Sensor package with cooling feature and method of making same
First Claim
1. A sensor device, comprising:
- a first substrate of semiconductor material comprising;
opposing first and second surfaces,a plurality of photodetectors configured to receive light impinging on the first surface, anda plurality of first contact pads each extending between the first and second surfaces and electrically coupled to at least one of the plurality of photodetectors;
a second substrate comprising;
opposing first and second surfaces,electrical circuits,a plurality of second contact pads each disposed at the first surface of the second substrate and electrically coupled to at least one of the electrical circuits, anda plurality of cooling channels formed as first trenches extending into the second surface of the second substrate but not reaching the first surface of the second substrate;
wherein the second surface of the first substrate is mounted to the first surface of the second substrate such that each of the first contact pads is electrically coupled to at least one of the second contact pads.
1 Assignment
0 Petitions
Accused Products
Abstract
A sensor device includes a first substrate of semiconductor material having opposing first and second surfaces, photodetectors configured to receive light impinging on the first surface, and first contact pads each exposed at both the first and second surfaces and electrically coupled to at least one of the photodetectors. A second substrate comprises opposing first and second surfaces, electrical circuits, a second contact pads each disposed at the first surface of the second substrate and electrically coupled to at least one of the electrical circuits, and a plurality of cooling channels formed as first trenches extending into the second surface of the second substrate but not reaching the first surface of the second substrate. The first substrate second surface is mounted to the second substrate first surface such that each of the first contact pads is electrically coupled to at least one of the second contact pads.
63 Citations
6 Claims
-
1. A sensor device, comprising:
-
a first substrate of semiconductor material comprising; opposing first and second surfaces, a plurality of photodetectors configured to receive light impinging on the first surface, and a plurality of first contact pads each extending between the first and second surfaces and electrically coupled to at least one of the plurality of photodetectors; a second substrate comprising; opposing first and second surfaces, electrical circuits, a plurality of second contact pads each disposed at the first surface of the second substrate and electrically coupled to at least one of the electrical circuits, and a plurality of cooling channels formed as first trenches extending into the second surface of the second substrate but not reaching the first surface of the second substrate; wherein the second surface of the first substrate is mounted to the first surface of the second substrate such that each of the first contact pads is electrically coupled to at least one of the second contact pads. - View Dependent Claims (2, 3, 4, 5, 6)
-
Specification