Nanoparticulate encapsulation barrier stack
First Claim
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1. An encapsulation barrier stack for encapsulating at least one of a moisture and oxygen sensitive article, comprising:
- a multilayer film to be arranged on a substrate, the multilayer film having at least one barrier layer having at least one of low moisture and low oxygen permeability, andat least one sealing layer arranged to be in contact with a surface of the at least one barrier layer, for plugging at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein the nanoparticles have different at least one of shapes and sizes for controlling the sealing and plugging of the at least one defect, wherein the barrier layer comprises a material selected from indium tin oxide (ITO), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5, and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less.
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Abstract
A barrier stack for encapsulating a moisture and/or oxygen sensitive electronic device is provided. The barrier stack comprises a multilayer film having at least one barrier layer having low moisture and/or oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the barrier layer, wherein the sealing material comprises reactive nanoparticles capable of interacting with moisture and/or oxygen, thereby retarding the permeation of moisture and/or oxygen through defects present in the barrier layer.
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Citations
42 Claims
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1. An encapsulation barrier stack for encapsulating at least one of a moisture and oxygen sensitive article, comprising:
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a multilayer film to be arranged on a substrate, the multilayer film having at least one barrier layer having at least one of low moisture and low oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the at least one barrier layer, for plugging at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein the nanoparticles have different at least one of shapes and sizes for controlling the sealing and plugging of the at least one defect, wherein the barrier layer comprises a material selected from indium tin oxide (ITO), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5, and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. An electronic device comprising:
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an active component that is sensitive to at least one of moisture and oxygen, the active component being arranged within an encapsulation barrier stack for encapsulating at least one of a moisture and oxygen sensitive article, the encapsulation barrier stack comprising; a multilayer film to be arranged on a substrate, the multilayer film having at least one barrier layer having at least one of low moisture and low oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the at least one barrier layer, for plugging at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein the nanoparticles have different at least one of shapes and sizes for controlling the sealing and plugging of the at least one defect, wherein the barrier layer comprises a material selected from indium tin oxide (ITO), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5, and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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29. A method to manufacture an encapsulation barrier stack, comprising:
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forming at least one barrier layer; and forming at least one sealing layer on a surface of the at least one barrier layer, wherein forming the at least one sealing layer comprises conformal deposition of the at least one sealing layer over the at least one barrier layer under vacuum or in an inert gas environment, wherein the encapsulation barrier stack is for encapsulating at least one of a moisture and oxygen sensitive article, the at least one barrier layer having at least one of low moisture and low oxygen permeability, wherein the at least one sealing layer is arranged to be in contact with the surface of the at least one barrier layer to plug at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer and wherein the nanoparticles have different at least one of shapes and sizes for controlling the sealing and plugging of the at least one defect, wherein the barrier layer comprises a material selected from indium tin oxide (ITO), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5 and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less. - View Dependent Claims (30, 31, 32, 33, 34)
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35. An encapsulation barrier stack for encapsulating at least one of a moisture and oxygen sensitive article, comprising:
- a multilayer film to be arranged on a substrate, the multilayer film comprising at least one barrier layer having at least one of low moisture and low oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the at least one barrier layer to plug at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein the sealing layer is formed by conformal deposition, wherein the conformal deposition is selected from the group consisting of chemical vapour deposition, spin coating, screen printing, WebFlight method, tip coating, atomic layer deposition, and pulsed laser deposition, wherein the barrier layer comprises a material selected from indium tin oxide (no), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5 and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less. - View Dependent Claims (36, 37, 38)
- a multilayer film to be arranged on a substrate, the multilayer film comprising at least one barrier layer having at least one of low moisture and low oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the at least one barrier layer to plug at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein the sealing layer is formed by conformal deposition, wherein the conformal deposition is selected from the group consisting of chemical vapour deposition, spin coating, screen printing, WebFlight method, tip coating, atomic layer deposition, and pulsed laser deposition, wherein the barrier layer comprises a material selected from indium tin oxide (no), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5 and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
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39. A method to manufacture an encapsulation barrier stack, comprising:
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providing at least one barrier layer; and forming at least one sealing layer on a surface of the at least one barrier layer, wherein forming the at least one sealing layer comprises conformal deposition of the at least one sealing layer over the at least one barrier layer under vacuum or in an inert gas environment, the at least one barrier layer having at least one of low moisture and low oxygen permeability, wherein the at least one sealing layer is arranged to be in contact with the surface of the at least one barrier layer to plug at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein the conformal deposition is selected from the group consisting of chemical vapour deposition, screen printing, WebFlight method, tip coating, atomic layer deposition, and pulsed laser deposition, wherein the barrier layer comprises a material selected from indium tin oxide (ITO), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5, and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less.
