Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction

• US 9,496,466 B2
• Filed: 12/06/2011
• Issued: 11/15/2016
• Est. Priority Date: 12/06/2011
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Lydon, Justin, Rosado, Raymond, Britt, Jeffrey C.
• Primary Examiner(s): May, Robert
• Application Number:
  US13/312,508
• Publication Number:
  US 20130141905A1
• Time in Patent Office: 1,806 Days
• Field of Search: 36231101-3111
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.

Claims

1. A light emitter device comprising:

a submount comprising a first surface, with a first electrical element and a second electrical element disposed on the first surface;

at least one light emitting chip disposed over the first surface of the submount and electrically connected to each of the first and second electrical elements, wherein the at least one light emitting chip comprises a planar upper surface and an opposing planar lower surface that faces the first surface of the submount; and

a lens disposed on and encapsulating the at least one light emitting chip, the first electrical element, and the second electrical element, wherein the lens comprises a lens base having substantially the same geometry as a geometry of the submount wherein the lens extends flush with outermost edges of the submount such that at least one corner of the submount and a corner of the first or the second electrical element is disposed below a non-planar and curved surface of the lens; and

wherein portions of the lens extending to outermost edges of the lens base, outermost edges of the submount, and over outermost edges of the first and second electrical elements are devoid of one or more horizontal surfaces, and wherein the portions of the lens that are devoid of one or more horizontal surfaces extend both above and below a the planar lower surface of the light emitting chip.

2. The light emitter device according to claim 1, wherein the geometry of the lens base and the submount is non-circular.

3. The light emitter device according to claim 1, wherein the geometry of the lens base and the submount is circular.

4. The light emitter device according to claim 1, wherein the geometry of the lens base and the submount is square.

5. The light emitter device according to claim 1, wherein the lens comprises a first portion disposed above the planar upper surface of light emitting chip and a second portion disposed below the planar upper surface of light emitting chip.

6. The light emitter device according to claim 5, wherein the first portion and the second portion are disposed along by a continuous straight, curved, or angled edge of the lens.

7. The light emitter device according to claim 1, wherein the at least one light emitting chip is wirebonded to the first or the second electrical element disposed on the submount.

8. The light emitter device according to claim 1, wherein the planar lower surface of the at least one light emitting chip is directly attached to each of the first and second electrical elements disposed on the submount.

9. The light emitter device according to claim 1, wherein the at least one light emitting chip comprises at least one beveled surface.

10. The light emitter device according to claim 9, wherein the at least one beveled surface faces a corner of the submount.

11. The light emitter device according to claim 9, wherein the at least one beveled surface is offset at an angle with respect to a side of the submount.

12. The light emitter device according to claim 11, wherein the angle comprises approximately 45°

.

13. The light emitter device according to claim 1, wherein the submount comprises a square geometry where each side is approximately 2.5 mm or less.

14. The light emitter device according to claim 13, wherein the submount comprises a square geometry where each side is approximately 2.0 mm or less.

15. The light emitter device according to claim 13, wherein the submount comprises a square geometry where each side is approximately 1.0 mm or less.

16. The light emitter device according to claim 1, wherein the submount comprises a ceramic material.

17. A light emitter device comprising:

a submount comprising a first electrical element and a second electrical element disposed on the submount;

at least one light emitting chip disposed over the submount and electrically connected to the first and second electrical elements, wherein the at least one light emitting chip comprises a planar upper surface and an opposing planar lower surface that faces the submount; and

a lens disposed on and encapsulating the at least one light emitting chip, wherein the lens comprises a first portion disposed above the planar upper surface of the at least one light emitting chip and a second portion disposed below the planar lower surface of the at least one light emitting chip wherein the lens extends flush with outermost edges of the submount such that at least one corner of the submount and a corner of the first or the second electrical element is disposed below a non-planar and inclined surface of the lens; and

wherein the first portion and the second portion are disposed along a continuous non-planar edge of the lens.

