Electronically variable capacitor and RF matching network incorporating same

• US 9,496,122 B1
• Filed: 01/12/2015
• Issued: 11/15/2016
• Est. Priority Date: 01/10/2014
• Status: Active Grant

• Current Assignee: ASM America Incorporated (ASM International NV)
• Original Assignee: Reno Technologies Inc.
• Inventors: Bhutta, Imran Ahmed
• Primary Examiner(s): A, Minh D
• Application Number:
  US14/594,262
• Time in Patent Office: 673 Days
• Field of Search: 333/17.3, 333/32, 333/171, 333/174, 333/99.PL, 315/111.21, 315/111.71
• US Class Current: 1/1
• CPC Class Codes: H01J 2237/327 Arrangements for generating the plasma
• CPC Class Codes: H01J 2237/332 Coating
• CPC Class Codes: H01J 2237/334 Etching
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/32183 Matching circuits
• CPC Class Codes: H01L 21/02274 in the presence of a plasma [PECVD]
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/31138 by dry-etching
• CPC Class Codes: H01L 21/32136 using plasmas
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H03H 7/0138 Electrical filters or coupling circuits
• CPC Class Codes: H03H 7/40 Automatic matching of load impedance to source impedance

Abstract

An RF impedance matching network includes an RF input coupled to an RF source having a fixed impedance and an RF output coupled to a plasma chamber having a variable impedance. A series electronically variable capacitor (EVC) is coupled in series between the RF input and the RF output. A shunt EVC is coupled in parallel between a ground and one of the RF input and the RF output. A control circuit is operatively coupled to the series and shunt EVCs to control first and second variable capacitances, wherein the control circuit is configured to: determine the variable impedance; determine first and second capacitance values for the first and second variable capacitances; and alter at least one of the first and second variable capacitances, wherein an elapsed time between determining the variable impedance and when RF power reflected back to the RF source decreases is less than about 150 μsec.

Claims

1. An RF impedance matching network comprising:

an RF input coupled to an RF source having a fixed impedance;

an RF output coupled to a plasma chamber having a variable impedance;

a series electronically variable capacitor having a first variable capacitance, the series electronically variable capacitor electrically coupled in series between the RF input and the RF output;

a shunt electronically variable capacitor having a second variable capacitance, the shunt electronically variable capacitor electrically coupled in parallel between a ground and one of the RF input and the RF output; and

a control circuit operatively coupled to the series electronically variable capacitor and to the shunt electronically variable capacitor to control the first variable capacitance and the second variable capacitance, wherein the control circuit is configured to;

determine the variable impedance of the plasma chamber,

determine a first capacitance value for the first variable capacitance and a second capacitance value for the second variable capacitance, and

generate a control signal to alter at least one of the first variable capacitance and the second variable capacitance to the first capacitance value and the second capacitance value, respectively,

wherein an elapsed time between determining the variable impedance of the plasma chamber to when RF power reflected back to the RF source decreases is less than about 150 μ

sec.

2. The RF impedance matching network of claim 1, wherein the control circuit is configured to repeat the steps of determining the variable impedance, determining the first and second capacitance values, and generating the control signal to create an impedance match at the RF input.

3. The RF impedance matching network of claim 2, wherein the impedance match is created in about 500 μ

sec or less.

4. The RF impedance matching network of claim 1, further comprising:

a series driver circuit operatively coupled between the control circuit and the series electronically variable capacitor, the series driver circuit being configured to alter the first variable capacitance based upon the control signal received from the control circuit; and

a shunt driver circuit operatively coupled between the control circuit and the shunt electronically variable capacitor, the shunt driver circuit being configured to alter the second variable capacitance based upon the control signal received from the control circuit.

5. The RF impedance matching network of claim 4, further comprising:

a series RF filter operatively coupled between the series electronically variable capacitor and the series driver circuit; and

a shunt RF filter operatively coupled between the shunt electronically variable capacitor and the shunt driver circuit.

