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Integrated finger print sensor

  • US 9,501,685 B2
  • Filed: 02/19/2014
  • Issued: 11/22/2016
  • Est. Priority Date: 02/22/2013
  • Status: Active Grant
First Claim
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1. A fingerprint sensor configured for integration in a device having an overlay made of an insulating material, the fingerprint sensor comprising:

  • a plurality of sensing elements positioned on a first side of the overlay, wherein the plurality of sensing elements comprises;

    a sensing electrode defined in a first conductive layer;

    a first dielectric layer under the sensing electrode; and

    an activation electrode and a pick-up electrode defined in a second conductive layer on the opposite side of the first dielectric layer from the sensing electrode, wherein the activation electrode and the pick-up electrode are at least partially covered by the sensing electrode;

    a plurality of probes defining a fingerprint sensing area on a second side of the overlay, the plurality of probes extending from the first side of the overlay at least partially through the overlay; and

    a plurality of conductor leads on the first side of the overlay interconnecting the plurality of probes with the plurality of sensing elements.

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