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Packages and methods of manufacture thereof

  • US 9,496,196 B2
  • Filed: 08/15/2014
  • Issued: 11/15/2016
  • Est. Priority Date: 08/15/2014
  • Status: Active Grant
First Claim
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1. A package comprising:

  • a first chip package comprising;

    a molding compound;

    a first die within the molding compound;

    a first via structure within the molding compound at a first lateral portion of the first die, the first via structure extending between an active surface of the first die and a first surface of the molding compound;

    a second via structure within the molding compound at a second lateral portion of the first die opposite the first lateral portion, the second via structure extending between the active surface of the first die and the first surface of the molding compound;

    a third via structure within the molding compound laterally adjacent to and spaced apart from a first sidewall of the first die;

    a fourth via structure within the molding compound laterally adjacent to and spaced apart from a second sidewall of the first die opposite the first sidewall, wherein the third via structure and the fourth via structure extend between the first surface of the molding compound and a second surface of the molding compound opposite the first surface;

    a second die within the molding compound, the second die disposed at the active surface of the first die and between the first via structure and the second via structure;

    a redistribution layer (RDL) disposed over the first surface of the molding compound, wherein the RDL electrically connects the first via structure and the second via structure to the third via structure and the fourth via structure respectively; and

    the first die attached to a substrate with an adhesive layer; and

    a die structure disposed over the first chip package.

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