6. A method of matching an impedance, the method comprising:

determining a variable impedance of a plasma chamber, with an impedance matching network electrically coupled between the plasma chamber and an RF source, wherein the RF source has a fixed impedance, and the impedance matching network includes a series electronically variable capacitor having a first variable capacitance and, coupled in series between the plasma chamber and the RF source, and a shunt electronically variable capacitor having a second variable capacitance and, coupled in parallel between a ground and one of the plasma chamber and the RF source;

determining a first variable capacitance value and a second variable capacitance value for, respectively, the series electronically variable capacitor and the shunt electronically variable capacitor, for purposes of creating an impedance match at an RF input of the impedance matching network; and

altering at least one of the first variable capacitance and the second variable capacitance to the first capacitance value and the second capacitance value, respectively, wherein an elapsed time between determining the variable impedance of the plasma chamber to when RF power reflected back to the RF source decreases is less than about 150 μ

sec.

7. The method of claim 6, wherein the steps of determining the first variable capacitance value and the second variable capacitance value and altering the at least one of the first variable capacitance value and the second variable capacitance are repeated to create the impedance match.

8. The method of claim 7, wherein the impedance match is created in an elapsed time of about 500 μ

sec or less.

9. The method of claim 6, wherein the altering of the at least one of the first variable capacitance and the second variable capacitance comprises sending a control signal to at least one of a series driver circuit and a shunt driver circuit to control the first variable capacitance and the second variable capacitance, respectively, the series driver circuit operatively coupled to the series electronically variable capacitor, and the shunt driver circuit operatively coupled to the shunt electronically variable capacitor.

10. A method of manufacturing a semiconductor comprising:

placing a substrate in a plasma chamber configured to deposit a material layer onto the substrate or etch a material layer from the substrate; and

energizing plasma within the plasma chamber by coupling RF power from an RF source into the plasma chamber to perform a deposition or etching, and while energizing the plasma;

determining a variable impedance of the plasma within the plasma chamber, with an impedance matching network electrically coupled between the plasma chamber and the RF source, wherein the RF source has a fixed impedance, and the impedance matching network includes a series electronically variable capacitor having a first variable capacitance and coupled in series between the plasma chamber and the RF source, and a shunt electronically variable capacitor having a second variable capacitance and coupled in parallel between a ground and one of the plasma chamber and the RF source, determining a first variable capacitance value and a second variable capacitance value for, respectively, the series electronically variable capacitor and the shunt electronically variable capacitor, for purposes of creating an impedance match at an RF input of the impedance matching network; and

altering at least one of the first variable capacitance and the second variable capacitance to the first capacitance value and the second capacitance value, respectively, wherein an elapsed time between determining the variable impedance of the plasma chamber to when RF power reflected back to the RF source decreases is less than about 150 μ

sec.

11. The method of claim 10, wherein the steps of determining the first variable capacitance value and the second variable capacitance value and altering the series electronically variable capacitor and the shunt electronically variable capacitor are repeated to create the impedance match.

12. The method of claim 11, wherein the impedance match is created in an elapsed time of about 500 μ

sec or less and results in about 10% or less RF power reflected back to the RF source.

13. The method of claim 10, wherein each of the series and shunt electronically variable capacitors comprise a plurality of discrete capacitors;

and wherein the alteration of at least one of the first variable capacitance and the second variable capacitance to the first capacitance value and the second capacitance value, respectively, is controlled by;

directing a first voltage into a first power switch;

directing a second voltage into a second power switch;

directing a common input signal into the first power switch and into the second power switch; and

controlling the first power switch and the second power switch with the common input signal, wherein the first power switch provides the first voltage to a common output in response to the common input signal, and the second power switch asynchronously provides, with respect to the first voltage, the second voltage to the common output in response to the common input signal, and wherein an electronic switch, which is electrically coupled to the common output, is switched to activate or deactivate one of the discrete capacitors of one of the series electronically variable capacitor and the shunt electronically variable capacitor according to the first voltage or the second voltage being provided to the common output.

14. The method of claim 13, wherein the second voltage is opposite in polarity to the first voltage.

15. The method of claim 13, wherein the first voltage is greater than about 500 volts.

16. The method of claim 13, wherein the first voltage differs from the second voltage by at least two orders of magnitude.

17. The method of claim 13, wherein the first power switch comprises at least one optocoupler phototransistor.

18. The method of claim 13, wherein the first power switch optically isolates the common input signal from the first voltage.

19. The method of claim 13, wherein the common input signal is a 5 volt control signal.

20. The method of claim 13, wherein the first power switch and the second power switch, in combination, are configured to switch between the first voltage and the second voltage on the common output in less than about 15 μ

sec.