×

Methods and devices for securing and transporting singulated die in high volume manufacturing

  • US 9,496,161 B2
  • Filed: 02/22/2016
  • Issued: 11/15/2016
  • Est. Priority Date: 12/28/2013
  • Status: Active Grant
First Claim
Patent Images

1. A die processing method comprising:

  • identifying a wafer position for a plurality of die on a wafer;

    storing the wafer position for each of the plurality of die in a database;

    dicing the wafer into a plurality of singulated die;

    positioning each of the singulated die in a die position on a tray;

    storing the die position on the tray for each of the singulated die in the database, wherein the database includes information including the wafer position associated with each die position;

    transporting the tray to a processing tool;

    removing at least one of the plurality of singulated die from the die position on the tray and processing the singulated die in the processing tool; and

    after the processing, replacing the singulated die in the same die location on the tray that the singulated die was positioned in prior to the processing.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×