Passive RF tag with adiabatic circuits

• US 9,495,628 B2
• Filed: 04/03/2014
• Issued: 11/15/2016
• Est. Priority Date: 04/03/2014
• Status: Active Grant

• Current Assignee: Tyfone Incorporated
• Original Assignee: Tyfone Incorporated
• Inventors: Narendra, Siva G.
• Primary Examiner(s): Lim, Steven
• Assistant Examiner(s): MA, KAM WAN
• Application Number:
  US14/244,855
• Publication Number:
  US 20150286918A1
• Time in Patent Office: 957 Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/0709 the source being an interrogation field
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07767 the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies

Abstract

A passive tag embedded in a package includes multiple conductive coils. A first coil receives radio frequency (RF) energy used to power the tag. Additional coils receive and/or transmit data signals, clock signals, and carrier signals. The RF energy and other signals may be at different frequencies. An RF probe includes a first coil to emit the RF energy to power the tag. The RF probe includes additional coils corresponding to the additional coils in the tag. The RF probe may turn off the RF signal used for power during communication. The RF energy may be rectified to provide DC power to circuits in the tag, or may be used directly for adiabatic circuits. The RF probe and the package may have complementary shapes to facilitate alignment of the coils.

Claims

1. An apparatus comprising:

an integrated circuit die having a footprint, the integrated circuit die including at least one adiabatic logic circuit;

a first conductive coil having a plurality of turns electrically coupled to power the at least one adiabatic logic circuit from an electromagnetic signal at a first frequency;

a second conductive coil having a plurality of turns to receive data modulated on a carrier signal at a second frequency; and

a package to house the integrated circuit die;

wherein the first and second conductive coils are integrated in the integrated circuit die, and wherein the package includes a surface feature matching a feature of an RF probe to facilitate alignment of the RF probe and the integrated circuit die, and the alignment corresponds to alignment of the first and second conductive coils affixed to the integrated circuit die with corresponding conductive coils on the RF probe.

2. The apparatus of claim 1 wherein the first and second frequencies are the same.

3. The apparatus of claim 1 wherein the first and second frequencies are different.

4. The apparatus of claim 1 wherein the integrated circuit die further includes a data input/output circuit electrically coupled between the at least one adiabatic logic circuit and the second conductive coil to extract incoming data modulated on the carrier signal, and to transmit outgoing data by modulating the carrier signal.

5. The apparatus of claim 4 further comprising a third conductive coil with a plurality of turns to receive a carrier signal at the second frequency.

6. The apparatus of claim 1 further comprising a third conductive coil with a plurality of turns to transmit output data modulated at the second frequency.

7. An apparatus comprising:

an integrated circuit die having a footprint, the integrated circuit die including at least one adiabatic logic circuit;

a first conductive coil having a plurality of turns electrically coupled to power the at least one adiabatic logic circuit from an electromagnetic signal at a first frequency;

a second conductive coil having a plurality of turns;

a data output circuit to transmit data by modulating an impedance of the second conductive coil when the second conductive coil is in the presence of a carrier signal; and

a package to house the integrated circuit die;

wherein the first and second conductive coils are integrated in the integrated circuit die, and wherein the package includes a surface feature matching a feature of an RF probe to facilitate alignment of the RF probe and the integrated circuit die, and the alignment corresponds to alignment of the first and second conductive coils affixed to the integrated circuit die with corresponding conductive coils on the RF probe.

8. The apparatus of claim 7 wherein the first and second frequencies are the same.

9. The apparatus of claim 7 wherein the first and second frequencies are different.

10. The apparatus of claim 7 wherein the integrated circuit die further includes a data input circuit electrically coupled between the at least one adiabatic logic circuit and the second conductive coil to extract incoming data modulated on the carrier signal.

11. The apparatus of claim 10 further comprising a third conductive coil with a plurality of turns to receive a carrier signal at the second frequency.

12. The apparatus of claim 7 further comprising a third conductive coil with a plurality of turns to transmit output data modulated at the second frequency.