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Light emitting diode package with enhanced heat conduction

DC
  • US 9,502,612 B2
  • Filed: 10/07/2013
  • Issued: 11/22/2016
  • Est. Priority Date: 09/20/2009
  • Status: Active Grant
First Claim
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1. A light emitting device, comprising:

  • a substrate having opposing first and second substrate surfaces;

    a semiconductor LED including doped and intrinsic regions thereof, said semiconductor LED having opposing first and second LED surfaces, said first LED surface disposed on the first substrate surface;

    a thermally conductive layer disposed on the second LED surface of the semiconductor LED;

    a carrier wafer disposed on the thermally conductive layer;

    at least one optically reflective surface disposed between said carrier wafer and said semiconductor LED; and

    a substantially optically transmissive layer disposed proximal to the second substrate surface,wherein the carrier wafer and the thermally conductive layer define a relief to expose at least a portion of the second LED surface.

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