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Wafer-level flip chip device packages and related methods

  • US 9,496,472 B2
  • Filed: 11/30/2015
  • Issued: 11/15/2016
  • Est. Priority Date: 01/24/2012
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a solid shaped volume of a polymeric binder;

    suspended within the binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a bare-die light-emitting element comprising a plurality of active semiconductor layers that cooperatively emit light;

    disposed on the first face of the semiconductor die, at least two spaced-apart contacts each having a terminal end not covered by the polymeric binder, the contacts each contacting a different active semiconductor layer of the semiconductor die; and

    disposed over and in electrical contact with at least a portion of each of the terminal ends of the contacts, an anisotropic conductive adhesive (ACA),wherein at least a portion of the polymeric binder is transparent to a wavelength of light emitted by the light-emitting element.

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