Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
First Claim
1. A backside-illuminated photosensitive image device, comprising:
- a semiconductor substrate having multiple doped regions forming at least one junction;
a textured region coupled to the semiconductor substrate and positioned such that incoming electromagnetic radiation passes through the semiconductor substrate before contacting the textured region, wherein the textured region interacts with the electromagnetic radiation so as to redirect at least a portion of the electromagnetic radiation back into the semiconductor substrate,a dielectric region positioned between the textured region and the at least one junction, the dielectric region being positioned to isolate the at least one junction from the textured region,a reflecting region coupled to the textured region for reflecting electromagnetic radiation passing through the textured region back to the textured region, wherein the textured region is disposed between the dielectric region and the reflecting region, andan electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction.
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Abstract
Backside illuminated photosensitive devices and associated methods are provided. In one aspect, for example, a backside-illuminated photosensitive imager device can include a semiconductor substrate having multiple doped regions forming a least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation where the textured region includes surface features sized and positioned to facilitate tuning to a preselected wavelength of light, and a dielectric region positioned between the textured region and the at least one junction. The dielectric region is positioned to isolate the at least one junction from the textured region, and the semiconductor substrate and the textured region are positioned such that incoming electromagnetic radiation passes through the semiconductor substrate before contacting the textured region. Additionally, the device includes an electrical transfer element coupled to the semiconductor substrate to transfer an electrical signal from the at least one junction.
484 Citations
15 Claims
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1. A backside-illuminated photosensitive image device, comprising:
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a semiconductor substrate having multiple doped regions forming at least one junction; a textured region coupled to the semiconductor substrate and positioned such that incoming electromagnetic radiation passes through the semiconductor substrate before contacting the textured region, wherein the textured region interacts with the electromagnetic radiation so as to redirect at least a portion of the electromagnetic radiation back into the semiconductor substrate, a dielectric region positioned between the textured region and the at least one junction, the dielectric region being positioned to isolate the at least one junction from the textured region, a reflecting region coupled to the textured region for reflecting electromagnetic radiation passing through the textured region back to the textured region, wherein the textured region is disposed between the dielectric region and the reflecting region, and an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A backside-illuminated photosensitive image device, comprising:
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a semiconductor substrate having multiple doped regions forming at least one junction; a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation, wherein the textured region includes a plurality of grooves; a dielectric region positioned between the textured region and the at least one junction, the dielectric region being positioned to isolate the at least one junction from the textured region, wherein the semiconductor substrate and the textured region are positioned such that incoming electromagnetic radiation passes through the semiconductor substrate and the dielectric region before contacting the textured region; and an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction.
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Specification