BVA interposer

• US 9,502,390 B2
• Filed: 03/12/2013
• Issued: 11/22/2016
• Est. Priority Date: 08/03/2012
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Invensas Corporation
• Inventors: Caskey, Terrence, Mohammed, Ilyas, Uzoh, Cyprian Emeka, Woychik, Charles G., Newman, Michael, Monadgemi, Pezhman, Co, Reynaldo, Chau, Ellis, Haba, Belgacem
• Primary Examiner(s): Smith, Courtney
• Assistant Examiner(s): Augustin, Christopher L
• Application Number:
  US13/795,756
• Publication Number:
  US 20140036454A1
• Time in Patent Office: 1,351 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/02379 Fan-out arrangement
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/43848 Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45664 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48108 the connector not being orthogonal to a side surface of the semiconductor or solid-state body, e.g. fanned-out connectors, radial layout
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1052 Wire or wire-like electrical connections
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB printed circuits H05K1/00
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49833 : the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/381 : Pitch distance
• CPC Class Codes: H05K 1/0298 : Multilayer circuits
• CPC Class Codes: H05K 3/46 : Manufacturing multilayer circuits
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49162 : by using wire as conductive path

Abstract

A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Claims

1. An interposer, comprising:

a dielectric encapsulation having first and second oppositely-facing surfaces at which electrical connection can be made to respective first and second external components; and

a plurality of wire bonds each separated from one another by the encapsulation, each wire bond having first and second opposite extremities not fully covered by the encapsulation at the first and second surfaces, respectively, and an edge surface between the first and second extremities contacted by the encapsulation and separated from the edge surfaces of adjacent wire bonds by the encapsulation, at least one of the extremities of each wire bond being a base of such wire bond, each base being a portion of the respective wire bond other than a cylindrically shaped shaft,

the interposer having first and second opposite sides, first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with the first and second external components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds, the base of each wire bond contacting an adjacent surface of a corresponding one of the first contacts or second contacts, the first and second contacts each configured to be electrically connected with the first and second external components by a conductive bond material,

wherein one of the extremities of each wire bond opposite from the respective base is an end of such wire bond, and the encapsulation has a recess extending from at least one of the first and second surfaces adjacent the end of each of at least some of the wire bonds, each recess configured to receive the conductive bond material.

2. An interposer comprising:

a dielectric encapsulation having first and second oppositely-facing surfaces, wherein the dielectric encapsulation has a through opening extending between the first and second oppositely-facing surfaces, the opening sized to receive an entire major surface of a microelectronic element; and

a plurality of wire bonds for electrical connection with first and second components and separated from one another by the encapsulation, each wire bond having first and second opposite extremities at least not completely covered by the encapsulation at one or both of the first and second oppositely-facing surfaces, respectively, and an edge surface between the first and second extremities contacted by the encapsulation and separated from edge surfaces of adjacent wire bonds by the encapsulation, at least one of the extremities of each wire bond being a base of such wire bond, each base being a portion of the respective wire bond other than a cylindrically shaped shaft,

wherein one of the extremities of each wire bond opposite from the respective base is an end of such wire bond, and the encapsulation has a recess extending from at least one of the first and second surfaces adjacent the end of each of at least some of the wire bonds, each recess configured to receive a conductive bond material.

3. The interposer of claim 2, the interposer further comprising first and second oppositely-facing sides separated from one another by at least the first and second oppositely-facing surfaces of the dielectric encapsulation, respectively.

4. The interposer of claim 3, the interposer further comprising first and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds, the base of each wire bond contacting an adjacent surface of a corresponding one of the first contacts or second contacts.

5. The interposer of claim 3 further comprising at least one conductive structure having at least a portion extending in a lateral direction from and electrically connecting one of the plurality of first extremities of the plurality of wire bonds to a corresponding one of the first contacts, the corresponding one of the first contacts being offset from the one of the plurality of first extremities.

6. The interposer of claim 5 further comprising at least a second conductive structure having at least a portion extending in a lateral direction from and electrically connecting one of the plurality of second extremities of the plurality of wire bonds to a corresponding one of the second contacts, the corresponding one of the second contacts being offset from the one of the plurality of second extremities.

7. The interposer of claim 3, wherein the thickness of the interposer between the first and second oppositely-facing sides is less than one millimeter.

8. A stacked microelectronic assembly, including the interposer of claim 3,

wherein the first component is a first microelectronic package including a plurality of first terminals,

wherein the second component is a second microelectronic package including a plurality of second terminals, the second microelectronic package being electrically connected with the first microelectronic package through the interposer,

wherein the first microelectronic package includes a surface facing the first side of the interposer and the second microelectronic package includes a surface facing the second side of the interposer,

wherein at least some of the respective plurality of first terminals of the first microelectronic package are electrically connected with corresponding first extremities of the plurality of wire bonds of the interposer, and

wherein at least some of the respective plurality of second terminals of the second microelectronic package are electrically connected with corresponding second extremities of the plurality of wire bonds of the interposer.

9. The stacked microelectronic assembly of claim 8, the first microelectronic package further including a first microelectronic element, wherein a major surface of the first microelectronic element is received within the through opening, and wherein the first microelectronic element includes first element contacts electrically connected to the second microelectronic package through the interposer.

10. The stacked microelectronic assembly of claim 9, the second microelectronic package further including a second microelectronic element, wherein the second microelectronic element includes second element contacts electrically connected to the first microelectronic package through the interposer.

