Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
First Claim
1. A method of manufacturing a hermetically sealed feedthrough, comprising the steps of:
- a) forming a dielectric substrate comprising at least 96 percent alumina;
b) forming at least one via hole extending through the dielectric substrate;
c) filling the at least one via hole with a conductive fill, the conductive fill including a platinum powder and an inactive organic binder, solvent or plasticizer;
d) placing the dielectric substrate and conductive fill into an air filled heating chamber;
e) heating the dielectric substrate and conductive fill to a temperature of from about 400°
C. to 700°
C. and holding that temperature for a period of time that is sufficient for the inactive organic binder, solvent and plasticizer to be substantially baked out of the platinum fill;
f) heating the dielectric substrate and platinum fill to a temperature of about 1,400°
C. to about 1,900°
C. and holding that temperature for a period of time sufficient for the conductive fill to hermetically seal to the dielectric substrate forming a monolithic structure; and
g) cooling the heating chamber.
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Accused Products
Abstract
A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
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Citations
16 Claims
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1. A method of manufacturing a hermetically sealed feedthrough, comprising the steps of:
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a) forming a dielectric substrate comprising at least 96 percent alumina; b) forming at least one via hole extending through the dielectric substrate; c) filling the at least one via hole with a conductive fill, the conductive fill including a platinum powder and an inactive organic binder, solvent or plasticizer; d) placing the dielectric substrate and conductive fill into an air filled heating chamber; e) heating the dielectric substrate and conductive fill to a temperature of from about 400°
C. to 700°
C. and holding that temperature for a period of time that is sufficient for the inactive organic binder, solvent and plasticizer to be substantially baked out of the platinum fill;f) heating the dielectric substrate and platinum fill to a temperature of about 1,400°
C. to about 1,900°
C. and holding that temperature for a period of time sufficient for the conductive fill to hermetically seal to the dielectric substrate forming a monolithic structure; andg) cooling the heating chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification