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Induction-coupled clock distribution for an integrated circuit

  • US 9,501,089 B2
  • Filed: 10/09/2015
  • Issued: 11/22/2016
  • Est. Priority Date: 01/29/2013
  • Status: Active Grant
First Claim
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1. An integrated circuit package, comprising:

  • a transmission module coupled to a main clock line;

    a semiconductor die;

    a clock reception module disposed on the semiconductor die and inductively coupled to the transmission module, the clock reception module configured to generate a clocking signal on a clock output line; and

    an electronic circuit disposed on the semiconductor die and coupled to the clock output line of the clock reception module, the electronic circuit comprising at least one clocked element, and configured to operate synchronously with the clocking signal received through the clock output line of the clock reception module.

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