Semiconductor device

• US 9,504,154 B2
• Filed: 05/28/2014
• Issued: 11/22/2016
• Est. Priority Date: 06/04/2013
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Mochizuki, Eiji, Nakamura, Hideyo, Horio, Masafumi, Tada, Shinji
• Primary Examiner(s): Bui, Hung S
• Application Number:
  US14/288,825
• Publication Number:
  US 20140355219A1
• Time in Patent Office: 909 Days
• Field of Search: 361/714, 361728-730, 361/752, 361/775, 361/784, 361/796, 361/800, 257/762, 257/773, 257/E23.024, 257/E21.499, 257/E21.214, 257/E21.24
• US Class Current: 1/1
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10272 Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors metal strips H05K2201/1028
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 3/328 by welding

Abstract

A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.

Claims

1. A semiconductor device comprising:

a plurality of semiconductor modules, each having one or more semiconductor chips mounted on an insulated circuit board and contained in a casing, with externally connecting terminals connected to the semiconductor chips or the insulated circuit board protruding from the casing;

bus bars electrically connecting specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel; and

a semiconductor module case having through-holes for protruding external terminals that are portions of the bus bars, and covering and fastening the plurality of semiconductor modules that are connected by the bus bars;

wherein the bus bars and the externally connecting terminals of the semiconductor modules are connected by means of laser welding.

2. The semiconductor device according to claim 1, wherein the bus bar has through-holes capable of passing the externally connecting terminals through the through-holes, or recessed parts for making the terminals contact the recessed parts or grips for holding the terminals.

3. The semiconductor device according to claim 2, wherein the bus bar is plated at least on a place at which the laser welding is conducted.

4. The semiconductor device according to claim 1, wherein the bus bar is plated at least on a place at which the laser welding is conducted.

5. A semiconductor device comprising:

a plurality of semiconductor modules, each having one or more semiconductor chips mounted on an insulated circuit board and contained in a casing, with externally connecting terminals connected to the semiconductor chips or the insulated circuit board protruding from the casing;

bus bars electrically connecting specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel;

a printed circuit board electrically connecting specific externally connecting terminals of the plurality of semiconductor modules, the specific externally connecting terminals being different from the externally connecting terminals connected to the bus bars; and

a semiconductor module case having through-holes for protruding external terminals that are portions of the bus bars, and covering and fastening the plurality of semiconductor modules that are connected by the bus bars;

wherein the printed circuit board and the externally connecting terminals of the semiconductor modules are connected by means of laser welding.

6. The semiconductor device according to claim 5, wherein the printed circuit board has through-holes that allow the externally connecting terminals passing through the through-holes, or intermediate pins that are inserted into the through-holes and capable of passing the terminals through the intermediate pins or capable of making the terminals in contact with the intermediate pins.

7. The semiconductor device according to claim 6, wherein the printed circuit board is plated at least on a place at which the laser welding is conducted.

8. The semiconductor device according to claim 5, wherein the printed circuit board is plated at least on a place at which the laser welding is conducted.