Sensing module for orthopedic load sensing insert device

• US 9,492,119 B2
• Filed: 06/29/2010
• Issued: 11/15/2016
• Est. Priority Date: 06/30/2009
• Status: Active Grant

• Current Assignee: Howmedica Osteonics Corp. (Stryker Corporation)
• Original Assignee: OrthoSensor, Inc (Stryker Corporation)
• Inventors: Stein, Marc, Roche, Martin
• Primary Examiner(s): Le, Long V
• Assistant Examiner(s): IMPINK, BRADLEY GERALD
• Application Number:
  US12/826,363
• Publication Number:
  US 20100331683A1
• Time in Patent Office: 2,331 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: A61B 5/4509 Bone density determination
• CPC Class Codes: A61B 5/4528 Joints A61B5/4533, A61B5/4538 take precedence
• CPC Class Codes: A61B 5/6846 specially adapted to be brought in contact with an internal body part, i.e. invasive
• CPC Class Codes: A61B 5/6878 Bone
• CPC Class Codes: A61B 5/7239 using differentiation including higher order derivatives
• CPC Class Codes: A61B 8/15 Transmission-tomography

Abstract

A sensing insert device (100) is disclosed for measuring a parameter of the muscular-skeletal system. The sensing insert device (100) can be temporary or permanent. The sensing module (200) is a self-contained encapsulated measurement device having at least one contacting surface that couples to the muscular-skeletal system. The sensing module (200) comprises one or more sensing assemblages (2302), electronic circuitry (307), an antenna (2302), and communication circuitry (320). The sensing assemblages (2302) are between a top plate (1502) and a bottom plate (1504) in a sensing platform (121). The bottom plate (1504) is supported by a ledge (1708) on an interior surface of a sidewall (1716) of a housing (1706). A cap (1702) couples to top plate (1502). The sensing assemblage (2302) includes one of a piezo-resistive sensor, MEMS sensor, strain gauge, or mechanical sensor when a force, pressure, or load is applied to the top plate (1502).

Claims

1. A sensing module for measuring a load applied by the muscular-skeletal system comprising:

an encapsulating enclosure having a load-bearing surface;

a first load sensor coupled to a first portion of the load-bearing surface of the encapsulating enclosure wherein the first load sensor has a planar surface;

a second load sensor coupled to a second portion of the load-bearing surface of the encapsulating enclosure;

a third load sensor coupled to a third portion of the load bearing surface of the encapsulating enclosure;

a first load disk coupled between the encapsulating enclosure and the planar surface of the first load sensor wherein a load applied to the first portion of the load-bearing surface is distributed approximately perpendicular to the planar surface of the first load sensor by the first load disk to prevent inelastic deformation of the first load sensor, and wherein the first load disk is non-compressible;

electronic circuitry coupled to the at least three sensors wherein the electronic circuitry and the first, second, and third load sensors are housed in the encapsulating enclosure and wherein the electronic circuitry is configured to control a measurement process, receive measurement data, and transmit the measurement data.

2. The sensing module of claim 1 where the electronic circuitry further comprises an accelerometer configured to monitor position of the sensing module and wherein the first load disk is rigid.

3. The sensing module of claim 2 further including:

a second load disk coupled between the load-bearing surface of the encapsulating enclosure and the second sensor; and

a third load disk coupled between the load-bearing surface of the encapsulating enclosure and the third sensor wherein the first, second, and third load disks couple to different regions of the load-bearing surface of the encapsulating enclosure.

4. The sensing module of claim 2 where the encapsulating enclosure is a prosthetic component.

5. The sensing module of claim 2 wherein the load disk comprises steel.

6. A sensing module for measuring a load applied by the muscular-skeletal system comprising:

an encapsulating enclosure having a first major surface and a second major surface;

a first load disk wherein the first load disk is non-compressible;

a first load sensor wherein the first load disk is coupled between the first major surface of the encapsulating enclosure and the first load sensor, wherein the first load sensor has a planar surface and wherein an area of a surface of the first load disk is equal to or greater than the planar surface of the first load sensor, wherein the first load disk is configured to distribute loading approximately evenly across the planar surface of the load sensor to prevent inelastic deformation of the first load sensor; and

electronic circuitry coupled to the at least one sensor within the encapsulating enclosure configured to transmit measurement data.

7. The sensing module of claim 6 wherein the load disk comprises steel.

8. The sensing module of claim 6 further including a second load sensor, and a third load sensor wherein the first, second, and third load sensors couple to a different location of the first major surface of the encapsulating enclosure, wherein a second load disk couples between the first major surface of the encapsulating enclosure and the second load sensor, and wherein a third load disk couples between the first maior surface of the encapsulating enclosure and the third load sensor.

9. The sensing module of claim 6 wherein a load is applied substantially perpendicular from the planar surface of the first load disk to the maior surface of the first load sensor.

10. The sensing module of claim 6 wherein the first load disk and the first load sensor couples between the first and second major surfaces of the encapsulating enclosure.

11. The sensing module of claim 6 where the encapsulating enclosure is a prosthetic component.

12. The sensing module of claim 6 wherein a portion of the load applied to the first major surface is applied directly to the first load sensor.