Integrated camera module and method of making same

• US 9,496,247 B2
• Filed: 08/20/2014
• Issued: 11/15/2016
• Est. Priority Date: 08/26/2013
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Primary Examiner(s): Kraig, William F
• Assistant Examiner(s): Malek, Maliheh
• Application Number:
  US14/463,896
• Publication Number:
  US 20150054001A1
• Time in Patent Office: 818 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/18165 of a wire bonded chip
• CPC Class Codes: H04N 13/239 using two 2D image sensors having a relative position equal to or related to the interocular distance H04N13/243 takes precedence
• CPC Class Codes: H04N 13/254 in combination with electromagnetic radiation sources for illuminating objects
• CPC Class Codes: H04N 23/45 for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
• CPC Class Codes: H04N 23/56 provided with illuminating means
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/741 by increasing the dynamic range of the image compared to the dynamic range of the electronic image sensors
• CPC Class Codes: H04N 23/951 by using two or more images to influence resolution, frame rate or aspect ratio

Abstract

A camera module and method of making same, includes a substrate of conductive silicon having top and bottom surfaces, a sensor device, and an LED device. The substrate includes a first cavity formed into the bottom surface of the substrate and has an upper surface, an aperture extending from the first cavity upper surface to the top surface of the substrate, and a second cavity formed into the top surface of the substrate and having a lower surface. The sensor device includes at least one photodetector, is disposed at least partially in the first cavity, and is mounted to the first cavity upper surface. The LED device includes at least one light emitting diode, is disposed at least partially in the second cavity, and is mounted to the second cavity lower surface.

Claims

1. A camera module, comprising:

a substrate of conductive silicon having top and bottom surfaces, the substrate comprising;

a first cavity formed into the bottom surface of the substrate and having an upper surface,

an aperture extending from the first cavity upper surface to the top surface of the substrate, and

a second cavity formed into the top surface of the substrate and having a lower surface;

a sensor device that includes at least one photodetector, is disposed at least partially in the first cavity, and is mounted to the first cavity upper surface; and

an LED device that includes at least one light emitting diode, is disposed at least partially in the second cavity, and is mounted to the second cavity lower surface.

2. The camera module of claim 1, wherein the substrate further comprises:

a first plurality of conductive leads each electrically connected to the sensor device and including a contact pad on the bottom surface of the substrate; and

a second plurality of conductive leads extending through and insulated from the substrate, each of the second plurality of conductive leads extending between a first contact pad at the top surface and a second contact pad at the bottom surface.

3. The camera module of claim 2, wherein each of the first plurality of conductive leads extends over and is insulated from the upper surface of the first cavity, a sidewall of the first cavity, and the bottom surface of the substrate.

4. The camera module of claim 2, further comprising:

a first plurality of electrical interconnects each electrically connected to one of the contact pads of the first plurality of conductive leads; and

a second plurality of electrical interconnects each electrically connected to one of the second contact pads of the second plurality of conductive leads.

5. The camera module of claim 2, further comprising:

a plurality of wires each electrically connected between the LED device and one of the first contact pads.

6. The camera module of claim 5, further comprising:

encapsulant material formed in the second cavity, over the LED device, over the plurality of wires and over at least a portion of the top surface of the substrate.

7. The camera module of claim 5, further comprising:

a curved member mounted to the top surface and disposed over the second cavity, the LED device, and the plurality of wires.

8. The camera module of claim 1, wherein the at least one photodetector is oriented to receive light passing through the aperture, and wherein the at least one light emitting diode is disposed in the second cavity and facing an opening of the second cavity at the top surface of the substrate.

9. The camera module of claim 1, further comprising:

a lens module that includes;

a housing mounted to the top surface and over the aperture;

at least one lens secured in the housing and disposed to focus light impinging on the top surface through the aperture and onto the at least one photodetector.

10. The camera module of claim 1, wherein a sidewall of the second cavity is tapered and covered with a reflective material.

11. The camera module of claim 1, wherein the substrate further comprises:

a third cavity extending from the bottom surface of the substrate to the lower surface of the second cavity.

12. The camera module of claim 11, further comprising:

a heat sink disposed in the third cavity and mounted to the LED device.

13. The camera module of claim 11, further comprising:

a logic device disposed in the third cavity;

wherein the substrate further comprises;

a third plurality of conductive leads each electrically connected to the logic device and including a contact pad on the bottom surface of the substrate, wherein each of the third plurality of conductive leads extends over and is insulated from a sidewall of the third cavity and the bottom surface of the substrate.

14. The camera module of claim 13, further comprising:

a heat sink mounted to the logic device.

15. The camera module of claim 1, wherein:

the substrate further comprises;

a third cavity formed into the bottom surface of the substrate and having an upper surface, and

a second aperture extending from the third cavity upper surface to the top surface of the substrate;

the camera module further comprises;

a second sensor device that includes at least one photodetector, is disposed at least partially in the third cavity, and is mounted to the third cavity upper surface.

