Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
First Claim
1. A method for fabricating a microelectronic package, comprising:
- bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer;
bonding a second MEMS die having a second MEMS transducer structure thereon to one of the cap piece and the second MEMS die such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer, the second hermetically-sealed cavity containing a different internal pressure than does the first hermetically-sealed cavity;
removing a portion of the second MEMS die and the cap piece overlying a bond pad shelf on the first MEMS die to reveal the bond pad shelf and a plurality of bonds pads thereon; and
forming wire bonds in contact with the plurality of bonds to electrically interconnect the first MEMS die with the second MEMS die.
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Accused Products
Abstract
Microelectronic packages and methods for producing microelectronic packages are provided. In one embodiment, the method includes bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece. The first MEMS die and cap piece are bonded such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer. A second MEMS die having a second MEMS transducer structure thereon is further bonded to one of the cap piece and the second MEMS die. The second MEMS die and the cap piece are bonded such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer. The second hermetically-sealed cavity contains a different internal pressure than does the first hermetically-sealed cavity.
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Citations
20 Claims
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1. A method for fabricating a microelectronic package, comprising:
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bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer; bonding a second MEMS die having a second MEMS transducer structure thereon to one of the cap piece and the second MEMS die such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer, the second hermetically-sealed cavity containing a different internal pressure than does the first hermetically-sealed cavity; removing a portion of the second MEMS die and the cap piece overlying a bond pad shelf on the first MEMS die to reveal the bond pad shelf and a plurality of bonds pads thereon; and forming wire bonds in contact with the plurality of bonds to electrically interconnect the first MEMS die with the second MEMS die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for fabricating microelectronic packages, comprising:
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bonding a first wafer to a second wafer to produce a two wafer stack comprising a first array of Microelectromechanical Systems (MEMS) transducer structures enclosed by a first plurality of hermetic cavities each containing a first predetermined pressure; bonding a third wafer to the two wafer stack to produce a three wafer stack comprising a second array of MEMS transducer structures enclosed by a second plurality of hermetic cavities each containing a second predetermined pressure different than the first predetermined pressure; and singulating the three wafer stack into a plurality of die-cap stacks each including axially-partitioned hermetic cavities enclosing different MEMS transducer structures and containing different internal pressures. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A method for fabricating a microelectronic package, comprising:
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bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer; bonding a second MEMS die having a second MEMS transducer structure thereon to the first MEMS die such that the first and second MEMS die are stacked in a face-to-back relationship and such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer, the second hermetically-sealed cavity containing a different internal pressure than does the first hermetically-sealed cavity; and etching a recess into the backside of the second MEMS die prior to bonding to the first MEMS die, the recess enlarging the volume of the first hermetically-sealed cavity. - View Dependent Claims (20)
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Specification