11. The stacked microelectronic assembly of claim 9, wherein the first element contacts are electrically connected to the interposer through a plurality of first conductive elements, and wherein the plurality of first conductive elements is at least one of (i) overlying and (ii) embedded at least partially within a redistribution structure, the redistribution structure including a redistribution dielectric layer overlying the dielectric encapsulation of the interposer and a plurality of second conductive elements therethrough.

12. The stacked microelectronic assembly of claim 11, wherein the first element contacts are further electrically connected to joining elements on an opposite side of the redistribution structure.

13. The stacked microelectronic assembly of claim 9, wherein the through opening is filled with encapsulation to fix the location of the interposer relative to the first microelectronic element.

14. The stacked microelectronic assembly of claim 8, wherein the first microelectronic package is a circuit panel.

15. An interposer, comprising:

a dielectric encapsulation having first and second oppositely-facing surfaces at which electrical connection can be made to respective first and second external components; and

a plurality of wire bonds each separated from one another by the encapsulation, each wire bond having first and second opposite extremities not fully covered by the encapsulation at the first and second surfaces, respectively, and an edge surface between the first and second extremities contacted by the encapsulation and separated from the edge surfaces of adjacent wire bonds by the encapsulation, at least one of the extremities of each wire bond being a base of such wire bond, each base being a portion of the respective wire bond other than a cylindrically shaped shaft,

the interposer having first and second opposite sides, first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with the first and second external components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds, the base of each wire bond contacting an adjacent surface of a corresponding one of the first contacts or second contacts, the first and second contacts each configured to be electrically connected with the first and second external components by a conductive bond material,

wherein a material surrounding the edge surface of at least some of the wire bonds is recessed from at least one of the first and second surfaces adjacent the ends of the respective wire bonds, providing a trench extending around the end of each of the respective wire bonds, each trench configured to receive the conductive bond material.

16. An interposer, comprising:

a dielectric encapsulation having first and second oppositely-facing surfaces, wherein the dielectric encapsulation has a through opening extending between the first and second oppositely-facing surfaces, the opening sized to receive an entire major surface of a microelectronic element; and

a plurality of wire bonds for electrical connection with first and second components and separated from one another by the encapsulation, each wire bond having first and second opposite extremities at least not completely covered by the encapsulation at one or both of the first and second oppositely-facing surfaces, respectively, and an edge surface between the first and second extremities contacted by the encapsulation and separated from edge surfaces of adjacent wire bonds by the encapsulation, at least one of the extremities of each wire bond being a base of such wire bond, each base being a portion of the respective wire bond other than a cylindrically shaped shaft,

wherein a material surrounding the edge surface of at least some of the wire bonds is recessed from at least one of the first and second surfaces adjacent the ends of the respective wire bonds, providing a trench extending around the end of each of the respective wire bonds, each trench configured to receive a conductive bond material.

17. The interposer of claim 16, the interposer further comprising first and second oppositely-facing sides separated from one another by at least the first and second oppositely-facing surfaces of the dielectric encapsulation, respectively.

18. The interposer of claim 17, the interposer further comprising first and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds, the base of each wire bond contacting an adjacent surface of a corresponding one of the first contacts or second contacts.

19. The interposer of claim 17 further comprising at least one conductive structure having at least a portion extending in a lateral direction from and electrically connecting one of the plurality of first extremities of the plurality of wire bonds to a corresponding one of the first contacts, the corresponding one of the first contacts being offset from the one of the plurality of first extremities.

20. The interposer of claim 19 further comprising at least a second conductive structure having at least a portion extending in a lateral direction from and electrically connecting one of the plurality of second extremities of the plurality of wire bonds to a corresponding one of the second contacts, the corresponding one of the second contacts being offset from the one of the plurality of second extremities.

21. The interposer of claim 17, wherein the thickness of the interposer between the first and second oppositely-facing sides is less than one millimeter.

22. A stacked microelectronic assembly, including the interposer of claim 17,

wherein the first component is a first microelectronic package including a plurality of first terminals,

wherein the second component is a second microelectronic package including a plurality of second terminals, the second microelectronic package being electrically connected with the first microelectronic package through the interposer,

wherein the first microelectronic package includes a surface facing the first side of the interposer and the second microelectronic package includes a surface facing the second side of the interposer,

wherein at least some of the respective plurality of first terminals of the first microelectronic package are electrically connected with corresponding first extremities of the plurality of wire bonds of the interposer, and

wherein at least some of the respective plurality of second terminals of the second microelectronic package are electrically connected with corresponding second extremities of the plurality of wire bonds of the interposer.

23. The stacked microelectronic assembly of claim 22, the first microelectronic package further including a first microelectronic element, wherein a major surface of the first microelectronic element is received within the through opening, and wherein the first microelectronic element includes first element contacts electrically connected to the second microelectronic package through the interposer.

24. The stacked microelectronic assembly of claim 23, the second microelectronic package further including a second microelectronic element, wherein the second microelectronic element includes second element contacts electrically connected to the first microelectronic package through the interposer.

25. The stacked microelectronic assembly of claim 23, wherein the first element contacts are electrically connected to the interposer through a plurality of first conductive elements, and wherein the plurality of first conductive elements is at least one of (i) overlying and (ii) embedded at least partially within a redistribution structure, the redistribution structure including a redistribution dielectric layer overlying the dielectric encapsulation of the interposer and a plurality of second conductive elements therethrough.

26. The stacked microelectronic assembly of claim 25, wherein the first element contacts are further electrically connected to joining elements on an opposite side of the redistribution structure.

27. The stacked microelectronic assembly of claim 23, wherein the through opening is filled with encapsulation to fix the location of the interposer relative to the first microelectronic element.