16. The camera module of claim 15, wherein the sensor device has a different optical sensing characteristic than that of the second sensor device.

17. The camera module of claim 15, further comprising:

a first lens module that includes;

a housing mounted to the top surface and over the aperture;

at least one lens secured in the housing and disposed to focus light impinging on the top surface through the aperture and onto the at least one photodetector of the sensor device;

a second lens module that includes;

a second housing mounted to the top surface and over the second aperture;

at least one second lens secured in the housing and disposed to focus light impinging on the top surface through the second aperture and onto the at least one photodetector of the second sensor device;

wherein the first lens module has at least one focusing characteristic that is different than that of the second lens module.

18. A method of forming a camera module, comprising:

providing a substrate of conductive silicon having top and bottom surfaces;

forming a first cavity into the bottom surface of the substrate, the first cavity having an upper surface;

forming an aperture extending from the first cavity upper surface to the top surface of the substrate;

forming a second cavity into the top surface of the substrate, the second cavity having a lower surface;

mounting a sensor device to the first cavity upper surface, wherein the sensor device includes at least one photodetector; and

mounting an LED device to the second cavity lower surface, wherein the LED device includes at least one light emitting diode.

19. The method of claim 18, further comprising:

forming a first plurality of conductive leads each electrically connected to the sensor device and including a contact pad on the bottom surface of the substrate; and

forming a second plurality of conductive leads extending through and insulated from the substrate, wherein each of the second plurality of conductive leads extends between a first contact pad at the top surface and a second contact pad at the bottom surface.

20. The method of claim 19, wherein each of the first plurality of conductive leads extends over and is insulated from the upper surface of the first cavity, a sidewall of the first cavity, and the bottom surface of the substrate.

21. The method of claim 19, further comprising:

forming a first plurality of electrical interconnects each electrically connected to one of the contact pads of the first plurality of conductive leads; and

forming a second plurality of electrical interconnects each electrically connected to one of the second contact pads of the second plurality of conductive leads.

22. The method of claim 19, further comprising:

connecting a plurality of wires between the LED device and the first contact pads.

23. The method of claim 22, further comprising:

forming encapsulant material that is disposed in the second cavity, over the LED device, over the plurality of wires and over at least a portion of the top surface of the substrate.

24. The method of claim 22, further comprising:

mounting a curved member to the top surface, wherein the curved member is disposed over the second cavity, the LED device, and the plurality of wires.

25. The method of claim 18, wherein the at least one photodetector is oriented to receive light passing through the aperture, and wherein the at least one light emitting diode is disposed in the second cavity and facing an opening of the second cavity at the top surface of the substrate.

26. The method of claim 18, further comprising:

mounting a lens module to the top surface and over the aperture, wherein the lens module includes at least one lens disposed to focus light impinging on the top surface of the substrate through the aperture and onto the at least one photodetector.

27. The method of claim 18, wherein the forming of the second cavity comprises:

forming a sidewall of the second cavity which is tapered; and

covering the tapered sidewall of the second cavity with a reflective material.

28. The method of claim 18, further comprising:

forming a third cavity in the substrate that extends from the bottom surface of the substrate to the lower surface of the second cavity.

29. The method of claim 28, further comprising:

mounting a heat sink to the LED device, wherein the heat sink is disposed in the third cavity.

30. The method of claim 18, further comprising:

mounting a logic device in the third cavity; and

forming a third plurality of conductive leads each electrically connected to the logic device and including a contact pad on the bottom surface of the substrate, wherein each of the third plurality of conductive leads extends over and is insulated from a sidewall of the third cavity and the bottom surface of the substrate.

31. The method of claim 30, further comprising:

mounting a heat sink to the logic device.

32. The method of claim 18, further comprising:

forming a third cavity into the bottom surface of the substrate, the third cavity having an upper surface;

forming a second aperture extending from the third cavity upper surface to the top surface of the substrate; and

mounting a second sensor device to the third cavity upper surface, wherein the second sensor device includes at least one photodetector.

33. The method of claim 32, wherein the sensor device has a different optical sensing characteristic than that of the second sensor device.

34. The method of claim 32, further comprising:

mounting a first lens module to the top surface and over the aperture, wherein the first lens module includes at least one lens disposed to focus light impinging on the top surface of the substrate through the aperture and onto the at least one photodetector of the first lens module; and

mounting a second lens module to the top surface and over the second aperture, wherein the second lens module includes at least one second lens disposed to focus light impinging on the top surface of the substrate through the second aperture and onto the at least one photodetector of the second lens module;

wherein the first lens module has at least one focusing characteristic that is different than that of the second lens module.