18. The light emitter device according to claim 17, wherein the lens comprises a lens base having substantially the same geometry as a geometry of the submount.

19. The light emitter device according to claim 18, wherein the geometry of the lens base and the submount is non-circular.

20. The light emitter device according to claim 18, wherein the geometry of the lens base and the submount is circular.

21. The light emitter device according to claim 18, wherein the geometry of the lens base and the submount is square.

22. The light emitter device according to claim 17, wherein the at least one light emitting chip is wirebonded to the first or the second electrical element disposed on the submount.

23. The light emitter device according to claim 17, wherein the planar lower surface of the at least one light emitting chip is directly attached to each of the first and second electrical elements disposed on the submount.

24. The light emitter device according to claim 17, wherein the at least one light emitting chip comprises at least one beveled surface.

25. The light emitter device according to claim 24, wherein the at least one beveled surface faces a corner of the submount.

26. The light emitter device according to claim 24, wherein the at least one beveled surface is offset at an angle with respect to a side of the submount.

27. The light emitter device according to claim 26, wherein the angle comprises approximately 45°

.

28. The light emitter device according to claim 17, wherein the submount comprises a square geometry where each side is approximately 2.5 mm or less.

29. The light emitter device according to claim 28, wherein the submount comprises the square geometry where each side is approximately 2.0 mm or less.

30. The light emitter device according to claim 28, wherein the submount comprises the square geometry where each side is approximately 1.0 mm or less.

31. The light emitter device according to claim 17, wherein the submount comprises a ceramic material.

32. A light emitter device comprising:

a submount comprising a first electrical element and a second electrical element disposed on the submount;

at least one light emitting chip disposed over the submount and electrically connected to each of the first and second electrical elements, wherein the at least one light emitting chip comprises a planar upper surface and an opposing planar lower surface that faces the submount; and

a lens disposed on the at least one light emitting chip, wherein the lens extends flush with outermost edges of the submount such that at least one corner of the submount and a corner of the first or the second electrical element is disposed below a non-planar and inclined surface of the lens, and wherein the non-planar and inclined surface of the lens extends both above and below the planar lower surface of the light emitting chip.

33. The light emitter according to claim 32, wherein the lens comprises a first portion disposed above the planar upper surface of the at least one light emitting chip and a second portion disposed below the planar upper surface of at least one light emitting chip.

34. The light emitter according to claim 33, wherein the first portion and the second portion are disposed along a continuous straight, curved, or angled edge of the lens.

35. The light emitter device according to claim 32, wherein the lens comprises a lens base having substantially the same geometry as a geometry of the submount.

36. The light emitter device according to claim 35, wherein the geometry of the lens base and the submount is non-circular.

37. The light emitter device according to claim 35, wherein the geometry of the lens base and the submount is circular.

38. The light emitter device according to claim 35, wherein the geometry of the lens base and the submount is square.

39. The light emitter device according to claim 32, wherein the at least one light emitting chip is wirebonded to the first or the second electrical element disposed on the submount.

40. The light emitter device according to claim 32, wherein the planar lower surface of the at least one light emitting chip is directly attached to each of the first and second electrical elements disposed on the submount.

41. The light emitter device according to claim 32, wherein the at least one light emitting chip comprises at least one beveled surface.

42. The light emitter device according to claim 41, wherein the at least one beveled surface faces a corner of the submount.

43. The light emitter device according to claim 41, wherein the at least one beveled surface is offset at an angle with respect to a side of the submount.

44. The light emitter device according to claim 43, wherein the angle comprises approximately 45°

.

45. The light emitter device according to claim 32, wherein the submount comprises a square geometry where each side is approximately 2.5 mm or less.

46. The light emitter device according to claim 45, wherein the submount comprises a square geometry where each side is approximately 2.0 mm or less.

47. The light emitter device according to claim 45, wherein the submount comprises the square geometry where each side is approximately 1.0 mm or less.