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40. An encapsulation barrier stack for encapsulating at least one of a moisture and oxygen sensitive article, comprising:
- a multilayer film to be arranged on a substrate, the multilayer film comprising at least one barrier layer having at least one of low moisture and low oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the at least one barrier layer, for plugging at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein a shape of the nanoparticles is used to control sealing of defects in the at least one barrier layer, wherein the defects are structural defects including at least one of pinholes and cracks, wherein the barrier layer comprises a material selected from indium tin oxide (ITO), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5 and Al2O3 and wherein a permeation rate of the barrier stack having at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less.
- a multilayer film to be arranged on a substrate, the multilayer film comprising at least one barrier layer having at least one of low moisture and low oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the at least one barrier layer, for plugging at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein a shape of the nanoparticles is used to control sealing of defects in the at least one barrier layer, wherein the defects are structural defects including at least one of pinholes and cracks, wherein the barrier layer comprises a material selected from indium tin oxide (ITO), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5 and Al2O3 and wherein a permeation rate of the barrier stack having at least one sealing layer on the surface of the at least one barrier layer is 10−
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41. A method to manufacture an encapsulation barrier stack, comprising:
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forming at least one barrier layer; and forming at least one sealing layer on a surface of the at least one barrier layer, wherein forming the at least one sealing layer comprises conformal deposition of the at least one sealing layer over the at least one barrier layer under vacuum or in an inert gas environment, the at least one barrier layer having at least one of low moisture and low oxygen permeability, wherein the at least one sealing layer is arranged to be in contact with the surface of the at least one barrier layer, to plug at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer plug the at least one defect present in the at least one barrier layer, wherein the forming the at least one sealing layer comprises adding the nanoparticles to an organic solvent, and curing the sealing layer, wherein the barrier layer comprises a material selected from indium tin oxide (ITO), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5 and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less.
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42. An encapsulation barrier stack for encapsulating at least one of a moisture and oxygen sensitive article, comprising:
- a multilayer film to be arranged on a substrate, the multilayer film comprising at least one barrier layer having at least one of low moisture and low oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the at least one barrier layer, for entirely plugging at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer are distributed in a sealing solution to entirely plug the at least one defect present in the at least one barrier layer, wherein the barrier layer comprises a material selected from indium tin oxide (no), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5 and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
3 g/m2/day or less.
- a multilayer film to be arranged on a substrate, the multilayer film comprising at least one barrier layer having at least one of low moisture and low oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the at least one barrier layer, for entirely plugging at least one defect present in the barrier layer, wherein the at least one sealing layer comprises reactive nanoparticles interacting by way of a chemical reaction with at least one of moisture and oxygen to retard the permeation of the at least one of moisture and oxygen through the at least one defect present in the barrier layer, wherein the nanoparticles present in the at least one sealing layer are distributed in a sealing solution to entirely plug the at least one defect present in the at least one barrier layer, wherein the barrier layer comprises a material selected from indium tin oxide (no), TiAlN, SiO2, SiC, Si3N4, TiO2, HfO2, Y2O3, Ta2O5 and Al2O3 and wherein a permeation rate of the barrier stack having the at least one sealing layer on the surface of the at least one barrier layer is 10−
Specification