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MEMS apparatus disposed on assembly lid

  • US 9,491,539 B2
  • Filed: 07/29/2013
  • Issued: 11/08/2016
  • Est. Priority Date: 08/01/2012
  • Status: Active Grant
First Claim
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1. A Microelectromechanical system (MEMS) assembly comprising,a base substrate having a first base via extending through the base substrate, wherein the first base via is electrically connected to a first electrical connection pad on the base substrate, wherein the first base via is hollow and has an interior surface that is plated with a first base conductive material and filled with a first base insulating material;

  • a lid;

    a MEMS device attached to the lid and mounted over an acoustic port;

    a wall coupled to the lid and the base substrate, wherein the wall includes a first wall portion and a second wall portion opposing each other, and a third wall portion and a fourth wall portion opposing each other, wherein the first, second, third, and fourth wall portions form a cavity within which the MEMS device is disposed;

    a first wall via disposed within only the first wall portion of the wall and not through the second wall portion, the third wall portion, or the fourth wall portion, wherein the first wall via is hollow and has an interior surface that is plated with a first wall conductive material and filled with a first wall insulating material, wherein the first wall via is electrically coupled to the first base via.

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