Methods and devices for securing and transporting singulated die in high volume manufacturing
First Claim
1. A die processing method comprising:
- identifying a wafer position for a plurality of die on a wafer;
storing the wafer position for each of the plurality of die in a database;
dicing the wafer into a plurality of singulated die;
positioning each of the singulated die in a die position on a tray;
storing the die position on the tray for each of the singulated die in the database, wherein the database includes information including the wafer position associated with each die position;
transporting the tray to a processing tool;
removing at least one of the plurality of singulated die from the die position on the tray and processing the singulated die in the processing tool; and
after the processing, replacing the singulated die in the same die location on the tray that the singulated die was positioned in prior to the processing.
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Accused Products
Abstract
A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.
12 Citations
22 Claims
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1. A die processing method comprising:
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identifying a wafer position for a plurality of die on a wafer; storing the wafer position for each of the plurality of die in a database; dicing the wafer into a plurality of singulated die; positioning each of the singulated die in a die position on a tray; storing the die position on the tray for each of the singulated die in the database, wherein the database includes information including the wafer position associated with each die position; transporting the tray to a processing tool; removing at least one of the plurality of singulated die from the die position on the tray and processing the singulated die in the processing tool; and after the processing, replacing the singulated die in the same die location on the tray that the singulated die was positioned in prior to the processing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A die processing method comprising:
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dicing a wafer into a plurality of singulated die; storing information including a wafer position where each of the plurality of singulated die was positioned prior to the dicing the wafer; positioning each of the singulated die in a die position on a tray; storing additional information including the die position on the tray for each of the singulated die; transporting the tray to a processing tool; processing the singulated die in the processing tool; and transporting the tray away from the processing tool after the processing, wherein the singulated die are positioned in the same die position on the tray after the processing that they were positioned in prior to the processing. - View Dependent Claims (12, 13)
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14. A die processing system comprising:
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a die singulation device configured to singulate a wafer into a plurality of singulated die; a tray configured to hold a quantity of the singulated die; a pick and place device configured to position a quantity of the singulated die on the tray; a container configured to hold the tray; an automated loading device configured to deliver the container to a processing tool; and a database component comprising information including a wafer origination position and a tray position for each of the singulated die on the tray. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A die processing system comprising:
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a die singulation device configured to singulate a wafer into a plurality of singulated die; a plurality of trays each configured to hold a quantity of the singulated die; a pick and place device configured to position the singulated die on the trays; a plurality of containers configured to each hold a quantity of the trays; a database component comprising information including a wafer origination position, a tray position, a tray identification, and a container identification for each of the singulated die; an automated loading device configured to deliver the containers to processing tools; and a plurality of processing tools configured to process the singulated die and configured to provide the singulated die in the same tray position prior to and after any processing in the processing tools. - View Dependent Claims (21, 22)
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Specification