Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate

• US 9,498,944 B2
• Filed: 06/09/2014
• Issued: 11/22/2016
• Est. Priority Date: 09/28/2009
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Izumi, Shigeto
• Primary Examiner(s): KOCH, GEORGE R
• Application Number:
  US14/299,511
• Publication Number:
  US 20140262045A1
• Time in Patent Office: 897 Days
• Field of Search: 156/351, 156/358, 156/366, 156/367, 156/378, 156/379
• US Class Current: 1/1
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: B32B 41/00 Arrangements for controlling or monitoring lamination processes; Safety arrangements
• CPC Class Codes: H01L 21/67005 Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: Y10T 428/24595 and varying density

Abstract

A pressuring module includes a stage having a mounting surface on which an object to be pressured is mounted; a plurality of pressure detecting sections that detect a pressure applied on the mounting surface; and a pressure varying section that varies a pressure distribution across a plane of the mounting surface, by differing a pressing force against the object to be pressured between a periphery and a central portion of the mounting surface in a plane direction of the mounting surface based on the pressure detected by the plurality of pressure detecting sections.

Claims

1. A device comprising:

a first surface configured to support a plurality of semiconductor substrates;

a second surface that opposes the first surface such that the plurality of semiconductor substrates is between the first surface and the second surface;

a driving unit operable to move the first surface toward the second surface until the first surface reaches a predetermined position; and

a pressing unit operable to deliver a pressing force to the first surface towards the second surface;

an instruction setting section including at least one instruction to implement cooperative control of the pressing unit by

moving the first surface toward the second surface with the driving unit,

detecting a change in position of the first surface with a position sensor while the driving unit moves the first surface toward the second surface, and

adjusting a volume of a main room of the pressing unit in response to the detected change in position of the first surface until the position sensor detects that the first surface has reached the predetermined position.

2. The device according to claim 1, wherein the driving unit includes at least one sub cylinder piston mechanism.

3. The device according to claim 2, wherein the pressing unit includes a main cylinder piston mechanism having a larger diameter than the at least one sub cylinder piston mechanism.

4. The device according to claim 3, wherein the at least one sub cylinder piston mechanism includes a sub piston and a sub cylinder, the main cylinder piston mechanism includes a main piston and a main cylinder, and the sub piston is fixed to the main piston.

5. The device according to claim 4, wherein the instruction setting section controls an amount of fluid in the sub cylinder via at least one sub valve, an amount of fluid in the main cylinder via a main valve.

6. The device according to claim 5, wherein the instruction setting section controls the at least one sub valve and subjects the main valve cooperative control to move the first surface faster than a predetermined speed.

7. The device according to claim 5, wherein the instruction setting section controls the main valve and subjects the at least one sub valve to cooperative control to move the first surface slower than a predetermined speed.

8. The device according to claim 5, wherein the instruction setting section controls the main valve and subjects the at least one sub valve to cooperative control to apply more than a predetermined amount of pressure to the first surface.

9. The device according to claim 4, wherein the sub piston extends through the main cylinder.

10. The device according to claim 1, wherein the instruction setting section further includes at least one instruction to implement cooperative control of the driving unit by

moving the first surface toward the second surface with the pressing unit,

detecting a change in pressure applied to the first surface with a pressure sensor while the pressing unit moves the first surface toward the second surface, and

adjusting a volume of a sub room of the driving unit in response to a change in elevation of the first surface until the pressure sensor detects that the pressure applied to the first surface has reached a predetermined pressure.

11. A device comprising:

a first surface configured to support a plurality of semiconductor substrates;

a second surface that opposes the first surface such that the plurality of semiconductor substrates is between the first surface and the second surface;

a main piston that is directly fixed to the first surface and operates according to an amount of fluid in a main cylinder to move the first surface towards the second surface; and

a sub piston that is inserted through the main cylinder and fixed to the main piston and the first surface, the sub piston operating according to an amount of fluid in a sub cylinder to move the first surface towards the second surface;

wherein the amount of fluid in the sub cylinder is in cooperation with the amount of fluid in the main cylinder, and

wherein the main piston, the sub piston, and the first surface are all fixed together as a single body, such that the single body and the plurality of semiconductor substrates move toward the second surface in unison.

12. The device according to claim 11, wherein the main cylinder has a larger diameter than the sub cylinder.

13. The device according to claim 11, wherein the sub piston and the main cylinder are positioned to cross a common horizontal plane.

14. The device according to claim 11, further comprising a main valve operable to control the amount of fluid in the main cylinder;

and a sub valve operable to control the amount of fluid in the sub cylinder.

15. The device according to claim 14, further comprising an instruction setting section that controls the sub valve and subjects the main valve to cooperative control to move the first surface faster than a predetermined speed.

16. The device according to claim 14, further comprising an instruction setting section that controls the main valve and subjects the sub valve to cooperative control to move the first surface slower than a predetermined speed.

17. The device according to claim 14, further comprising an instruction setting section that controls the main valve and subjects the sub valve to cooperative control to apply more than a predetermined amount of pressure to the first surface.

18. The device according to claim 15, wherein, while subjected to cooperative control, the instruction setting section causes the main valve to transfer, into the main cylinder, an amount of fluid corresponding to an increase in volume of the main cylinder due to elevation of the first surface.

19. The device according to claim 15, wherein, while the main valve is subjected to cooperative control, the instruction setting section causes the main piston to exert no force on the first surface.