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Semiconductor device and method for manufacturing the same

  • US 9,496,406 B2
  • Filed: 07/12/2012
  • Issued: 11/15/2016
  • Est. Priority Date: 07/31/2008
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a gate electrode over a substrate, the gate electrode comprising copper;

    a first insulating film over the gate electrode, the first insulating film comprising silicon nitride;

    a second insulating film over the first insulating film, the second insulating film comprising silicon oxide;

    an oxide semiconductor film over the second insulating film, the oxide semiconductor film comprising indium and oxygen;

    a first film over the oxide semiconductor film, the first film comprising oxide;

    a second film over the oxide semiconductor film, the second film comprising oxide;

    a source electrode over the oxide semiconductor film with the first film interposed therebetween;

    a drain electrode over the oxide semiconductor film with the second film interposed therebetween;

    a third insulating film over the oxide semiconductor film, the source electrode, and the drain electrode, the third insulating film comprising silicon oxide;

    a fourth insulating film over the third insulating film, the fourth insulating film comprising silicon nitride; and

    a pixel electrode over the fourth insulating film, the pixel electrode electrically connected to one of the source electrode and the drain electrode,wherein the oxide semiconductor film comprises a first end portion, a second end portion, a depressed portion overlapping with the gate electrode and between the first end portion and the second end portion, and a portion between the depressed portion and the first end portion,wherein one of the first film and the second film is in contact with a top surface of the portion, and each of the first film and the second film is not in contact with a top surface of the depressed portion, and a top surface of the first end portion,wherein a thickness of the portion is larger than a thickness of the depressed portion and larger than a thickness of the first end portion,wherein a first gap between the first film and the second film is smaller than a second gap between the source electrode and the drain electrode,wherein the first gap is a distance between an upper end portion of the first film and an upper end portion of the second film, and the second gap is a distance between a lower end portion of the source electrode and a lower end portion of the drain electrode, andwherein the third insulating film is in contact with the depressed portion.

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