Integrated finger print sensor
First Claim
1. A fingerprint sensor configured for integration in a device having an overlay made of an insulating material, the fingerprint sensor comprising:
- a plurality of sensing elements positioned on a first side of the overlay, wherein the plurality of sensing elements comprises;
a sensing electrode defined in a first conductive layer;
a first dielectric layer under the sensing electrode; and
an activation electrode and a pick-up electrode defined in a second conductive layer on the opposite side of the first dielectric layer from the sensing electrode, wherein the activation electrode and the pick-up electrode are at least partially covered by the sensing electrode;
a plurality of probes defining a fingerprint sensing area on a second side of the overlay, the plurality of probes extending from the first side of the overlay at least partially through the overlay; and
a plurality of conductor leads on the first side of the overlay interconnecting the plurality of probes with the plurality of sensing elements.
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Accused Products
Abstract
A fingerprint sensor and fingerprint sensor system especially for integration in a device having an overlay made of an insulating material comprises a plurality of sensing elements positioned on a first side of the overlay; a plurality of probes positioned in a predetermined pattern defining a fingerprint sensing area on a second side of the overlay, the plurality of probes extending from the first side of the overlay at least partially through the overlay; a plurality of conductor leads on the first side of the overlay interconnecting the plurality of probes with the plurality of sensing elements; a plurality of amplifiers connected to the plurality of sensing elements, the number of amplifiers being less than the number of sensing elements; and an activation circuit connected to the plurality of sensing elements, the activation circuit being adapted to output at least one activation signal.
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Citations
25 Claims
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1. A fingerprint sensor configured for integration in a device having an overlay made of an insulating material, the fingerprint sensor comprising:
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a plurality of sensing elements positioned on a first side of the overlay, wherein the plurality of sensing elements comprises; a sensing electrode defined in a first conductive layer; a first dielectric layer under the sensing electrode; and an activation electrode and a pick-up electrode defined in a second conductive layer on the opposite side of the first dielectric layer from the sensing electrode, wherein the activation electrode and the pick-up electrode are at least partially covered by the sensing electrode; a plurality of probes defining a fingerprint sensing area on a second side of the overlay, the plurality of probes extending from the first side of the overlay at least partially through the overlay; and a plurality of conductor leads on the first side of the overlay interconnecting the plurality of probes with the plurality of sensing elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 24)
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15. A fingerprint sensor system configured for integration in a device having an overlay made of an insulating material, the fingerprint sensor system comprising:
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a plurality of sensing elements positioned on a first side of the overlay; a plurality of probes defining a fingerprint sensing area on a second side of the overlay, the plurality of probes extending from the first side of the overlay at least partially through the overlay; a plurality of conductor leads on the first side of the overlay interconnecting the plurality of probes with the plurality of sensing elements; a plurality of amplifiers connected to the plurality of sensing elements, the number of amplifiers being less than the number of sensing elements; and an activation circuit connected to the plurality of sensing elements, the activation circuit being adapted to output at least one activation signal, wherein the plurality of sensing elements further comprises; a sensing electrode defined in a first conductive layer; a first dielectric layer under the sensing electrode; an activation electrode and a pick-up electrode defined in a second conductive layer on an opposite side of the first dielectric layer from the first conductive layer, wherein the activation electrode and the pick-up electrode are at least partially covered by the sensing electrode; wherein the activation electrode is connected to the activation circuit; and wherein the pick-up electrode is connected to one of the plurality of amplifiers. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 25)
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Specification