an electrical conductor extending through the base substrate between a first surface of the base substrate and a second surface of the base substrate opposite the first surface;

a surface mount pad disposed on the first surface of the base substrate coupled to the electrical conductor extending through the base substrate;

a cover;

an acoustic MEMS sensor;

a wall disposed between the cover and the second surface of the base substrate wherein the cover, the wall, and the base substrate form a cavity within which the acoustic MEMS sensor is disposed, and wherein at least the wall and the cover are discrete elements,

an electrically conductive via extending through a wall portion between the cover and the base substrate, the wall portion through which the electrically conductive via extends has a width greater than a width of wall portions devoid of the electrically conductive via,

the electrically conductive via electrically coupled to the electrical conductor of the base substrate and to an electrical conductor at the cover; and

the electrically conductive via having a hollow portion plated with a conductive material, an insulating material disposed in the hollow portion of the electrically conductive via.