Induction-coupled clock distribution for an integrated circuit
First Claim
1. An integrated circuit package, comprising:
- a transmission module coupled to a main clock line;
a semiconductor die;
a clock reception module disposed on the semiconductor die and inductively coupled to the transmission module, the clock reception module configured to generate a clocking signal on a clock output line; and
an electronic circuit disposed on the semiconductor die and coupled to the clock output line of the clock reception module, the electronic circuit comprising at least one clocked element, and configured to operate synchronously with the clocking signal received through the clock output line of the clock reception module.
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Accused Products
Abstract
An integrated circuit package including an induction-coupled clock distribution system is disclosed. An exemplary embodiment of the disclosure includes a transmission module coupled to a main clock line, a clock reception module coupled to the transmission module, the clock reception module including a clock output line, and an electronic circuit coupled to the clock output line of the clock reception module, the electronic circuit including at least one clocked element and configured to operate synchronously with a clocking signal received through the clock output line of the clock reception module. The transmission module may be disposed on the supporting case of the IC package, and the electronic circuit and the clock reception module may be disposed on the semiconductor die of the IC package.
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Citations
20 Claims
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1. An integrated circuit package, comprising:
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a transmission module coupled to a main clock line; a semiconductor die; a clock reception module disposed on the semiconductor die and inductively coupled to the transmission module, the clock reception module configured to generate a clocking signal on a clock output line; and an electronic circuit disposed on the semiconductor die and coupled to the clock output line of the clock reception module, the electronic circuit comprising at least one clocked element, and configured to operate synchronously with the clocking signal received through the clock output line of the clock reception module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An integrated circuit package, comprising:
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a semiconductor die; a transmission module coupled to a main clock line; a plurality of clock reception modules inductively coupled to the transmission module and disposed on the semiconductor die, each clock reception module comprising a clock output line; and a plurality of electronic circuits disposed on the semiconductor die, each electronic circuit coupled to the clock output line of a corresponding clock reception module of the plurality of clock reception modules, each electronic circuit comprising at least one clocked element and configured to operate synchronously with a clocking signal received through the corresponding clock output line. - View Dependent Claims (14, 15, 16)
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17. An integrated circuit package, comprising:
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a semiconductor die; a transmission module disposed on the semiconductor die and coupled to a main clock line; a clock reception module inductively coupled to the transmission module, the clock reception module configured to generate a clocking signal on a clock output line, wherein an electronic circuit is coupled to the clock output line of the clock reception module and configured to operate synchronously with the clocking signal received through the clock output line of the clock reception module. - View Dependent Claims (18, 19, 20)
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Specification