48. The light emitter device according to claim 32, wherein the submount comprises a ceramic material.

49. A method of providing a light emitter device, the method comprising:

providing a submount comprising a first electrical element and a second electrical element disposed on the submount;

electrically connecting at least one light emitting chip to the first and second electrical elements disposed on the submount, wherein the at least one light emitting chip comprises a planar upper surface and an opposing planar lower surface that faces the submount; and

forming a lens on and encapsulating the at least one light emitting chip such that a lens base comprises substantially the same geometry as a geometry of the submount, wherein the lens extends flush with outermost edges of the submount such that at least one corner of the submount and a corner of the first or the second electrical element is disposed below a non-planar and inclined surface of the lens;

wherein portions of the lens extending to outermost edges of the lens base, outermost edges of the substrate, and over outermost edges of the first and second electrical elements are non-planar, and wherein the non-planar portions of the lens extend both above and below the planar lower surface of the light emitting chip.

50. The method according to claim 49, wherein forming the lens comprises molding the lens such that the geometry of the lens base is non-circular.

51. The method according to claim 49, wherein forming the lens comprises molding the lens such that the geometry of the lens base is circular.

52. The method according to claim 49, wherein forming the lens comprises molding the lens such that the geometry of the lens base is square.

53. The method according to claim 49, wherein forming the lens comprises forming a first portion and forming a second portion, where the first portion is formed above the planar upper surface of the light emitting chip and a second portion is formed below the planar upper surface of the light emitting chip.

54. The method according to 53, wherein the first portion and the second portion are disposed along a continuous straight, curved, or angled edge of the lens.

55. The method according to claim 49, wherein electrically connecting the at least one light emitting chip comprises wirebonding the light emitting chip to the first or the second electrical element disposed on the submount.

56. The method according to claim 49, wherein electrically connecting the at least one light emitting chip comprises attaching a portion of the bottom surface of the light emitting chip to each of the first or the second electrical elements disposed on the submount.

57. The method according to claim 49, wherein electrically connecting the at least one light emitting chip comprises electrically connecting a light emitting chip comprising at least one beveled surface.

58. The method according to claim 57, further comprising angling the at least one beveled surface to face a corner of the submount.

59. The method according to claim 57, further comprising angling the at least one beveled surface approximately 45°

with respect to a side of the submount.

60. The method according to claim 49, wherein providing the submount comprises providing a square geometry where each side is approximately 2.5 mm or less.

61. The method according to claim 60, wherein providing the submount comprises providing a square geometry where each side is approximately 2.0 mm or less.

62. The method according to claim 60, wherein providing the submount comprises providing a square geometry where each side is approximately 1.0 mm or less.

63. The method according to claim 49, wherein providing the submount comprises providing a ceramic submount.

64. A light emitter device comprising:

a submount comprising a first electrical element and a second electrical element disposed on the submount;

at least one light emitting chip disposed over the submount and electrically connected to the each of the first and second electrical elements, wherein the at least one light emitting chip comprises a planar upper surface and an opposing planar lower surface that faces the submount; and

a lens disposed on and encapsulating the at least one light emitting chip, wherein a lens base and the submount have a non-circular configuration, and wherein portions of the lens extending to outermost edges of the lens base, outermost edges of the submount, and over outermost edges of the first and second electrical elements are devoid of one or more horizontal surfaces, wherein the lens extends flush with outermost edges of the submount such that at least one corner of the submount and a corner of the first or the second electrical element is disposed below a non-planar and inclined surface of the lens; and

wherein the portions of the lens that are devoid of one or more horizontal surfaces extend both above and below the planar lower surface of the light emitting chip.

65. The light emitter device according to claim 64, wherein the shape of the lens base and the submount is square.

66. The light emitter device according to claim 64, wherein the at least one light emitting chip comprises at least one beveled surface.

67. The light emitter device according to claim 66, wherein the at least one beveled surface faces a corner of the submount.

68. The light emitter device according to claim 64, wherein the submount comprises a square shape where each side is approximately 2.5 mm or less.