Micro electro mechanical system
First Claim
1. A micro electro mechanical system, comprising:
- a sensor element, comprising;
a first spring system including a first fixed portion and a first elastically-deformable beam connected to the first fixed portion and extending therefrom in a first direction,a second spring system including a second fixed portion and a second elastically-deformable beam connected to the second fixed portion and extending therefrom in a second direction opposite to the first direction,a third spring system including a third fixed portion and a third elastically-deformable beam connected to the third fixed portion and extending therefrom in a third direction,a fourth spring system including a fourth fixed portion and a fourth elastically-deformable beam connected to the fourth fixed portion and extending therefrom in a fourth direction opposite to the third direction, anda movable body, movable in a moving direction, suspended from the first fixed portion via the first beam, suspended from the second fixed portion via the second beam, suspended from the third fixed portion via the third beam, and suspended from the fourth fixed portion via the fourth beam,wherein the first and second spring systems are arranged on one side of a virtual line extending in the moving direction through a center of the sensor element, the third and fourth spring systems are arranged on the other side of the virtual line, and, when the movable body is displaced in the moving direction, tensile stresses are generated within the first, second, third and fourth spring systems at the same time.
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Accused Products
Abstract
In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2. Therefore, a tensile stress (+σ1) occurs in the beam 4a and a compressive stress (−σ2) occurs in the beam 4b. At this time, in terms of a spring system made by combining the beam 4a and the beam 4b, increase in spring constant due to the tensile stress acting on the beam 4a and decrease in spring constant due to the compressive stress acting on the beam 4b are offset against each other.
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Citations
14 Claims
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1. A micro electro mechanical system, comprising:
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a sensor element, comprising; a first spring system including a first fixed portion and a first elastically-deformable beam connected to the first fixed portion and extending therefrom in a first direction, a second spring system including a second fixed portion and a second elastically-deformable beam connected to the second fixed portion and extending therefrom in a second direction opposite to the first direction, a third spring system including a third fixed portion and a third elastically-deformable beam connected to the third fixed portion and extending therefrom in a third direction, a fourth spring system including a fourth fixed portion and a fourth elastically-deformable beam connected to the fourth fixed portion and extending therefrom in a fourth direction opposite to the third direction, and a movable body, movable in a moving direction, suspended from the first fixed portion via the first beam, suspended from the second fixed portion via the second beam, suspended from the third fixed portion via the third beam, and suspended from the fourth fixed portion via the fourth beam, wherein the first and second spring systems are arranged on one side of a virtual line extending in the moving direction through a center of the sensor element, the third and fourth spring systems are arranged on the other side of the virtual line, and, when the movable body is displaced in the moving direction, tensile stresses are generated within the first, second, third and fourth spring systems at the same time. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification