Metal-free monolithic epitaxial graphene-on-diamond PWB

• US 9,504,158 B2
• Filed: 04/22/2014
• Issued: 11/22/2016
• Est. Priority Date: 04/22/2014
• Status: Expired due to Fees

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Meta Platforms, Inc. (f/k/a Facebook, Inc.)
• Inventors: Findley, David G.
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US14/258,448
• Publication Number:
  US 20150305158A1
• Time in Patent Office: 945 Days
• Field of Search: 174/256, 174/255, 174/266, 361/705, 512/95, 513/07, 513/09, 423/446, 607/118
• US Class Current: 1/1
• CPC Class Codes: B28B 1/001 Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00
• CPC Class Codes: B29C 64/165 using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
• CPC Class Codes: B32B 18/00 Layered products essentially comprising ceramics, e.g. refractory products
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: C04B 2235/386 Boron nitrides
• CPC Class Codes: C04B 2235/404 Refractory metals
• CPC Class Codes: C04B 2235/425 Graphite
• CPC Class Codes: C04B 2235/427 Diamond
• CPC Class Codes: C04B 2235/48 Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
• CPC Class Codes: C04B 2235/483 Si-containing organic compounds, e.g. silicone resins, (poly)silanes, (poly)siloxanes or (poly)silazanes
• CPC Class Codes: C04B 2235/5288 Carbon nanotubes
• CPC Class Codes: C04B 2235/5292 Flakes, platelets or plates
• CPC Class Codes: C04B 2235/5454 nanometer sized, i.e. below 100 nm
• CPC Class Codes: C04B 2235/6026 Computer aided shaping, e.g. rapid prototyping
• CPC Class Codes: C04B 2237/363 Carbon
• CPC Class Codes: C04B 2237/365 Silicon carbide
• CPC Class Codes: C04B 2237/76 Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
• CPC Class Codes: C04B 35/528 obtained from carbonaceous particles with or without other non-organic components
• CPC Class Codes: C04B 35/532 containing a carbonisable binder
• CPC Class Codes: C04B 35/571 : obtained from Si-containing polymer precursors or organosilicon monomers
• CPC Class Codes: H05K 1/0203 : Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 : Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 2201/0323 : Carbon
• CPC Class Codes: H05K 3/0014 : Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/101 : by casting or moulding of conductive material

Abstract

According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube.

Claims

1. An apparatus comprising:

a circuit board made of polycrystalline diamond; and

a substantially hollow tube formed within the circuit board, the tube terminating at one or more surfaces of the circuit board, the tube comprising a layer of graphene that is operable to permit the tube to conduct electrical current.

2. The apparatus of claim 1, wherein the layer of graphene forms an outer surface of the tube.

3. The apparatus of claim 1, wherein the tube further comprises a layer of polycrystalline diamond that forms an outer surface of the tube, the layer of polycrystalline diamond being deposited over the layer of graphene.

4. The apparatus of claim 1, wherein the tube further comprises one or more internal support structures.

5. The apparatus of claim 1, further comprising a capacitor formed within the circuit board, the capacitor comprising:

a first layer of graphene;

a second layer of graphene; and

a layer of polycrystalline diamond located between the first and second layers of graphene.

6. The apparatus of claim 1, further comprising one or more cooling tubes formed within the circuit board, the cooling tubes configured to transmit a liquid through at least a portion of the circuit board.

7. The apparatus of claim 1, further comprising a plurality of heat sink fins formed on a surface of the circuit board, the plurality of heat sink fins made of polycrystalline diamond, the plurality of fins operable to conduct heat away from the circuit board.

8. The apparatus of claim 1, further comprising an electrical device connected to the tube at a termination of the tube.

9. The apparatus of claim 1, wherein at least one termination of the tube is open to an atmosphere.

10. The apparatus of claim 1, wherein the polycrystalline diamond comprises hexagonal polycrystalline diamond.